公开(公告)号：US20110139494A1

公开(公告)日：2011-06-16

申请号：US12696629

申请日：2010-01-29

申请人： Chen-Po Yu ,  Chai-Liang Hsu

发明人： Chen-Po Yu ,  Chai-Liang Hsu

IPC分类号： H05K1/02 ,  B05D5/12 ,  H05K1/03

CPC分类号： H05K3/107 ,  H05K3/181 ,  H05K3/422 ,  H05K2201/0376

摘要： A method for manufacturing an embedded wiring board is provided. An activating insulation layer is formed, in which the activating insulation layer includes a plurality of catalyst particles, and covers a first wiring layer. An intaglio pattern and at least one blind via partially exposing the first wiring layer are formed on the activating insulation layer, in which some of the catalyst particles are activated and exposed in the intaglio pattern and the blind via. The activating insulation layer is dipped in a first chemical plating solution, and a solid conductive pillar is formed in the blind via through electroless plating. The activating insulation layer is dipped in a second chemical plating solution after the solid conductive pillar is formed, and a second wiring layer is formed in the intaglio pattern through the electroless plating. Components of the first chemical plating solution and the second chemical plating solution are different.

摘要翻译： 提供了一种用于制造嵌入式布线板的方法。 形成激活绝缘层，其中活化绝缘层包括多个催化剂颗粒，并覆盖第一布线层。 在活化绝缘层上形成凹版图案和部分露出第一布线层的至少一个盲孔，其中一些催化剂颗粒被活化并以凹版图案和盲孔曝光。 将激活绝缘层浸入第一化学镀溶液中，并通过化学镀在盲孔中形成固体导电柱。 在形成固体导电柱之后，将激活绝缘层浸入第二化学镀溶液中，并且通过无电解电镀在凹版图案中形成第二布线层。 第一化学镀液和第二化学镀液的成分不同。