公开(公告)号：US20070001146A1

公开(公告)日：2007-01-04

申请号：US11386175

申请日：2006-03-22

Applicant: Stefan Dick ,  Arthur Schepf ,  Tateshi Kimura ,  Andrew Robertson ,  Mike Gaffney

Inventor： Stefan Dick ,  Arthur Schepf ,  Tateshi Kimura ,  Andrew Robertson ,  Mike Gaffney

IPC: C09K3/00

CPC classification number: B01D53/02 ,  B01D2253/10 ,  B01D2253/108 ,  B01D2253/11 ,  B01D2253/304 ,  B01J20/183 ,  B01J20/28004 ,  B01J20/28019 ,  B01J20/2803 ,  B01J20/28033 ,  B01J20/28042 ,  B01J20/3035 ,  B01J20/3042

Abstract: There is disclosed a plate-shaped pressed body (wafer) produced from an inorganic sorbent and a binder, having a thickness of less than 700 μm, which is produced by the process of compressing a mixture of the inorganic sorbent, the binder, and optionally water and compression aids at a pressure of at least 70 MPa, wherein the weight ratio of dry sorbent to dry binder is between about 4 and 0.7 and the water content of the mixture, measured at 160° C., is between 8 and 20%; and calcining the resulting pressed body at temperatures of at least about 500° C., until the water content is substantially removed.

Abstract translation: 公开了一种由无机吸附剂和粘合剂制成的板状压制体（晶片），其厚度小于700μm，其通过压缩无机吸附剂，粘合剂和任选地 水和压缩助剂在至少70MPa的压力下，其中干吸附剂与干粘合剂的重量比为约4至0.7，混合物的水含量在160℃下测得为8至20％ ; 并在至少约500℃的温度下煅烧所得到的压制体，直到基本上除去含水量。