公开(公告)号：KR1020050043746A

公开(公告)日：2005-05-11

申请号：KR1020047006786

申请日：2002-11-04

申请人： 벡톤 디킨슨 앤드 컴퍼니

发明人： 거렐누크크레그엔. ,  카스트로신시아에이. ,  하딩웨스톤에프. ,  존슨스티븐더블유. ,  파리스웨인엠. ,  구오랜태오 ,  라센마이클씨.

IPC分类号： A61M25/06

CPC分类号： A61M25/0009 ,  A61M25/0606 ,  A61M25/0668 ,  B29C45/0046 ,  B29C45/0081 ,  B29C45/261 ,  B29C45/36 ,  B29C45/40 ,  B29C2045/279

摘要： An enhanced catheter introducer (10) and method for making the same are disclosed. The catheter (10) introduced may have a splittable sleeve assembly (16) configured to be inserted into a blood vessel with a cannula (24). The cannula (24) may then be removed, and a catheter (12) may be inserted into the sleeve assembly (16). The sleeve assembly (16) may be removed from the catheter (12) by pulling handles (34, 36) of the sleeve assembly (16) in different directions to split the sleeve assembly (16) into two pieces. The sleeve assembly (16) may have failure zones (50, 52) that enable the sleeve assembly (16) to be easily split; the failure zones (50, 52) may take the form of thinned regions (50, 52) running along the length of the sleeve assembly (16). The sleeve assembly (16) may be injection molded with a single step by injecting flows of molten plastic into a cavity of a mold (110) such that the flows converge into an even distribution about the circumference of the sleeve (30). The mold (110) may have a core pin designed to fit into the cavity. Through the use of the even distribution of flows, the core pin (140) may seat within the cavity in an untensioned manner.

摘要翻译： 公开了一种增强导管导引器（10）及其制造方法。 引入的导管（10）可以具有可分开的套筒组件（16），其被配置成用插管（24）插入血管。 然后可以移除套管（24），并且可以将导管（12）插入套筒组件（16）中。 可以通过沿不同方向拉动套筒组件（16）的手柄（34,36）将套筒组件（16）分成两部分，从套管组件（16）中移除导管（12）。 套筒组件（16）可以具有能够使套筒组件（16）容易地分离的故障区域（50,52）; 故障区域（50,52）可以采取沿套筒组件（16）的长度延伸的变薄区域（50,52）的形式。 套筒组件（16）可以通过将熔融塑料流注入到模具（110）的空腔中，以单个步骤注射成型，使得流体围绕套筒（30）的圆周收敛成均匀分布。 模具（110）可以具有设计成适合于空腔的芯销。 通过使用均匀的流动分布，芯销（140）可以以未张紧的方式位于空腔内。

公开(公告)号：KR1020050022849A

公开(公告)日：2005-03-08

申请号：KR1020030080448

申请日：2003-11-14

申请人： 가부시키가이샤 사카이야

发明人： 나카무라히로유키 ,  시바타마사오

IPC分类号： B29C45/00

CPC分类号： B29C45/1418 ,  B29C45/14811 ,  B29C45/2708 ,  B29C45/40 ,  B29C2045/14868 ,  B29K2105/256

摘要： PURPOSE: A shape-formed article of synthetic resin sheet and a method for producing the same are provided to allow the precision or sharp sensation of the corresponding board or panel, to form a thin shaped articles, to use the hot-stamped sheet metal, and to simplify the attachment onto a printed surface. CONSTITUTION: A melt resin(4) is injection-molded into an air space(3) which is formed between a synthetic resin sheet(2) and a gate(13) inside an injection mold(1) and then the synthetic resin sheet(2) is expanded. After that, the synthetic resin sheet(2) comes to have a local shape, formed according to a concave internal shape which is arranged in a determined local position of the injection mold(1). Besides, the synthetic resin sheet(2) has a thickness of 0.2 to 0.8mm.

