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1114 条记录 (耗时 0.033 秒)

    Wiring device having a plurality of protrusions
    1.
    发明授权
    Wiring device having a plurality of protrusions 有权

    公开(公告)号：US12119574B2

    公开(公告)日：2024-10-15

    申请号：US17689759

    申请日：2022-03-08

    申请人： Kabushiki Kaisha Toshiba ,  Toshiba Electronic Devices & Storage Corporation

    发明人： Kenichi Agawa

    IPC分类号： H01R12/53 ,  H01R12/88 ,  H05K1/14

    CPC分类号： H01R12/53 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/10287 ,  H05K2201/10393

    摘要： A wiring device has a plate having a first surface and a second surface and a first protrusion having a side surface capable of locking a first substrate and a first upper surface with a plurality of first grooves and the first substrate including a terminal on a surface of the first substrate. Each of the first grooves accommodates a coating of a wiring including a conductor and the coating, the first protrusion extending in a third direction. The holder includes a plurality of connection portions, and the holder includes a plurality of second grooves, each of the second grooves capable of accommodating the conductor exposed from the coating. The cover is rotatably openable and closable with respect to the plate, and the cover brings the conductor into pressure contact with the terminal between the first protrusion and the holder.

    Electronic device
    3.
    发明授权
    Electronic device 有权

    公开(公告)号：US11982704B2

    公开(公告)日：2024-05-14

    申请号：US17216708

    申请日：2021-03-30

    申请人： E Ink Holdings Inc.

    发明人： Ruei-Huan Rao ,  Te-Lung Cheng

    IPC分类号： G01R31/28 ,  H05K1/11

    CPC分类号： G01R31/2812 ,  H05K1/111 ,  H05K2201/09245 ,  H05K2201/09336 ,  H05K2201/09409 ,  H05K2201/10287

    摘要： An electronic device includes a first substrate having a first bonding region, a first circuit, a second circuit, a third circuit, and a plurality of first conductive contacts. The first and second circuit are located at a first edge and a second edge of the first bonding region, the third circuit is located between the first and the second circuits. A second substrate having a second bonding region corresponding to the first bonding region in position and a fourth circuit, a fifth circuit, a sixth circuit, and a plurality of second conductive contacts. When the first substrate is bonded with the second substrate, the first circuit, the second circuit, the third circuit, the fourth circuit, the fifth circuit, and the sixth circuit form a loop, and the first and second conductive contacts are electrically connected to a plurality of signal circuits.

    METHOD FOR PRODUCING WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD
    4.
    发明公开
    METHOD FOR PRODUCING WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD 审中-公开

    公开(公告)号：US20240114628A1

    公开(公告)日：2024-04-04

    申请号：US18471046

    申请日：2023-09-20

    申请人： NITTO DENKO CORPORATION

    发明人： Kenta FUKUSHIMA ,  Hayato TAKAKURA ,  Naoki SHIBATA ,  Ryosuke SASAOKA

    IPC分类号： H05K3/10 ,  H05K1/02 ,  H05K3/00 ,  H05K3/32

    CPC分类号： H05K3/103 ,  H05K1/0296 ,  H05K3/0017 ,  H05K3/32 ,  H05K2201/10287

    摘要： A method for producing a wiring circuit board includes a preparation step of preparing a substrate; a first patterning step of forming a first insulating layer on one side of the substrate in a thickness direction; a second patterning step of forming a conductive pattern on one side of the first insulating layer in the thickness direction; and a deposition step of depositing a metal on the other side of the substrate in the thickness direction and forming a first metal support layer. The conductive pattern has two terminals, and two wirings. The first metal support layer has a terminal support portion supporting the terminals, a wiring support portion supporting one of the wirings, and a second wiring support portion supporting the other wiring and disposed spaced from the wiring support portion.

    CAMERA MODULE
    5.
    发明公开
    CAMERA MODULE 审中-公开

    公开(公告)号：US20240089570A1

    公开(公告)日：2024-03-14

    申请号：US18262847

    申请日：2022-01-25

    申请人： LG INNOTEK CO., LTD.

    发明人： Won Seob SHIN

    IPC分类号： H04N23/52 ,  H04N23/54 ,  H04N25/77 ,  H05K1/02

    CPC分类号： H04N23/52 ,  H04N23/54 ,  H04N25/77 ,  H05K1/0271 ,  H05K2201/10151 ,  H05K2201/10287

    摘要： A camera module according to an embodiment includes a reinforcing plate; a bump part disposed on the reinforcing plate; a substrate disposed on the reinforcing plate and including a cavity vertically overlapping the bump part; and an image sensor disposed on the bump part, wherein the bump part includes a first bump disposed on the reinforcing plate and having a first height; and a second bump disposed on the first bump and having a second height different from the first height; and wherein an upper surface of the second bump is in direct contact with a lower surface of the image sensor.