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公开(公告)号:JP5868711B2
公开(公告)日:2016-02-24
申请号:JP2012008342
申请日:2012-01-18
申请人: テルモ株式会社
CPC分类号: B29C66/861 , B29C65/203 , B29C65/2046 , B29C65/2076 , B29C65/30 , B29C65/7802 , B29C65/7841 , B29C66/002 , B29C66/1142 , B29C66/5221 , B29C66/71 , B29C66/73921 , B29C66/8167 , B29C66/857 , B29C66/8746 , B29C66/91313 , B29C66/91315 , B29K2027/06
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公开(公告)号:JP2013162965A
公开(公告)日:2013-08-22
申请号:JP2012028479
申请日:2012-02-13
申请人: Terumo Corp , テルモ株式会社
发明人: KOKUBU TOMOTAKA , TSUNEI MITSUAKI , YAMAMOTO KOHEI
CPC分类号: B29C65/7802 , B29C65/203 , B29C65/2046 , B29C65/2076 , B29C65/30 , B29C65/7841 , B29C66/002 , B29C66/1142 , B29C66/5221 , B29C66/71 , B29C66/73921 , B29C66/8167 , B29C66/857 , B29C66/861 , B29C66/8746 , B29C66/91313 , B29C66/91315 , B29K2027/06
摘要: PROBLEM TO BE SOLVED: To provide an aseptic connection apparatus which allows detection of a situation in which two tubes have been piled up and correctly clamped to fix, when the two tubes are cut by fusing and connected by pressuring.SOLUTION: An aseptic connection apparatus 1 includes a case 2, a tube detector 290, and a controller 100, wherein: the case 2 has an embedding groove 52C into which a first tube T1 and a second tube T2 are embedded to fix; the tube detector 290 detects that the first tube T1 and the second tube T2 have taken their correct postures to be embedded into the embedding groove; and the controller 100 accepts a signal HS from the tube detector 290 to report that the first tube T1 and the second tube T2 have taken their correct postures to be embedded.
摘要翻译: 要解决的问题:提供一种无菌连接装置,其可以检测两个管已被堆积并被正确夹紧固定的情况,当两个管通过压力切割和连接而切割时。解决方案:无菌连接装置 1包括壳体2,管检测器290和控制器100,其中:壳体2具有嵌入槽52C,第一管T1和第二管T2嵌入到嵌入槽52C中以固定; 管检测器290检测到第一管T1和第二管T2已经采取其正确的姿势以嵌入到嵌入槽中; 并且控制器100接受来自管检测器290的信号HS,以报告第一管T1和第二管T2已经采取其嵌入的正确姿势。
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公开(公告)号:JP2013146356A
公开(公告)日:2013-08-01
申请号:JP2012008342
申请日:2012-01-18
申请人: Terumo Corp , テルモ株式会社
发明人: KOKUBU TOMOTAKA , SAKAGAMI YUSUKE
CPC分类号: B29C66/861 , B29C65/203 , B29C65/2046 , B29C65/2076 , B29C65/30 , B29C65/7802 , B29C65/7841 , B29C66/002 , B29C66/1142 , B29C66/5221 , B29C66/71 , B29C66/73921 , B29C66/8167 , B29C66/857 , B29C66/8746 , B29C66/91313 , B29C66/91315 , B29K2027/06
摘要: PROBLEM TO BE SOLVED: To provide an aseptic joining device capable of smoothly performing aseptic joining work of tubes by allowing a user to check whether or not a heating plate member is present in a cassette disposed in a housing before joining work of tubes, and allowing the user to non-visually check that the cassette is stored in a predetermined accurate position in the housing and that the heating plate member is stored in a correct attitude in the cassette.SOLUTION: A presence/absence detecting sensor 101 for wafers (heating plate members) detects whether or not a wafer WF is stored in a wafer cassette WC that has been positioned at a predetermined position in a cassette storage unit 82. As long as an innermost wafer WF in the wafer cassette WC is stored in a correct attitude in the wafer cassette WC, the presence/absence detecting sensor 101 outputs a signal 202S representing that the wafer WF is present in the wafer cassette WC.
