公开(公告)号：US20230164910A1

公开(公告)日：2023-05-25

申请号：US17992161

申请日：2022-11-22

Applicant: Smith & Nephew PLC

Inventor： Ben Alan Askem ,  Fernando Bettani ,  Alberto Fasan ,  Allan Kenneth Frazer Grugeon Hunt ,  Felix Clarence Quintanar

IPC: H05K1/02 ,  H05K9/00 ,  A61M1/00 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/0257 ,  H05K1/0259 ,  H05K9/0067 ,  A61M1/80 ,  A61M1/96 ,  A61M1/74 ,  A61M1/90 ,  A61M1/84 ,  H05K1/115 ,  H05K1/181 ,  A61M2209/088 ,  H05K2201/09354 ,  H05K2201/09618 ,  A61M1/962 ,  A61M1/982 ,  A61M1/985 ,  A61M1/78 ,  A61M2205/0233 ,  A61M2205/15 ,  A61M2205/18 ,  A61M2205/502 ,  A61M2205/8206 ,  H05K2201/093

Abstract: Embodiments of negative pressure wound therapy systems and methods are disclosed. In one embodiment, an apparatus includes a housing, negative pressure source, circuit board, and one or more controllers. The circuit board can be supported by the housing and include a conductive pathway extending around at least part of a perimeter of a first side of the circuit board. The conductive pathway can be electrically coupled to an electrical ground for the circuit board. The one or more controllers can be mounted on the circuit board and activate and deactivate the negative pressure source.

公开(公告)号：US20190207286A1

公开(公告)日：2019-07-04

申请号：US15859393

申请日：2017-12-30

Applicant: Texas Instruments Incorporated

Inventor： Meysam Moallem

IPC: H01P5/107 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H01L23/66 ,  H01Q1/22

CPC classification number: H01P5/107 ,  H01L23/66 ,  H01L2223/6627 ,  H01L2223/6683 ,  H01Q1/2283 ,  H01Q1/38 ,  H05K1/024 ,  H05K1/0242 ,  H05K1/115 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/09618

Abstract: In described examples, an integrated waveguide transition includes a substrate with a waveguide side and an opposing waveguide termination side. A first layer of metal covers a portion of the waveguide side, a second layer of metal is separated from the first layer of metal by a first layer of dielectric, and a third layer of metal covers a portion of the waveguide termination side and is separated from the second layer of metal by a second layer of dielectric. A substrate waveguide perpendicular to a plane of the substrate extends from the waveguide side to the waveguide termination side; and a length and a width of the substrate waveguide is defined by a fence of ground-stitching vias that short the first layer of metal and the second layer of metal to a plate of the third layer of metal that forms a back short.

公开(公告)号：US20180310399A1

公开(公告)日：2018-10-25

申请号：US15771833

申请日：2015-12-21

Applicant: Intel Corporation

Inventor： Vijay K. NAIR ,  Sasha N. OSTER ,  Adel A. ELSHERBINI ,  Telesphor KAMGAING ,  Feras EID

IPC: H05K1/02 ,  H01P3/12 ,  H01P5/107 ,  H05K3/46

CPC classification number: H05K1/0243 ,  H01P3/121 ,  H01P5/107 ,  H05K3/4697 ,  H05K2201/037 ,  H05K2201/09618

Abstract: Embodiments of the invention include a waveguide structure that includes a lower member, at least one sidewall member coupled to the lower member, and an upper member. The lower member, the at least one sidewall member, and the upper member include at least one conductive layer to form a cavity in a substrate for allowing communications between devices that are coupled or attached to the substrate.

