점착층 형성방법
    1.
    发明授权
    점착층 형성방법 有权
    점착층형성방법

    公开(公告)号:KR101061918B1

    公开(公告)日:2011-09-02

    申请号:KR1020057023297

    申请日:2004-06-02

    IPC分类号: C09J5/00 B05D1/26

    摘要: In a method for forming an adhesive layer on the surface of a workpiece before the formation of a coating film containing a powder on the workpiece, the present invention provides a method for forming the adhesive layer having a desired thickness. This object is achieved by the following method: An adhesive layer formation medium m1 coated with an adhesive material is made to collide with a workpiece W so that the adhesive material is transferred from the adhesive layer formation medium m1 to the workpiece W and forms an adhesive layer on the workpiece. An adhesive layer having a desired thickness can be formed on the workpiece by regulating the thickness of the adhesive material applied to the surface of the adhesive layer formation medium (i.e. the amount of the adhesive material held by a single adhesive layer formation medium). This enables the thickness of the powder coating as the final product to be controlled as desired.

    摘要翻译: 在工件表面形成包含粉末的涂膜之前在工件表面上形成粘合层的方法中,本发明提供了一种形成具有所需厚度的粘合层的方法。 该目的通过以下方法实现:使涂覆有粘合材料的粘合剂层形成介质m1与工件W碰撞,使得粘合剂材料从粘合剂层形成介质m1转移到工件W并形成粘合剂 工件上的一层。 通过调节施加到粘合剂层形成介质表面的粘合剂材料的厚度(即由单一粘合剂层形成介质保持的粘合剂材料的量),可以在工件上形成具有所需厚度的粘合剂层。 这使得作为最终产品的粉末涂料的厚度可以根据需要进行控制。

    과립상 폴리실리콘의 제조 방법

    公开(公告)号:KR101889845B1

    公开(公告)日:2018-08-20

    申请号:KR1020167018024

    申请日:2014-12-11

    IPC分类号: C01B33/03 B01F5/24

    CPC分类号: C01B33/03 B01F5/247 B05D1/22

    摘要: 본발명은가열장치에의하여 850-1100℃의온도로가열되는유동층내에서기체흐름에의하여실리콘입자를유동화하는단계, 실리콘-함유반응기체를첨가하고상기실리콘입자상에실리콘을증착하는단계, 상기반응기로부터생산되는과립상폴리실리콘을제거하고상기과립상폴리실리콘을패키징하는단계를포함하는, 유동층반응기내에서과립상폴리실리콘을제조하는방법에관한것이다. 상기반응기로부터과립상폴리실리콘의제거로부터상기과립상폴리실리콘의패키징사이에, 상기과립상폴리실리콘은코어플로우를위하여설계되는컨테이너들에의하여하나의컨테이너로부터다른것으로여러번 이송된다.

    과립상 폴리실리콘의 제조 방법
    7.
    发明公开
    과립상 폴리실리콘의 제조 방법 审中-实审
    生产粒状多晶硅的方法

    公开(公告)号:KR1020160093715A

    公开(公告)日:2016-08-08

    申请号:KR1020167018024

    申请日:2014-12-11

    IPC分类号: C01B33/03 B01F5/24

    CPC分类号: C01B33/03 B01F5/247 B05D1/22

    摘要: 본발명은가열장치에의하여 850-1100℃의온도로가열되는유동층내에서기체흐름에의하여실리콘입자를유동화하는단계, 실리콘-함유반응기체를첨가하고상기실리콘입자상에실리콘을증착하는단계, 상기반응기로부터생산되는과립상폴리실리콘을제거하고상기과립상폴리실리콘을패키징하는단계를포함하는, 유동층반응기내에서과립상폴리실리콘을제조하는방법에관한것이다. 상기반응기로부터과립상폴리실리콘의제거로부터상기과립상폴리실리콘의패키징사이에, 상기과립상폴리실리콘은코어플로우를위하여설계되는컨테이너들에의하여하나의컨테이너로부터다른것으로여러번 이송된다.

    摘要翻译: 本发明包括通过在流化床中的气流流化硅颗粒的步骤,加热到850-1100℃通过加热装置,所述含硅反应气体的温度,并加入到存款硅上的硅粒子,在反应器 去除由颗粒状多晶硅产生的颗粒状多晶硅并包装该颗粒状多晶硅。[0002] 在从反应器中取出粒状多晶硅和粒状多晶硅的包装之间,粒状多晶硅通过为芯流设计的容器从一个容器运输到另一个容器几次。

    점착층 형성방법
    8.
    发明公开
    점착층 형성방법 有权
    胶粘剂成型方法

    公开(公告)号:KR1020060024789A

    公开(公告)日:2006-03-17

    申请号:KR1020057023297

    申请日:2004-06-02

    IPC分类号: C09J5/00 B05D1/26

    摘要: An adhesive layer forming method capable of forming an adhesive layer to a specified thickness in a step for forming the adhesive layer on the surface of a member to be treated for forming a film containing powder in the member to be treated. An adhesive layer forming medium (m1) coated with an adhesive substance is collided with the member to be treated (W) to move the adhesive substance from the adhesive layer forming medium (ml) to the member to be treated (W) to form the adhesive layer on the member to be treated (W). The adhesive layer formed on the member to be treated can be formed to the specified thickness by adjusting the thickness of the adhesive substance (amount of the adhesive substance held by each of the adhesive layer forming medium) applied onto the adhesive layer forming medium. Thus, a finally formed powder film can also be formed in a specified thickness.

    摘要翻译: 一种能够在用于在要处理的构件中形成含有粉末的膜的待处理构件的表面上形成粘合剂层的步骤中形成特定厚度的粘合剂层的粘合剂层形成方法。 涂有粘合剂物质的粘合剂层形成介质(m1)与被处理物(W)碰撞,将粘合剂物质从粘合层形成介质(ml)移动到待处理物(W)上,形成 要处理的部件上的粘合剂层(W)。 形成在被处理物上的粘合剂层可以通过调整施加到粘合剂层形成介质上的粘合物质的厚度(由各粘合剂层形成介质保持的粘合物质的量)而形成为规定的厚度。 因此,也可以形成规定厚度的最终形成的粉末膜。