公开(公告)号：US20090162592A1

公开(公告)日：2009-06-25

申请号：US12338752

申请日：2008-12-18

申请人： Kiran Baikerikar ,  Syed Z. Mahdi ,  Ben W. Schaefer

发明人： Kiran Baikerikar ,  Syed Z. Mahdi ,  Ben W. Schaefer

IPC分类号： C03C17/32 ,  C03C27/00 ,  C03C17/30 ,  C09D183/04 ,  C09J183/04

CPC分类号： C09D201/02 ,  B60J10/345 ,  C03C17/30 ,  Y10S525/901 ,  Y10S525/925 ,  Y10T428/31612

摘要： In one embodiment, the invention is a composition comprising: a) one or more film forming resins having at least one functional group capable of polymerization; b) one or more adhesion promoters comprising compounds containing one or more unsaturated groups capable of free radical polymerization and one or more trialkoxy silane groups; c) one or more fillers capable of imparting abrasion resistance to the composition when cured; d) one or more compounds which is reactive with the film forming resin which also contains an acidic moiety; and e) one or more compounds comprising a siloxane backbone and one or more active hydrogen groups capable of reacting with the functional groups on a glass bonding adhesive, one or more second adhesion promoters comprising one or more silicon, titanium, zirconium, aluminum, or metal containing compounds, organic materials having reactive groups which are reactive with reactive groups on the surface of substrates or adhesives to which the composition of the invention will be bonded or mixtures thereof.

摘要翻译： 在一个实施方案中，本发明是一种组合物，其包含：a）一种或多种具有至少一个能够聚合的官能团的成膜树脂; b）一种或多种粘合促进剂，其包含含有一个或多个能够自由基聚合的不饱和基团和一个或多个三烷氧基硅烷基团的化合物; c）一种或多种能够在固化时赋予组合物耐磨性的填料; d）一种或多种与还含有酸性部分的成膜树脂反应的化合物; 和e）一种或多种包含硅氧烷主链和能够与玻璃粘结粘合剂上的官能团反应的一个或多个活性氢基团的化合物，一种或多种第二粘合促进剂，其包含一种或多种硅，钛，锆，铝或 含有金属的化合物，具有与基材表面上的反应性基团反应的反应性基团的有机材料或与本发明组合物结合的粘合剂或其混合物。

公开(公告)号：US08801949B2

公开(公告)日：2014-08-12

申请号：US13239951

申请日：2011-09-22

申请人： Hamed Lakrout ,  Ben W Schaefer ,  Michael D. Williams

发明人： Hamed Lakrout ,  Ben W Schaefer ,  Michael D. Williams

IPC分类号： C23F1/02 ,  B24B37/22 ,  B24D11/00 ,  B24B37/26

CPC分类号： B24B37/22 ,  B24B37/26 ,  B24D11/003

摘要： The method forms forming an open-network polishing pad useful for polishing magnetic, semiconductor and optical substrates. The method provides a polymer sheet or film of a curable polymer and exposes the polymer sheet or film to an energy source to create an exposure pattern in the polymer sheet or film. The exposure pattern having elongated sections exposed to the energy source. After attaching the polymer sheet or film to an open-network substrate, the method removes polymer adjacent from the exposed polymer sheet or film of the intermediate structure with a solvent. This forms elongated channels through the polymer sheet or film in a texture pattern that corresponds to the exposure pattern with the open-network supporting the polymer. The elongated channels extending through the thickness of the polymer sheet or film to form the open-network polishing pad.