公开(公告)号：US20180228033A1

公开(公告)日：2018-08-09

申请号：US15878063

申请日：2018-01-23

Applicant: Yazaki Corporation

Inventor： Mizuki Shirai ,  Hiroki Kondo

IPC: H05K3/40 ,  H01R12/52 ,  H01R4/04 ,  H05K1/11 ,  H05K3/12 ,  H05K1/09

CPC classification number: H05K3/4038 ,  H01R4/04 ,  H01R12/52 ,  H05K1/092 ,  H05K1/115 ,  H05K3/1216 ,  H05K3/361 ,  H05K3/4053 ,  H05K2201/041 ,  H05K2201/09236 ,  H05K2201/09563 ,  H05K2201/09618 ,  H05K2201/0979

Abstract: An electrical connection method of a printed circuit includes overlapping a base material and a thin member in which a thin conductor is mounted, forming a through hole which passes through the base material overlapped with the thin member in the overlapping and reaches the thin conductor of the thin member, and forming a printed circuit on the base material by a screen printing method using conductive paste. The through hole formed in the forming of the through hole is filled with the conductive paste in the forming of the printed circuit.

公开(公告)号：US20180048047A1

公开(公告)日：2018-02-15

申请号：US15603582

申请日：2017-05-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Soon Yong LEE ,  Yeon Sik YU ,  Il Kim ,  Keon Young SEO ,  Min-Goo SEO ,  Jae-Deok LIM ,  Si Ho JANG ,  Hyun-Tae JANG

IPC: H01P7/08 ,  H05K1/11 ,  H05K1/03 ,  H05K1/02

CPC classification number: H01P7/082 ,  H01P1/2005 ,  H05K1/0219 ,  H05K1/0227 ,  H05K1/0236 ,  H05K1/0353 ,  H05K1/115 ,  H05K2201/09218 ,  H05K2201/09618 ,  H05K2201/09781

Abstract: A split resonator and a printed circuit board (PCB) including the same are disclosed. The split resonator is mounted to one side of the PCB to improve the electromagnetic shielding effect, and absorbs a radiation field emitted to the outer wall of the PCB. The PCB includes: a substrate on which one or more electronic components are populated; a dielectric substrate mounted to one side of the substrate; one pair of conductors provided in the dielectric substrate, spaced apart from the substrate in a thickness direction of the substrate by a predetermined distance, and arranged to face each other; and a connection portion configured to interconnect the one pair of conductors, and arranged in parallel to the thickness direction of the substrate.

公开(公告)号：US20170273174A1

公开(公告)日：2017-09-21

申请号：US15245202

申请日：2016-08-24

Applicant: Industrial Technology Research Institute ,  First Hi-tec Enterprise Co.,Ltd. ,  NEXCOM International Co., Ltd.

Inventor： Chien-Min Hsu ,  Min-Lin Lee ,  Huey-Ru Chang ,  Hung-I Liu ,  Ching-shan Chang

IPC: H05K1/02 ,  H01P3/08 ,  H05K1/11

CPC classification number: H05K1/0245 ,  H01P3/08 ,  H05K1/0251 ,  H05K1/111 ,  H05K1/115 ,  H05K2201/09509 ,  H05K2201/09545 ,  H05K2201/09618 ,  H05K2201/09627

Abstract: A multi-layer circuit structure includes a differential transmission line pair and at least one conductive pattern. The differential transmission line pair includes first and second transmission lines disposed side by side. Each of the first and second transmission lines includes first and second segments connected to each other. An spacing between the two first segments is non-fixed, and an spacing between the two second segments is fixed. A first zone is located between the two first segments, a second zone is opposite to the first zone and located outside the first segment of the first transmission line, and a third zone is opposite to the first zone and located outside the first segment of the second transmission line. The conductive pattern is coplanar with the differential transmission line pair and disposed on at least one of the first, second and third zones. The conductive pattern is electrically connected to a reference potential and electrically insulated from the differential transmission line pair.

公开(公告)号：US09699888B2

公开(公告)日：2017-07-04

申请号：US14838642

申请日：2015-08-28

Applicant: FUJITSU LIMITED

Inventor： Taiga Fukumori

IPC: H05K1/11 ,  H05K1/14 ,  H05K1/02

CPC classification number: H05K1/0243 ,  H05K1/0218 ,  H05K1/0251 ,  H05K2201/09618 ,  H05K2201/09672 ,  H05K2201/10674

Abstract: A circuit substrate includes: a plurality of signal wirings formed at different positions of the circuit substrate in a thickness direction and extending in parallel in the circuit substrate; and ground layers or power supply layers formed at both sides of the circuit substrate in the thickness direction by interposing the plurality of the signal wirings between the ground layers or between the power supply layers, wherein the plurality of signal wirings are electrically coupled with each other by a plurality of conductors formed at an interval narrower than an interval by which a resonance is caused.

