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公开(公告)号：KR1020020073328A
公开(公告)日：2002-09-23
申请号：KR1020027000927
申请日：1999-07-23
申请人： 엠큐브드 테크놀로지스, 인크.
发明人： 웨그고너더블유마이클 , 로씽배리알 , 리치몬드마이클에이 , 애거재니언마이클에이 , 맥코믹앨린엘
IPC分类号： C04B35/573
CPC分类号： C04B35/636 , C04B35/565 , C04B35/573 , C04B35/62635 , C04B35/6267 , C04B35/64 , C04B37/005 , C04B41/009 , C04B41/5155 , C04B41/88 , C04B2235/3826 , C04B2235/402 , C04B2235/422 , C04B2235/425 , C04B2235/428 , C04B2235/5436 , C04B2235/5472 , C04B2235/6027 , C04B2235/606 , C04B2235/608 , C04B2235/612 , C04B2235/616 , C04B2235/656 , C04B2235/6562 , C04B2235/6565 , C04B2235/6567 , C04B2235/6581 , C04B2235/77 , C04B2235/80 , C04B2235/94 , C04B2235/945 , C04B2235/95 , C04B2235/96 , C04B2235/9607 , C04B2237/083 , C04B2237/365 , C04B2237/76 , C04B2237/82 , C22C1/1068 , C22C29/065 , C22C32/0063 , C04B38/00 , C04B41/4515 , C04B41/4523 , C04B41/4556 , C04B41/5096
摘要： 본발명의용침프로세스에따라제조된개량형탄화규소복합체는임의의잔류규소상외에금속상을갖는것을특징으로한다. 기계적인성과같은성질이개선될뿐만아니라, 응고시팽창되는양을감소시키도록용침재를도모할수 있어, 최종형태에가깝게제조할수 있는능력이개선된다. 또한, 다성분용침재는액상선의온도가순수규소보다낮아, 실시자가용침프로세스를보다잘 제어할수 있게해준다. 특히, 용침은보다낮은온도에서수행될수도있는데, 용침재가일단침투성질량체를통해그 질량체와베드재료사이의경계까지이동하였다면, 저비용의효과적인베드또는배리어재료는상기용침프로세스를종료시킬수 있다.
摘要翻译： 通过渗透方法制备的改进的碳化硅复合材料除了任何残留的硅相之外还具有金属相。 不仅可以提高机械韧性等性能，而且可以将渗透剂设计成在凝固时具有大大减少的膨胀量，从而提高网状制造能力。 此外，多成分渗透材料可能具有比纯硅更低的液相线温度，从而为从业者提供对渗透过程的更大控制。 特别地，渗透可以在较低温度下进行，其中低成本但有效的床垫或阻挡材料可以在渗透剂已经通过可渗透物质迁移到物质和床上用品之间的边界时终止渗透过程。
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公开(公告)号：KR1020080099632A
公开(公告)日：2008-11-13
申请号：KR1020070045428
申请日：2007-05-10
申请人： 한국세라믹기술원
CPC分类号： C08G77/02 , C01B32/956 , C08G77/60 , C22C29/065 , D01F8/18
摘要： A porous polycarbosilane tube and a method for manufacturing the same is provided to control the thickness of tube wall freely due to high specific surface area of the wall and the developed pore structure and to ensure excellent high strength, heat resistance, corrosion resistance and environmental proofing property. A method for manufacturing polycarbosilane tube comprises a step for extruding polycarbosilane in a fibrous type; a step for heat-treating it in the oxidizing atmosphere and hardening from the surface of polycarbosilane to form a uncured part on the fibrous polycarbosilane central part; and a step for forming hollow by dissolving the uncured central part of the fibrous polycarbosilane with a polar solvent.