摘要翻译: 要解决的问题:提供一种能够通过允许用户在连接工作之前检查加热板构件是否存在于设置在壳体中的盒中的情况下能够平稳地执行管的无菌接合工作的无菌接合装置,并且允许 用户非视觉地检查盒被存储在壳体中预定的精确位置,并且加热板构件以正确的姿态存储在盒中。解决方案:用于晶片的存在/不存在检测传感器101(加热板 成员)检测晶片WF是否存储在已经位于盒存储单元82中的预定位置的晶片盒WC中。只要将晶片盒WC中的最内晶圆WF以正确的姿态存储在 晶片盒WC,存在/不存在检测传感器101输出表示晶片WF存在于晶片盒WC中的信号202S。
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公开(公告)号:JP4685269B2
公开(公告)日:2011-05-18
申请号:JP2001153135
申请日:2001-05-22
CPC分类号: B29C66/9672 , B29C65/342 , B29C65/3468 , B29C65/3476 , B29C66/1122 , B29C66/1142 , B29C66/5221 , B29C66/5229 , B29C66/71 , B29C66/8748 , B29C66/9121 , B29C66/91221 , B29C66/91313 , B29C66/91315 , B29C66/91317 , B29C66/91651 , B29C66/91653 , B29C66/91655 , B29K2023/06 , B29K2023/12 , B29K2023/18
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公开(公告)号:JP2013146458A
公开(公告)日:2013-08-01
申请号:JP2012010462
申请日:2012-01-20
申请人: Terumo Corp , テルモ株式会社
发明人: YAMAMOTO KOJI , IGUCHI HIROMI
CPC分类号: B29C66/861 , B29C65/203 , B29C65/2046 , B29C65/2076 , B29C65/30 , B29C65/7802 , B29C65/7841 , B29C66/002 , B29C66/1142 , B29C66/5221 , B29C66/71 , B29C66/73921 , B29C66/8167 , B29C66/857 , B29C66/8746 , B29C66/91313 , B29C66/91315 , B29K2027/06
摘要: PROBLEM TO BE SOLVED: To provide a sterile bonding apparatus capable of reliably and comprehensively instructing such as an operation procedure of bonding operation of a tube.SOLUTION: The sterile bonding apparatus 1 includes: a case 2; a lid part 3 arranged on an upper surface part 2F of the case 2 to holding a first tube T1 and a second tube T2 to fix them, and openable and closable with respect to the case 2; and a display part 8 disposed so that a position on the upper surface part 2F of the case 2 can be changed from a storage state to a displayable state, and displaying a display content in the displayable state when using the sterile bonding apparatus 1.
摘要翻译: 要解决的问题:提供能够可靠且全面地指示诸如管的接合操作的操作过程的无菌接合装置。解决方案:无菌接合装置1包括:壳体2; 设置在壳体2的上表面部分2F上以保持第一管T1和第二管T2以固定它们并且相对于壳体2可打开和关闭的盖部分3; 以及显示部8,其设置为使得壳体2的上表面部分2F上的位置可以从存储状态改变为可显示状态,并且在使用无菌粘合装置1时将显示内容显示在可显示状态。
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公开(公告)号:JP2013146355A
公开(公告)日:2013-08-01
申请号:JP2012008341
申请日:2012-01-18
申请人: Terumo Corp , テルモ株式会社
发明人: SAKAGAMI YUSUKE , YAMAMOTO KOJI
CPC分类号: B29C66/002 , B29C65/203 , B29C65/2046 , B29C65/2076 , B29C65/30 , B29C65/7802 , B29C65/7841 , B29C66/1142 , B29C66/5221 , B29C66/71 , B29C66/73921 , B29C66/8167 , B29C66/857 , B29C66/861 , B29C66/8746 , B29C66/91313 , B29C66/91315 , B29K2027/06
摘要: PROBLEM TO BE SOLVED: To provide a sterile connecting device, capable of checking whether or not there is a heating plate member in a cassette placed in a case and the number of remaining wafers without visually recognizing them before connecting work of the tubes, and capable of smoothly performing sterile connection work of the tubes.SOLUTION: A sterile connecting device 1 has: a wafer cassette storage unit 82 for removably storing a wafer cassette WC; a presence or absence detection sensor 101 for wafer WF, which detects whether or not the wafers WF are stored in the wafer cassette WC positioned in the wafer cassette storage unit 82; a remaining amount detection sensor 102 for wafer WF, which detects the number of remaining wafers WF stored in the wafer cassette WC; and a control unit 100 for recognizing whether or not the wafer WF remains in the wafer cassette WC and the number of remaining wafers according to a signal from the presence or absence detection sensor 101 and a signal from the remaining amount detection sensor 102.
摘要翻译: 要解决的问题:提供一种无菌连接装置,其能够检查在放置在壳体中的盒中是否存在加热板构件,并且在连接管的工作之前没有视觉识别剩余的晶片的数量,并且能够 顺利进行管的无菌连接工作。解决方案:无菌连接装置1具有:用于可移除地存储晶片盒WC的晶片盒存储单元82; 用于晶片WF的存在或不存在检测传感器101,其检测晶片WF是否存储在位于晶片盒存储单元82中的晶片盒WC中; 用于晶片WF的剩余量检测传感器102,其检测存储在晶片盒WC中的剩余晶片WF的数量; 以及用于根据来自有无检测传感器101的信号和来自剩余量检测传感器102的信号来识别晶片WF是否保留在晶片盒WC中的剩余晶片数量的控制单元100。
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7.
