摘要:
A camera assembly mounted in an electronic device comprises a hollow base, a first gear, a first shaft, a second gear, a second shaft, a driving device and a driving gear. The camera is received in the base and rotatably connected to the base. One end of the first shaft is fixed with the first gear, another end of the first shaft is rotatably connected with the camera. One end of the second shaft is fixed with the base, another end of the second shaft is fixed with the second gear. The driving device drives the driving gear to engage with the first gear and the second gear, respectively, which lead to the camera capable of rotating around an axis of the first shaft and an axis of the second shaft, respectively.
摘要:
A camera assembly mounted in an electronic device comprises a hollow base, a first gear, a first shaft, a second gear, a second shaft, a driving device and a driving gear. The camera is received in the base and rotatably connected to the base. One end of the first shaft is fixed with the first gear, another end of the first shaft is rotatably connected with the camera. One end of the second shaft is fixed with the base, another end of the second shaft is fixed with the second gear. The driving device drives the driving gear to engage with the first gear and the second gear, respectively, which lead to the camera capable of rotating around an axis of the first shaft and an axis of the second shaft, respectively.
摘要:
A circuit board includes a first circuit board section which is configured to support a set of light emitting diodes, a second circuit board section which is configured to support high-speed electronic circuitry, and a boundary section which defines an EMI boundary between the first circuit board section and the second circuit board section. The boundary section includes a set of outer surface elongated ground strips configured to form an EMI seal onto which a set of EMI shields is capable of mounting. In some arrangements, the set of outer surface elongated ground strips take the form of metallic bands (e.g., layers of copper). Such bands can be integrated into the circuit board itself (e.g., during PCB fabrication), or added onto one or more of the circuit board surfaces (e.g., after PCB fabrication).
摘要:
A chassis utilizes spring fingers having contact portions and mid portions where each spring finger forms multiple cantilevers to provide different spring constants. Accordingly, the increase in force resulting from displacement can be better controlled and even minimized for certain ranges of displacement. In particular, each spring finger can be configured to perform in an operating range characterized by a smaller spring constant. As a result, the force increase in this operating range is slower thus accommodating circuit boards with large connector height variations without significantly changing the normal contact force. Such operation enables the chassis to consistently pass EMI and ESD testing, as well as provide more reliable device operation.