摘要翻译： 提供多孔聚碳硅烷管及其制造方法，由于壁的高比表面积和显影孔结构自由地控制管壁的厚度，并且确保优异的高强度，耐热性，耐腐蚀性和环境保护性 属性。 聚碳硅烷管的制造方法包括将纤维状聚碳硅烷挤出的工序; 在氧化气氛中进行热处理，从聚碳硅烷表面硬化，在纤维状聚碳硅烷中心部形成未固化部的工序; 以及通过用极性溶剂溶解纤维状聚碳硅烷的未固化的中心部分来形成中空的步骤。
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公开(公告)号：KR1020090008177A
公开(公告)日：2009-01-21
申请号：KR1020087017539
申请日：2007-05-08
申请人： 덴카 주식회사
IPC分类号： C04B35/565 , B22D19/00 , B24C1/00 , H01L23/15
CPC分类号： C04B41/88 , B22D19/14 , B24C1/045 , B26F3/004 , C04B35/565 , C04B35/6316 , C04B41/009 , C04B41/5155 , C04B2111/00844 , C04B2235/3418 , C04B2235/3826 , C04B2235/5436 , C04B2235/5481 , C04B2235/6583 , C22C29/065 , H01L21/4878 , H01L23/147 , H01L23/3733 , H01L23/3735 , H01L23/4922 , H01L2924/0002 , Y10T428/24999 , C04B41/4521 , C04B41/4523 , C04B41/4572 , C04B41/5096 , C04B41/515 , C04B41/53 , C04B38/00 , H01L2924/00
摘要： Disclosed is an aluminum-silicon carbide composite body suitable as a base plate for power modules. Specifically disclosed is an aluminum-silicon carbide composite body obtained by impregnating a plate-like silicon carbide porous body with a metal mainly containing aluminum. This aluminum-silicon carbide composite body is characterized by having an aluminum layer composed of the metal mainly containing aluminum on both major surfaces and not having such an aluminum layer on lateral surfaces. The aluminum-silicon carbide composite body is further characterized in that the lateral surfaces and pore portions are subjected to water jet processing.
摘要翻译： 公开了一种适用于功率模块的基板的铝 - 碳化硅复合体。 具体公开了一种通过用主要含有铝的金属浸渍板状碳化硅多孔体而获得的铝 - 碳化硅复合体。 该铝 - 碳化硅复合体的特征在于，在两个主面上具有由主要含有铝的金属构成的铝层，在侧面不具有这样的铝层。 铝 - 碳化硅复合体的特征还在于侧面和孔部分进行喷水处理。
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公开(公告)号：KR1020080077094A
公开(公告)日：2008-08-21
申请号：KR1020087009808
申请日：2006-11-13
申请人： 덴카 주식회사
IPC分类号： C22C29/06
CPC分类号： H01L23/13 , C04B35/565 , C04B35/71 , C04B41/009 , C04B41/5155 , C04B41/88 , C04B2111/00844 , C04B2235/3217 , C04B2235/3418 , C04B2235/402 , C04B2235/5436 , C04B2235/5472 , C04B2235/77 , C04B2235/9607 , C22C1/0475 , C22C1/051 , C22C29/065 , H01L23/15 , H01L23/3731 , H01L23/3733 , H01L23/3735 , H01L2924/0002 , Y10T428/12361 , Y10T428/12389 , Y10T428/12479 , Y10T428/12736 , Y10T428/12993 , Y10T428/2495 , Y10T428/24975 , Y10T428/249957 , Y10T428/249969 , Y10T428/249974 , C04B41/4521 , C04B41/4523 , C04B38/00 , H01L2924/00
摘要： An aluminum/silicon carbide composite that is suitable as a base board for power module. There is provided a base board for power module of aluminum/silicon carbide composite, characterized in that the aluminum/silicon carbide composite is one consisting of a flat-plate silicon carbide porous body impregnated with a metal composed mainly of aluminum, and that only its one major surface has an aluminum layer consisting of a metal composed mainly of aluminum while as another major surface, its backside has exposure of the aluminum/silicon carbide composite, and that the configuration thereof is rectangular or one consisting of a rectangle having, added thereto, a zone surrounding outer circumferential hole portions. Accordingly, plating capability is imparted by disposing the aluminum layer on one major surface; the degree of planarity is enhanced by polishing of the backside so as to realize exposure of the aluminum/silicon carbide composite; and the warpage configuration after polishing of the backside is controlled by regulating the thickness of the aluminum layer.