公开(公告)号：US09674960B2

公开(公告)日：2017-06-06

申请号：US14700204

申请日：2015-04-30

Applicant: AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT

Inventor： Johannes Stahr ,  Markus Leitgeb

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/02 ,  H05K1/14

CPC classification number: H05K1/185 ,  H05K1/0218 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/14 ,  H05K1/144 ,  H05K1/181 ,  H05K1/186 ,  H05K3/4623 ,  H05K3/4697 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/045 ,  H05K2201/0723 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/09618 ,  H05K2201/10 ,  H05K2201/10083 ,  H05K2201/10151 ,  Y10T29/49126 ,  Y10T29/49144

Abstract: A printed circuit board having two completed printed circuit board elements which consists of a plurality of interconnected plies or layers, wherein at least one printed circuit board element has a cutout or depression containing the component to be integrated on one of the printed circuit board elements or in the cutout of the at least one printed circuit board element, and the printed circuit board elements are connected with the component being accommodated in the cutout, as a result of which it is possible to obtain secure and reliable accommodation of the component in the printed circuit board. Furthermore, a printed circuit board of this type also contains an electronic component integrated therein.

公开(公告)号：US09666925B2

公开(公告)日：2017-05-30

申请号：US14796027

申请日：2015-07-10

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki Yosui ,  Nobuo Ikemoto ,  Shigeru Tago ,  Zhujun Yang ,  Jun Sasaki ,  Fumie Matsuda ,  Wataru Tamura

IPC: H05K7/00 ,  H01P3/02 ,  H05K1/18 ,  H05K1/02 ,  H01P3/08 ,  H05K1/14

CPC classification number: H01P3/026 ,  H01P3/085 ,  H05K1/0225 ,  H05K1/0227 ,  H05K1/0242 ,  H05K1/025 ,  H05K1/028 ,  H05K1/147 ,  H05K1/18 ,  H05K2201/09618 ,  H05K2201/09727

Abstract: A main transmission line includes a substantially elongated dielectric body in which first and second substantially elongated signal conductors are disposed with a distance therebetween in a width direction. A first reference ground conductor and a first auxiliary ground conductor sandwich therebetween the first signal conductor in a thickness direction. A second reference ground conductor and a second auxiliary ground conductor sandwich therebetween the second signal conductor in the thickness direction. The second auxiliary ground conductor includes two substantially elongated conductors and a first bridge conductor, and the second auxiliary ground conductor includes two substantially elongated conductors and a second bridge conductor. The positions of the first and second bridge conductors in a lengthwise direction are different.

公开(公告)号：US09603250B2

公开(公告)日：2017-03-21

申请号：US14194278

申请日：2014-02-28

Applicant: FUJITSU LIMITED

Inventor： Yasuo Hidaka

IPC: H05K1/11 ,  H05K3/46 ,  H05K1/02 ,  H05K3/00 ,  H05K3/42

CPC classification number: H05K1/116 ,  H05K1/0225 ,  H05K1/0251 ,  H05K3/0047 ,  H05K3/429 ,  H05K2201/093 ,  H05K2201/096 ,  H05K2201/09618 ,  H05K2201/09718 ,  H05K2201/09727 ,  H05K2201/09845 ,  Y10T29/49165

Abstract: A circuit may include a signal path, a first layer including the signal path, and a second layer including the signal path. The circuit may additionally include a path via having a signal-path via location and configured to connect the signal path at the first layer with the signal path at the second layer. The circuit may also include a ground plane associated with the first layer. The ground plane may have a ground-plane location that corresponds to the signal-path via location. The ground plane may also include an asymmetrical cutout portion that extends away from the ground-plane location on a first side of the ground plane that is opposite a second side of the ground plane that corresponds with a side of the first layer where the path via interfaces with the signal path at the first layer.