公开(公告)号：KR1020080077094A

公开(公告)日：2008-08-21

申请号：KR1020087009808

申请日：2006-11-13

申请人： 덴카 주식회사

发明人： 히로츠루히데키 ,  이와모토고 ,  츠카모토히데오 ,  미야이아키라 ,  사사키요시오

IPC分类号： C22C29/06

CPC分类号： H01L23/13 ,  C04B35/565 ,  C04B35/71 ,  C04B41/009 ,  C04B41/5155 ,  C04B41/88 ,  C04B2111/00844 ,  C04B2235/3217 ,  C04B2235/3418 ,  C04B2235/402 ,  C04B2235/5436 ,  C04B2235/5472 ,  C04B2235/77 ,  C04B2235/9607 ,  C22C1/0475 ,  C22C1/051 ,  C22C29/065 ,  H01L23/15 ,  H01L23/3731 ,  H01L23/3733 ,  H01L23/3735 ,  H01L2924/0002 ,  Y10T428/12361 ,  Y10T428/12389 ,  Y10T428/12479 ,  Y10T428/12736 ,  Y10T428/12993 ,  Y10T428/2495 ,  Y10T428/24975 ,  Y10T428/249957 ,  Y10T428/249969 ,  Y10T428/249974 ,  C04B41/4521 ,  C04B41/4523 ,  C04B38/00 ,  H01L2924/00

摘要： An aluminum/silicon carbide composite that is suitable as a base board for power module. There is provided a base board for power module of aluminum/silicon carbide composite, characterized in that the aluminum/silicon carbide composite is one consisting of a flat-plate silicon carbide porous body impregnated with a metal composed mainly of aluminum, and that only its one major surface has an aluminum layer consisting of a metal composed mainly of aluminum while as another major surface, its backside has exposure of the aluminum/silicon carbide composite, and that the configuration thereof is rectangular or one consisting of a rectangle having, added thereto, a zone surrounding outer circumferential hole portions. Accordingly, plating capability is imparted by disposing the aluminum layer on one major surface; the degree of planarity is enhanced by polishing of the backside so as to realize exposure of the aluminum/silicon carbide composite; and the warpage configuration after polishing of the backside is controlled by regulating the thickness of the aluminum layer.

摘要翻译： 适用于电源模块基板的铝/碳化硅复合材料。 提供了一种用于铝/碳化硅复合材料的功率模块的基板，其特征在于铝/碳化硅复合材料是由主要由铝组成的金属浸渍的平板碳化硅多孔体组成的， 一个主表面具有由主要由铝组成的金属组成的铝层，而作为另一个主表面，其背面具有铝/碳化硅复合材料的曝光，并且其构造为矩形或由其中添加的矩形构成 围绕外周孔部的区域。 因此，通过将铝层设置在一个主表面上来赋予电镀能力; 通过抛光背面来增强平面度，以实现铝/碳化硅复合材料的曝光; 并且通过调节铝层的厚度来控制背面的抛光后的翘曲构造。