摘要:
PURPOSE: A polymer is provided to improve chemical resistance by using a polymer of the shape of a hyper branch comprising an allyl group, and to prevent degradation of re-solubility by accepting an aryl-based reactive group. CONSTITUTION: A polymer comprises a unit originated from a monomer comprising an allyl group and an epoxy group, a unit originated from diol comprising acid components, and a unit originated from anhydride comprising acid components. The acid value of the polymer is 30-150 KOH mg/g and the weight average molecular weight is 3,000-50,000. The photoresist resin composition is a polymer, a polymerizable compound comprising ethylenically unsaturated bond, a photo-initiator, and solvent. The content of the polymer is 1-20 weight% based on total weight of the photoresist resin composition.
摘要:
PURPOSE: An alkali-developable resin polymer, a manufacturing method thereof, and photosensitive resin composition including thereof are provided to improve chemical resistance, sensitivity, straightness, and compatibility with other compounds. CONSTITUTION: An alkali-developable resin polymer is represented by chemical formula 1. Here, R1, R2, and R3 are independently hydrogen, C1-3 alkyl group, or C1-3 alkoxy group. X might has either direct bonding or is selected from C1-5 alkylene group, ethylene oxide group, and propylene oxide. Y is selected from C1-5 alkylene group, ethylene oxide group, and propylene oxide group. A is selected from phenyl group, benzyl oxy carbonyl group, methyloxycarbonyl group, ethyloxycarbonyl, isobutyl oxycarbonyl group, tert-butyl oxycarbonyl group, cyclohexyl oxycarbonyl group, and isobornyl oxycarbonyl group.
摘要:
PURPOSE: An alkali-soluble binder resin and a photosensitive resin composition containing thereof are provided to offer improved sensitivity of the resin to the composition by having an unsaturated double bond. CONSTITUTION: An alkali-soluble binder resin includes a recurring unit marked with chemical formula 1. In the chemical formula 1, R1 is hydrogen or a methyl group. R2 is selected from the group consisting of phenyl-substituted C1-6 alkylene, C1-8 alkyl, alkoxy-substituted C2-6 alkyl, halogen substituted C1-6 alkyl, C1-3 alkoxy polyalkylene(C2-3)glycol, C1-6 alkyl-substituted phenyl, C1-6 alkoxy-substituted phenyl, halogen substituted phenyl, and C1-6 alkoxymethyl.
摘要:
PURPOSE: An alkali soluble resin polymer and a negative type photo-sensitive resin composition are provided to maintain the chemical resistance characteristic, the sensitivity, and the pattern characteristic of the alkali soluble resin and to improve the dispersion stability and the protrusion characteristic of the composition. CONSTITUTION: An alkali soluble binder resin includes a monomer with an unsaturated double bond, a double bond monomer with carboxylic acid, and an unsaturated double bondable monomer. The molecular weight distribution of the resin is between 2.0 and 3.5. The unsaturated double bondable monomer is represented by chemical formula 1. In the chemical formula 1, the R is selected from a group including (meta)acrylrate, α-hydroxyl methyl metacrylate, α -chloroacrylate, monoallyl fumarate, monoallyl maleate, monoallyl benzoate, monoallyl phthalate.
摘要:
본 발명은 화학식 1의 구조를 가지는 감광성 수지와 이의 제조방법과 이를 포함하는 감광성 수지조성물 및 이에 의해 형성된 경화물에 대한 것이다. 본 발명에 의한 감광성 수지 및 그 감광성 수지조성물은 감도가 좋고, 내열성, 내화학성 및 보관 안정성이 뛰어나다. 폴리에스테르, 고감도, 내열성, 내화학성, 보관안정성
摘要:
PURPOSE: An alkali soluble resin polymer, a producing method thereof, and a negative photosensitive resin composition including thereof are provided to secure a proper molecular weight and acid value by reacting a compound including a fluorene group with an acrylic binder resin. CONSTITUTION: An alkali soluble binder resin polymer contains fluoren. The fluoren is obtained by reacting a fluoren compound by a reaction of a compound marked as chemical formula 1 with acrylic acid or methacrylic acid, with an alkali soluble binder resin. In the chemical formula 1, X refers to alkylene with the carbon number 1~3, ethylene oxide, and propylene oxide.
摘要:
PURPOSE: An alkali soluble resin is provided to ensure excellent heat resistance, chemical resistance, development, sensitivity, temporally stability due to a structure for improving heat resistance. CONSTITUTION: An alkali soluble resin has a structure represented by chemical formula 1. In chemical formula 1, R1~R4 are independently hydrogen or methyl group; X is a group derived from aromatic and aliphatic vinyl monomer; Y is a group derived from an ethylenically unsaturated compound containing an epoxy group; Z is a group derived from a compound containing an epoxy group; a is 5-30 mol%, b is 20-50 mol%, c is 10-30 mole %, and d is 5-20 mole %.
摘要:
An alkali soluble resin is provided to be usable in case of requiring hydrophobicity, to ensure few limits of addition amount of fluorine, hydrophobicity, photo-crosslinkage and development. An alkali soluble resin comprises units represented by chemical formula 1 - 3. In chemical formulas, X1 and X2 are selected from hydrogen, C1-3 alkyl group and alkoxy group; Y is selected from the group consisting of C1-3 alkylene, ethylene oxides and propylene oxide; Z is selected from C1-3 alkylene, cyclohexene, cyclohexane and a benzene group; A is at least one selected from a benzyloxycarbonyl group, benzyl group, isobornyl group, cyclohexyl group, and N-phenyl maleimide group; and B is selected from a fluoro group containing at least one fluorine element and a fluoroalkyl group.
摘要:
An alkali developable resin and a photosensitive composition comprising the same are provided to ensure excellent adhesive property while maintaining development, compatibility and coating performance. An alkali developable resin comprises repeating units represented by chemical formula 1-3. In chemical formulae 1-3, A is selected from a phenyl group, benzyl oxy carbonyl group, methyl oxy carbonyl group, ethyloxycarbonyl group, isobutyl oxycarbonyl group, t-butyloxycarbonyl group, cyclohexyl oxycarbonyl group and isobonyl oxycarbonyl group; X1 and X2 are selected from hydrogen, C1-3 alkyl group and alkoxy group; Y is selected from the group consisting of C1-3 alkylene, ethylene oxide and propylene oxide; Z is selected from C1-3 alkylene, cyclohexene, cyclohexane and benzene group; and R1 and R2 are hydrogen or hydroxy group.
摘要:
A cholate-based compound is provided to ensure excellent development when being applied to the photosensitive resin composition material, to improve the adhesive property with substrate by comprising a fluorene group and cholic acid derivative. A cholate-based compound has a structure represented by the chemical formula 1. In the chemical formula 1, X is selected from the group consisting of C1-3 alkylene group, or ethylene oxide and propylene oxide; R1 and R2 are the same or different, and are hydroxyl group or hydrogen. The polystyrene conversion average molecular weight of the collate-based compound is 800-2,000 g/mol.