摘要翻译： 适用于电源模块基板的铝/碳化硅复合材料。 提供了一种用于铝/碳化硅复合材料的功率模块的基板，其特征在于铝/碳化硅复合材料是由主要由铝组成的金属浸渍的平板碳化硅多孔体组成的， 一个主表面具有由主要由铝组成的金属组成的铝层，而作为另一个主表面，其背面具有铝/碳化硅复合材料的曝光，并且其构造为矩形或由其中添加的矩形构成 围绕外周孔部的区域。 因此，通过将铝层设置在一个主表面上来赋予电镀能力; 通过抛光背面来增强平面度，以实现铝/碳化硅复合材料的曝光; 并且通过调节铝层的厚度来控制背面的抛光后的翘曲构造。
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公开(公告)号：KR1020120082865A
公开(公告)日：2012-07-24
申请号：KR1020127004793
申请日：2010-07-29
申请人： 덴카 주식회사
CPC分类号： C04B35/565 , B22F2998/10 , C04B35/52 , C04B41/009 , C04B41/52 , C04B41/90 , C04B2235/3826 , C04B2235/427 , C04B2235/5427 , C04B2235/5436 , C04B2235/5472 , C22C1/1036 , C22C1/1094 , C22C26/00 , C22C29/065 , C22C29/16 , H01L33/0079 , H01L33/60 , H01L33/641 , H01L2924/0002 , Y10T428/23 , C04B38/00 , C04B35/581 , C04B35/584 , C04B35/185 , C04B41/4523 , C04B41/5155 , C04B41/4572 , C04B41/5031 , C04B41/4529 , C04B41/4574 , C04B41/5111 , C04B41/5144 , C04B41/522 , C04B41/4564 , C04B41/5116 , B22F3/04 , C23C16/00 , C25D7/12 , H01L2924/00
摘要： LED와의 선열팽창계수 차이가 작고, 게다가 열전도성이 뛰어난 LED 탑재용 웨이퍼와, 이 LED 탑재용 웨이퍼의 제조 방법과, 이 LED 탑재용 웨이퍼를 이용해 제조된 LED 탑재 구조체를 제공한다. LED 탑재용 웨이퍼 (6)는 금속 함침 세라믹스 복합체 (61)와, 그 주위에 형성된 보호층 (62)으로 이루어지며, 금속 함침 세라믹스 복합체 (61)는 표면에 금속의 박층 (63)을 가지고 있는 것이 바람직하다. 웨이퍼의 제조 방법은 금속제 또는 세라믹스제의 관상체의 내부에, 세라믹스 다공체, 세라믹스 분말 성형체 및 세라믹스 분말로부터 선택된 적어도 한쪽을 충전한 후, 이들 세라믹스 다공체, 세라믹스 분말 성형체 및 세라믹스 분말로부터 선택된 적어도 한쪽을 가지는 공극부에 금속을 함침시킨 후, 가공하는 것을 특징으로 한다.