公开(公告)号:JP5224011B2
公开(公告)日:2013-07-03
申请号:JP2012542301
申请日:2012-04-12
申请人: 東洋紡株式会社
CPC分类号: B32B38/10 , B29C59/14 , B29C65/02 , B29C65/1406 , B29C65/1432 , B29C65/1496 , B29C65/76 , B29C66/028 , B29C66/1122 , B29C66/41 , B29C66/43 , B29C66/71 , B29C66/73111 , B29C66/73117 , B29C66/7315 , B29C66/73161 , B29C66/7352 , B29C66/7392 , B29C66/7394 , B29C66/7465 , B29C66/9121 , B29C66/91216 , B29C66/91311 , B29C66/91313 , B29C66/91315 , B29C66/9141 , B29C66/91445 , B29C66/919 , B29C66/953 , B29C2035/0827 , B29K2995/0072 , B32B7/06 , B32B27/08 , B32B27/16 , B32B27/281 , B32B27/34 , B32B38/0004 , B32B38/0008 , B32B2255/10 , B32B2255/26 , B32B2307/306 , B32B2307/71 , B32B2307/734 , B32B2307/748 , B32B2315/08 , B32B2379/08 , B32B2457/00 , C08G73/105 , C08G73/1067 , C08G73/1071 , C08G73/1085 , C08G73/22 , C08L79/08 , Y10T156/10 , Y10T428/24802 , Y10T428/24851 , Y10T428/31725 , B29K2079/08
摘要: The present invention addresses the problem of providing a laminate of a polyimide film, which will serve as a base for laminating a variety of devices, and a substrate, the laminate being one with which there is no peeling, even during the high-temperature processes used to produce devices, but the polyimide film can be easily peeled from the substrate after a device has been produced on the polyimide film. The method for producing a laminate of the invention is a method for producing a laminate formed from at least a substrate (1) and a polyimide film (6), whereby using a film obtained by plasma treatment of at least the surface facing the substrate as the polyimide film (6), coupling agent treatment is performed on at least one of the surfaces facing the substrate 1 and the polyimide film (6) to form a coupling treatment layer (2), deactivation treatment is performed on a portion of the coupling treatment layer (2) to form a pre-determined pattern, and then pressing and heating are performed with the substrate (1) and polyimide film (6) overlapping.
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公开(公告)号:JP4765205B2
公开(公告)日:2011-09-07
申请号:JP2001182550
申请日:2001-06-15
申请人: 株式会社ジェイ・エム・エス
发明人: 幸三 竹野
IPC分类号: B29C65/04
CPC分类号: B29C65/04 , B29C66/8242 , B29C66/83221 , B29C66/91315 , B29C66/91655 , B29C66/9192 , B29C66/91951 , B29C66/942 , B29C66/944 , B29C66/9492 , B29C66/961
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公开(公告)号:JP2008501589A
公开(公告)日:2008-01-24
申请号:JP2007526576
申请日:2005-06-07
发明人: デニス コンスタンティノヴィッチ コルツォフ , ブレントン ジョン ゼブディー , カール ジョン ソフィールド , マイケル アラン ジョン フィースト , ハワード ホワイト , テレンス マイケル ロビンス
CPC分类号: B29C65/04 , B29C65/18 , B29C65/30 , B29C65/72 , B29C65/7867 , B29C66/112 , B29C66/131 , B29C66/24244 , B29C66/53461 , B29C66/71 , B29C66/72341 , B29C66/73115 , B29C66/73771 , B29C66/73775 , B29C66/73921 , B29C66/80 , B29C66/8122 , B29C66/81263 , B29C66/81431 , B29C66/81457 , B29C66/8167 , B29C66/81821 , B29C66/81871 , B29C66/8322 , B29C66/8432 , B29C66/849 , B29C66/876 , B29C66/91313 , B29C66/91315 , B29C66/91651 , B29C66/91653 , B29C66/91655 , B29C66/929 , B29C66/949 , B29C66/961 , B65B51/22 , B29K2827/18 , B29K2883/00 , B29K2077/00 , B29K2067/003 , B29K2027/08 , B29K2027/06 , B29K2023/086 , B29K2023/06
摘要: 【課題】本発明は、ポリマー材料で構成されたトレーと、カバー・シートとを用いて製品を包装する方法を提供する。
【解決手段】肉や調理済み食品のような製品(12)は、カバー・シート(34)で覆われた、ポリマー材料のトレー(14)に包装される。 トレーは、シーリング層(表面結合層)を実装しない。 例えば、トレーは、表面結合層なしの結晶性ポリエチレン・テレフタル酸塩(CPET)であってもよい。 カバー・シートの(APETのような)ポリマーは、トレーの外周の回りに連続溶着を形成するように、電気的導電性材料の対向電極(18、24)間の誘電溶着によりトレーのCPETに結合される。 これは、トレーに対する結合層の必要性を回避し、かつトレーの表面の汚染にも関わらず信頼性がある溶接シールを得ることができる。
【選択図】図1-
公开(公告)号:JP5837426B2
公开(公告)日:2015-12-24
申请号:JP2012009191
申请日:2012-01-19
申请人: テルモ株式会社
CPC分类号: B29C66/8746 , B29C65/203 , B29C65/2046 , B29C65/2076 , B29C65/30 , B29C65/7802 , B29C65/7841 , B29C66/002 , B29C66/1142 , B29C66/5221 , B29C66/71 , B29C66/73921 , B29C66/8167 , B29C66/857 , B29C66/861 , B29C66/91313 , B29C66/91315 , B29K2027/06
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