摘要翻译： 目的：合成树脂片的形状制品及其制造方法被设置成允许对应的板或面板的精确或尖锐的感觉形成薄的制品，以使用热冲压的金属片， 并且简化了附着到印刷表面上。 构成：将熔融树脂（4）注塑成空气（3），其形成在注射模具（1）内的合成树脂片（2）和浇口（13）之间，然后合成树脂片 2）被扩展。 之后，合成树脂片（2）具有根据设置在注射模具（1）的确定的局部位置的凹形内部形成的局部形状。 此外，合成树脂片（2）的厚度为0.2〜0.8mm。

公开(公告)号：KR1020040106876A

公开(公告)日：2004-12-18

申请号：KR1020030037795

申请日：2003-06-12

申请人： 노태균

发明人： 노태균

IPC分类号： B29D11/00

CPC分类号： B29D11/00432 ,  B29C45/40 ,  B29D11/0048

摘要： PURPOSE: Provided are method and apparatus for manufacturing eyeglass lenses by cutting a spool formed at a resin lens made by injection molding, the cut spool being recycled as injection material. CONSTITUTION: After a lens drawing process, a lens is seated on a lens seating member, and the lens is secured with a sucking pad by operating a spool removing member. A spool is cut from the lens using an cutting blade of a cutter. The resin lens with the spool removed is secured to the sucking pad, and is stacked on a stacking member of the lens stacking device. The cut spool is pulverized by crusher. If particles of the pulverized spool is filled in the crusher by a certain volume, the particles of the spool is transferred by a fan to raw material of resin lens.

摘要翻译： 目的：提供通过切割由注射成型制成的树脂透镜上形成的卷轴来制造眼镜镜片的方法和装置，切断的卷轴作为注射材料再循环。 构成：在透镜拉伸处理之后，透镜位于透镜座部件上，并且通过操作卷轴去除构件通过吸盘固定透镜。 使用切割器的切割刀片从透镜切割线轴。 去除了卷轴的树脂透镜被固定到吸盘，并且堆叠在透镜堆叠装置的堆叠构件上。 切断的卷轴由破碎机粉碎。 如果粉碎的卷轴的颗粒以一定体积填充在破碎机中，则将卷轴的颗粒通过风扇转移到树脂透镜的原料。

公开(公告)号：KR1020030034370A

公开(公告)日：2003-05-09

申请号：KR1020010065283

申请日：2001-10-23

申请人： 재영솔루텍 주식회사

发明人： 김학권

IPC分类号： B29C45/14

CPC分类号： B29C45/14065 ,  B29C45/18 ,  B29C45/40

摘要： PURPOSE: A method and device for manufacturing an injection material having an insert member is provided to improve the quality and productivity of a product by using a mold into which the insert member is inserted and automatically performing a series of processes. CONSTITUTION: A method for manufacturing an injection material having an insert member comprises the steps of: automatically arranging and inserting the insert member into a heating pin(P1); separating and feeding the insert member inserted into the heating pin(P2); inserting the insert member into a mold(P3); injecting resin liquid into the mold and molding a product(P4); and separating the injection product(P5).

摘要翻译： 目的：提供一种用于制造具有插入构件的注射材料的方法和装置，以通过使用插入件插入其中的模具自动执行一系列处理来提高产品的质量和生产率。 构成：一种制造具有插入构件的注射材料的方法，包括以下步骤：将插入构件自动布置并插入加热销（P1）中; 分离和进给插入加热销（P2）中的插入件; 将插入构件插入模具（P3）中; 将树脂液注入模具中并成型产品（P4）; 并分离注射产品（P5）。