摘要翻译： 提供了一种用于LED安装的晶片，其具有与LED相当的热膨胀系数差并且具有优异的导热性，用于制造用于LED安装的晶片的方法，以及通过使用用于LED安装的晶片制造的LED安装结构。 用于LED安装（6）的晶片由金属渗透陶瓷复合材料（61）和形成在其周围的保护层（62）构成。 金属渗透性陶瓷复合体（61）的表面优选具有薄的金属层（63）。 制造晶片的方法的特征在于，将从由多孔陶瓷体，陶瓷粉末压块和陶瓷粉末组成的组中选出的至少一种填充到由金属或陶瓷制成的管状体中，然后将金属浸渍到至少 选自由多孔陶瓷体，陶瓷粉末压块和陶瓷粉末组成的组，然后进行处理。
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公开(公告)号：KR1020090004864A
公开(公告)日：2009-01-12
申请号：KR1020087020448
申请日：2007-04-23
申请人： 덴카 주식회사
IPC分类号： H01L23/373
CPC分类号： H01L23/3733 , C04B41/009 , C04B41/5155 , C04B41/52 , C04B41/88 , C04B41/90 , C04B2111/00844 , C22C1/1036 , C22C29/065 , C22C32/0063 , C22C2001/1073 , H01L23/13 , H01L23/15 , H01L23/3731 , H01L23/3735 , H01L2924/0002 , Y10T428/12479 , Y10T428/24496 , Y10T428/24999 , C04B41/4521 , C04B41/4523 , C04B41/5096 , C04B41/515 , C04B14/4631 , C04B41/4541 , C04B41/5144 , C04B35/565 , C04B38/00 , H01L2924/00
摘要： An aluminum/silicon carbide composite suitable for use as a base plate for power modules. The base plate for power modules comprises an aluminum/silicon carbide composite obtained by producing, through molding or processing, a porous silicon carbide object of a flat shape having an in-plane thickness difference of 100 mum or smaller, sandwiching the porous object between release plates at a plane-direction clamping torque of 1-20 Nm to thereby form a multilayer structure, and infiltrating a metal comprising aluminum as the main component thereinto. It is characterized in that it has on each main side thereof an aluminum layer made of a metal comprising aluminum as the main component, the aluminum layers have an average thickness of 10-150 mum, the difference between the maximum value and minimum value of the in-plane thickness of each aluminum layer is 80 mum or smaller, and the difference in average aluminum layer thickness between the two main sides is 50 mum or smaller. It is further characterized in that the shape of the porous silicon carbide object is rectangular or a shape which further includes rectangular peripheral areas surrounding hole parts.
摘要翻译： 铝/碳化硅复合材料适用于电源模块的基板。 用于功率模块的基板包括铝/碳化硅复合体，其通过模制或加工制造平面形状的多孔碳化硅物体，其面内厚度差为100μm以下，将多孔物体夹在释放之间 板以1〜20Nm的平面方向夹紧扭矩形成多层结构，并浸渍以铝为主要成分的金属。 其特征在于，在其主要侧面上具有由以铝为主要成分的金属制成的铝层，铝层的平均厚度为10-150μm，最大值与最小值之间的差为 每个铝层的面内厚度为80μm以下，两个主面之间的平均铝层厚度差为50μm以下。 其特征还在于，多孔碳化硅物体的形状为矩形或还包括围绕孔部的矩形周边区域的形状。
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公开(公告)号：KR1020070103360A
公开(公告)日：2007-10-23
申请号：KR1020077008073
申请日：2005-09-09
申请人： 엘리먼트 씩스 리미티드
CPC分类号： B22F3/105 , B22F2005/001 , B22F2998/00 , B22F2998/10 , C22C2026/006 , C22C26/00 , C22C29/065 , C22C29/06 , B22F1/0096
摘要： A method of producing a high-density abrasive compact material includes the steps of providing an electrically conductive mixture of a bonding powder material and abrasive particles or grit; compressing the electrically conductive mixture; and subjecting the compressed electrically conductive mixture to one or more high current pulses to form the abrasive compact is provided.
