公开(公告)号：US20070003879A1

公开(公告)日：2007-01-04

申请号：US11337986

申请日：2006-01-24

Applicant: Ching-Yu Chang ,  C.C. Ke ,  Vincent Yu

Inventor： Ching-Yu Chang ,  C.C. Ke ,  Vincent Yu

IPC: G03F7/26

CPC classification number: G03F7/2041 ,  G03F7/162 ,  G03F7/168 ,  G03F7/70341 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/6715

Abstract: A method of performing immersion lithography on a semiconductor wafer is provided. The method includes providing a layer of resist onto a surface of the semiconductor wafer. Next, an edge-bead removal process spins the wafer at a speed greater than 1000 revolutions per minute and dispenses solvent through a nozzle while the wafer is spinning. Then, the resist layer is exposed using an immersion lithography exposure system.

Abstract translation: 提供了在半导体晶片上进行浸渍光刻的方法。 该方法包括在半导体晶片的表面上提供一层抗蚀剂。 接下来，边缘珠去除过程以大于1000转/分钟的速度旋转晶片，并且在晶片旋转时通过喷嘴分配溶剂。 然后，使用浸没式光刻曝光系统曝光抗蚀剂层。