摘要翻译： 该方法形成用于抛光磁性，半导体和光学衬底的开放网络抛光垫。 该方法提供可固化聚合物的聚合物片材或膜，并将聚合物片材或膜暴露于能量源以在聚合物片材或膜中产生曝光图案。 曝光图案具有暴露于能量源的细长部分。 在将聚合物片或膜连接到开放网络基板上之后，该方法用溶剂除去与暴露的聚合物片或中间结构的膜相邻的聚合物。 这形成通过聚合物片材或膜的细长通道，其以对应于曝光图案的纹理图案与支撑聚合物的开放网络形成。 细长通道延伸穿过聚合物片或薄膜的厚度以形成开放式网状抛光垫。

公开(公告)号：US08147974B2

公开(公告)日：2012-04-03

申请号：US12338752

申请日：2008-12-18

申请人： Kiran Baikerikar ,  Syed Z. Mahdi ,  Ben W. Schaefer

发明人： Kiran Baikerikar ,  Syed Z. Mahdi ,  Ben W. Schaefer

IPC分类号： B32B17/06 ,  B32B9/04 ,  C08J3/28 ,  C08L33/10

CPC分类号： C09D201/02 ,  B60J10/345 ,  C03C17/30 ,  Y10S525/901 ,  Y10S525/925 ,  Y10T428/31612

摘要： A composition comprising: a)one or more film forming resins having at least one functional group capable of polymerization; b) one or more adhesion promoters comprising compounds containing one or more unsaturated groups capable of free radical polymerization and one or more trialkoxy silane groups; c) one or more fillers capable of imparting abrasion resistance to the composition; d) one or more compounds which is reactive with the film forming resin which also contains an acidic moiety; and e) one or more compounds comprising a siloxane backbone and one or more active hydrogen groups capable of reacting with the functional groups on a glass bonding adhesive: one or more second adhesion promoters comprising one or more silicon, titanium, zirconium, aluminum, or metal containing compounds; organic materials having reactive groups reactive with reactive groups on the surface of substrates or adhesives; or mixtures thereof.

摘要翻译： 一种组合物，其包含：a）一种或多种具有至少一个能够聚合的官能团的成膜树脂; b）一种或多种粘合促进剂，其包含含有一个或多个能够自由基聚合的不饱和基团和一个或多个三烷氧基硅烷基团的化合物; c）能够赋予组合物耐磨性的一种或多种填料; d）一种或多种与还含有酸性部分的成膜树脂反应的化合物; 和e）一种或多种包含硅氧烷主链和能够与玻璃粘结粘合剂上的官能团反应的一个或多个活性氢基团的化合物：一种或多种第二粘合促进剂，其包含一种或多种硅，钛，锆，铝或 含金属化合物; 具有与基材或粘合剂表面上的反应性基团反应的反应性基团的有机材料; 或其混合物。

公开(公告)号：US20130075362A1

公开(公告)日：2013-03-28

申请号：US13239951

申请日：2011-09-22

申请人： Hamed Lakrout ,  Ben W. Schaefer ,  Michael D. Williams

发明人： Hamed Lakrout ,  Ben W. Schaefer ,  Michael D. Williams

IPC分类号： C23F1/02

CPC分类号： B24B37/22 ,  B24B37/26 ,  B24D11/003

摘要： The method forms forming an open-network polishing pad useful for polishing magnetic, semiconductor and optical substrates. The method provides a polymer sheet or film of a curable polymer and exposes the polymer sheet or film to an energy source to create an exposure pattern in the polymer sheet or film. The exposure pattern having elongated sections exposed to the energy source. After attaching the polymer sheet or film to an open-network substrate, the method removes polymer adjacent from the exposed polymer sheet or film of the intermediate structure with a solvent. This forms elongated channels through the polymer sheet or film in a texture pattern that corresponds to the exposure pattern with the open-network supporting the polymer. The elongated channels extending through the thickness of the polymer sheet or film to form the open-network polishing pad.

摘要翻译： 该方法形成用于抛光磁性，半导体和光学衬底的开放网络抛光垫。 该方法提供可固化聚合物的聚合物片材或膜，并将聚合物片材或膜暴露于能量源，以在聚合物片材或膜中产生曝光图案。 曝光图案具有暴露于能量源的细长部分。 在将聚合物片或膜连接到开放网络基板上之后，该方法用溶剂除去与暴露的聚合物片或中间结构的膜相邻的聚合物。 这形成通过聚合物片材或膜的细长通道，其以对应于曝光图案的纹理图案与支撑聚合物的开放网络形成。 细长通道延伸穿过聚合物片或薄膜的厚度以形成开放式网状抛光垫。