摘要翻译： 一种生产高密度研磨成型体材料的方法包括以下步骤：提供粘合粉末材料和磨料颗粒或砂砾的导电混合物; 压缩导电混合物; 并且提供压缩的导电混合物到一个或多个高电流脉冲以形成研磨体。
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公开(公告)号：KR101685231B1
公开(公告)日：2016-12-09
申请号：KR1020127004793
申请日：2010-07-29
申请人： 덴카 주식회사
CPC分类号： C04B35/565 , B22F2998/10 , C04B35/52 , C04B41/009 , C04B41/52 , C04B41/90 , C04B2235/3826 , C04B2235/427 , C04B2235/5427 , C04B2235/5436 , C04B2235/5472 , C22C1/1036 , C22C1/1094 , C22C26/00 , C22C29/065 , C22C29/16 , H01L33/0079 , H01L33/60 , H01L33/641 , H01L2924/0002 , Y10T428/23 , C04B38/00 , C04B35/581 , C04B35/584 , C04B35/185 , C04B41/4523 , C04B41/5155 , C04B41/4572 , C04B41/5031 , C04B41/4529 , C04B41/4574 , C04B41/5111 , C04B41/5144 , C04B41/522 , C04B41/4564 , C04B41/5116 , B22F3/04 , C23C16/00 , C25D7/12 , H01L2924/00
摘要： LED와의선열팽창계수차이가작고, 게다가열전도성이뛰어난 LED 탑재용웨이퍼와, 이 LED 탑재용웨이퍼의제조방법과, 이 LED 탑재용웨이퍼를이용해제조된 LED 탑재구조체를제공한다. LED 탑재용웨이퍼 (6)는금속함침세라믹스복합체 (61)와, 그주위에형성된보호층 (62)으로이루어지며, 금속함침세라믹스복합체 (61)는표면에금속의박층 (63)을가지고있는것이바람직하다. 웨이퍼의제조방법은금속제또는세라믹스제의관상체의내부에, 세라믹스다공체, 세라믹스분말성형체및 세라믹스분말로부터선택된적어도한쪽을충전한후, 이들세라믹스다공체, 세라믹스분말성형체및 세라믹스분말로부터선택된적어도한쪽을가지는공극부에금속을함침시킨후, 가공하는것을특징으로한다.
摘要翻译： 提供了一种用于LED安装的晶片，其具有与LED相当的热膨胀系数差并且具有优异的导热性，用于制造用于LED安装的晶片的方法，以及通过使用用于LED安装的晶片制造的LED安装结构。 用于LED安装（6）的晶片由金属渗透陶瓷复合材料（61）和形成在其周围的保护层（62）构成。 金属渗透性陶瓷复合体（61）的表面优选具有薄的金属层（63）。 制造晶片的方法的特征在于，将从由多孔陶瓷体，陶瓷粉末压块和陶瓷粉末组成的组中选出的至少一种填充到由金属或陶瓷制成的管状体中，然后将金属浸渍到至少 选自由多孔陶瓷体，陶瓷粉末压块和陶瓷粉末组成的组，然后进行处理。
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公开(公告)号：KR101334503B1
公开(公告)日：2013-11-29
申请号：KR1020087017539
申请日：2007-05-08
申请人： 덴카 주식회사
IPC分类号： C04B35/565 , B22D19/00 , B24C1/00 , H01L23/15
CPC分类号： C04B41/88 , B22D19/14 , B24C1/045 , B26F3/004 , C04B35/565 , C04B35/6316 , C04B41/009 , C04B41/5155 , C04B2111/00844 , C04B2235/3418 , C04B2235/3826 , C04B2235/5436 , C04B2235/5481 , C04B2235/6583 , C22C29/065 , H01L21/4878 , H01L23/147 , H01L23/3733 , H01L23/3735 , H01L23/4922 , H01L2924/0002 , Y10T428/24999 , C04B41/4521 , C04B41/4523 , C04B41/4572 , C04B41/5096 , C04B41/515 , C04B41/53 , C04B38/00 , H01L2924/00
摘要： 파워 모듈용 베이스판 등으로서 바람직한 알루미늄-탄화규소질 복합체를 제공한다.
평판상의 탄화규소질 다공체에 알루미늄을 주성분으로 하는 금속을 함침시켜 이루어지는 알루미늄-탄화규소질 복합체로서, 양 주면에 알루미늄을 주성분으로 하는 금속으로 이루어지는 알루미늄층을 갖고, 측면부 및 구멍부를 워터제트 가공하여, 측면에는 알루미늄을 주성분으로 하는 금속으로 이루어지는 알루미늄층을 측면에 갖지 않는 것을 특징으로 하는 알루미늄-탄화규소질 복합체.
알루미늄-탄화규소질 복합체-
公开(公告)号：KR1019970007499B1
公开(公告)日：1997-05-09
申请号：KR1019940701863
申请日：1992-11-06
申请人： 로버트 보쉬 테크놀러지 코포레이션
IPC分类号： F16D65/12
CPC分类号： C22C33/0292 , C22C29/065 , F16D65/125 , F16D65/128
摘要： 내용없음.
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