公开(公告)号：KR1020020027291A

公开(公告)日：2002-04-13

申请号：KR1020010061662

申请日：2001-10-06

申请人： 르네사스 일렉트로닉스 가부시키가이샤

发明人： 미네데쯔이찌

IPC分类号： B29C45/14

CPC分类号： B29C45/40 ,  B29C45/14655

摘要： PURPOSE: A resin encapsulation mold is provided to encapsulate a semiconductor device in resin without having any air bubbles develop in the vicinity of ejection pins. CONSTITUTION: A resin encapsulation mold comprises: a lower mold(1), which is mounted on a lead frame, includes an indentation(3,4) into which a semiconductor device is placed, and forms a gate(5) through which resin is injected; an upper mold(2), in which an indentation is formed opposite the indentation of the lower mold to configure a cavity for holding the semiconductor device; a plurality of ejection pins(7a,7b,7e,7f), which protrude from the respective bottoms of the indentation of the upper mold and the indentation of the lower mold into a resin package body formed by injecting the resin from the gate into the cavity, and eject the resin package body; a vertical drive mechanism(8), which brings into contact and separates the upper mold and the lower mold; and protrusion adjustment means for adjusting the amount of protrusion of the respective ends of the plurality of ejection pins protruding from the respective bottoms of the indentations of the lower mold and the upper mold comprising the cavity while resin is injected into the cavity; wherein the amount of protrusion of the plurality of the ejection pins ranges between 0 and 60 μm.

摘要翻译： 目的：提供树脂封装模具以将半导体器件封装在树脂中，而不会在喷射销附近形成任何气泡。 构成：树脂封装模具包括：安装在引线框架上的下模具（1），包括其中放置半导体器件的凹口（3,4），并形成浇口（5），树脂通过该浇口 注射; 上模具（2），其中形成与所述下模具的凹部相对的凹陷，以构造用于保持所述半导体器件的空腔; 从上模的凹部的各个底部突出的多个排出销（7a，7b，7e，7f）和下模的凹部成为通过将树脂从浇口注入到树脂封装主体而形成的树脂封装主体 空腔，并弹出树脂包装体; 垂直驱动机构（8），其接触并分离上模具和下模具; 以及突起调节装置，用于调节在将树脂注入到空腔中时，从下模具的凹陷的各个底部突出的多个喷射销的各个端部和包括空腔的上模具的突出量; 其中所述多个喷射销的突出量在0和60μm之间。

公开(公告)号：KR1020010047499A

公开(公告)日：2001-06-15

申请号：KR1019990051750

申请日：1999-11-20

申请人： 에이테크솔루션(주)

发明人： 유병현

IPC分类号： B29C45/26

CPC分类号： B29C45/2606 ,  B29C45/1761 ,  B29C45/40

摘要： PURPOSE: A mold is provided to prevent bad products by maintaining position of a movable die to a fixed die until a mold product hardened in a cavity is separated, to reduce the number of components, increase durability and to minimize transformation of the products by maintaining balance of a plush plate. CONSTITUTION: A mold includes a fixed die(11) and a movable die(3) forming a prescribed cavity, a plush plate(19) for separating mold products hardened in the cavity, a guide member(15) and a position maintaining part. The guiding member guides movement of the movable die to the fixed die. The position maintaining part maintains position movement of the movable die to the fixed die by stages until the mold product in the cavity is separated by the plush plate.

摘要翻译： 目的：提供模具以通过将可移动模具的位置保持在固定模具上来防止不良产品，直到在空腔中硬化的模具产品被分离，以减少部件数量，增加耐用性并且通过维持使产品的转化最小化 平衡的毛绒板。 构成：模具包括固定模具（11）和形成规定空腔的活动模具（3），用于分离在空腔中硬化的模具产品的毛绒板（19），引导构件（15）和位置保持部件。 引导构件引导可动模具的移动到固定模具。 位置保持部分保持可动模具的位置移动到固定模具的阶段，直到空腔中的模具产品被毛绒板分开。

公开(公告)号：KR1020010037252A

公开(公告)日：2001-05-07

申请号：KR1019990044657

申请日：1999-10-15

申请人： 앰코 테크놀로지 코리아 주식회사

发明人： 이형주 ,  홍구선 ,  구재훈

IPC分类号： H01L23/58 ,  H01L21/56

CPC分类号： B29C45/14655 ,  B29C45/2701 ,  B29C45/40 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： PURPOSE: A mold for manufacturing a semiconductor package is provided to separate easily a lead frame from an upper mold after performing a sealing process. CONSTITUTION: A mold for manufacturing a semiconductor package comprises a lower mold and an upper mold(20). The lower mold has a loading portion for loading a lead frame on an upper face. The upper mold is formed with a transport(22), a runner(24), a multitude of gate(26), and a cavity(28). The transport(22) penetrates an upper and a lower portion of the upper mold(20). The runner(24) is formed at a bottom face of the upper mold(20). The gates(26) are connected with the runner(24). The cavity(28) is formed at each gate(26).

