摘要:
A floatable magnetic filter screen (10, 40, 52, 60) for removing metallic debris from work-functioning baths (26, 26') comprises a tubular rectangular outer frame (11, 11', 14, 14', 16, 61) that supports a plurality of magnet-forming webs (18, 18', 62), in a predetermined array, within the central opening thereof. The magnets (23, 23', 64) of each web, when required, are encapsulated within a protective material covering (e.g., 19, 19') so as to physically isolate them from a given bath (26, 26') within which the filter screen (10, 40, 52, 60) is to be employed. While the filter screen is adapted to normally float on the surface of a given bath, through piece part (33, 33', 53) initiated immersion of the filter screen in the bath, preferably using a piece part-carrying basket (36, 36', 51), the bath solution is effectively forced through the filter screen during both the downward and subsequent upward displacement of the latter. As a result of such reciprocal displacement, any loose metallic debris (38) in the bath is magnetically drawn against magnet-defined sites on the filter screen, and may be readily removed periodically therefrom, such as with a simple water spray (39).
摘要:
Several planar configured, metallized resistor embodiments (25, 35, 45, 55, 65) are disclosed, as are several methods of manufacturing and resistance trimming the same, particularly to values of resistance lower than the "as fabricated" nominal value thereof. In accordance with one preferred resistor embodiment (25), a plurality of associated discrete conductive bonding pads (29) are formed on a common supporting substrate (27), with each pad being in conductive contact with a different spaced site along the body portion (25a) of the resistor between the terminating ends thereof. The bonding pads (29) are advantageously adapted to allow bonded wire connections to be made between different selected pairs thereof, after fabrication of the resistor, whenever necessary to incrementally reduce the initial nominal value of resistance of the resistor to a lower desired value.In accordance with several other resistor embodiments (35, 55, 65), the bonding pads (41 and 42, 59, 72) thereof are arranged in clusters so as to allow the use of solder bridges, as well as bonded wires, to interconnect selected ones of adjacent pairs of the pads as required to establish a desired lower value of resistance.Also in accordance with the principles of the invention, one illustrative resistor (45) incorporates a plurality of short-circuiting shunts (52), in addition to a plurality of bonding pads (47). The shunts are interconnected to the body portion (45a) of the resistor at different spaced sites therealong such that when selectively opened, the then existing value of resistance of the resistor is incrementally increased, whereas when short-circuit connections are selectively established between different pairs of the bonding pads (47), the then existing resistance of the resistor is incrementally decreased.