公开(公告)号：JP2008306029A

公开(公告)日：2008-12-18

申请号：JP2007152509

申请日：2007-06-08

Applicant: Smk Corp ,  Smk株式会社

Inventor： KASAGI NOBUO ,  HASHIMOTO KENICHI

IPC: H05K3/34

CPC classification number: B23K1/008 ,  B23K1/20 ,  B23K3/0646 ,  H05K1/095 ,  H05K3/3484 ,  H05K3/3494 ,  H05K2203/086 ,  H05K2203/111

Abstract: PROBLEM TO BE SOLVED: To provide a reflow soldering method that is effective for improvement of solder leakage in case where a conductive paint is used for a circuit pattern and a land pattern.
SOLUTION: In a step for conducting reflow soldering, a preliminary heating temperature is set at 150-190°C to activate a flux, and its preliminary heating time is set to a range of 60±30 seconds. In addition, the substrate is preliminary heated in a nitrogen atmosphere.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供一种在将导电涂料用于电路图案和焊盘图案的情况下有效地改善焊料泄漏的回流焊接方法。 解决方案：在进行回流焊接的步骤中，预热加热温度设定在150-190℃以激活焊剂，其预加热时间设定在60±30秒的范围内。 另外，将基板在氮气气氛中预备加热。 版权所有（C）2009，JPO＆INPIT