摘要翻译： 目的：提供一种用于制造半导体封装的模具，用于在执行密封处理之后容易地将引线框架与上模具分开。 构成：用于制造半导体封装的模具包括下模具和上模具（20）。 下模具有用于将引线框架装载在上表面上的装载部分。 上模具形成有输送器（22），流道（24），多个闸门（26）和空腔（28）。 输送器（22）穿透上模具（20）的上部和下部。 流道（24）形成在上模具（20）的底面。 浇口（26）与浇道（24）连接。 空腔（28）形成在每个门（26）处。

公开(公告)号：KR1019990068834A

公开(公告)日：1999-09-06

申请号：KR1019990024673

申请日：1999-06-28

申请人： 세일정기 (주)

发明人： 이병주

IPC分类号： B29C45/00

CPC分类号： B29C45/14336 ,  B29C45/27 ,  B29C45/40 ,  B29C45/46 ,  B29L2031/3468

摘要： 본발명은전해제련용극판을사출하기위한듀얼사출기및 사출방법에관한것으로, 이러한사출기는베이스프레임의상면에서수직하게설치되는세로형실린더부재, 이실린더부재의하단에설치되어상하이동되는상부몰드부재, 이상부몰드부재와대응되도록설계되어, 상기베이스프레임의상면에서수평이동되는하부몰드부재, 상기상하부몰드부재사이에개재되어특정부위에서만사출물이성형되는극판을포함한다. 또한, 상기사출기는사출공정이완료된후 상기판재와상기하부몰드부재를외측으로이송시키는이송실린더, 및이 이송실린더에의해이송된상기하부몰드부재의상면에배치된상기판재를외부로배출시키는배출실린더를구비한다. 이와같은구성에따라, 대형극판의상부및 가장자리에한번의사출공정으로수지재를기밀성이있게부착시키고성형된극판을자동적으로외부로배출시킴으로써작업성이향상되고극판의내구성이증대된다.

公开(公告)号：KR100176111B1

公开(公告)日：1999-03-20

申请号：KR1019950040241

申请日：1995-11-08

申请人： 삼성전자주식회사

发明人： 노희선 ,  최희국 ,  조인식 ,  김태형

IPC分类号： H01L23/28

CPC分类号： H01L21/565 ,  B29C45/14655 ,  B29C45/40 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/00

摘要： The apparatus manufactures a protective encapsulation for semiconductor chip (10) and includes upper and lower mould halves (100,102). Moulding tools form, when closed a mould space from injection of moulding compound and receive the semiconductor chip arranged on the chip frame. Upper and lower plate arrangement (80) open and close the moulding tools. The plate arrangement has with two ejection pins (4,9,8) for ejecting the mould part (104) forming the protection encapsulation immediately following its formation. A central ejection pin (13) is provided on the lower plate arrangement (80b) and likewise extends into the moulding space (6).

公开(公告)号：KR100136374B1

公开(公告)日：1998-04-25

申请号：KR1019890014140

申请日：1989-09-30

申请人： 스미도모쥬기가이고교 가부시키가이샤

发明人： 기다무라다께히꼬 ,  아마노히로사또 ,  가이다마사하루

IPC分类号： B29C45/10

CPC分类号： B29C45/263 ,  B29C45/40 ,  B29C2045/2648 ,  B29C2045/2657 ,  G11B7/26 ,  Y10S425/81

摘要： 요약없음