公开(公告)号：US11792919B2

公开(公告)日：2023-10-17

申请号：US17427954

申请日：2020-03-13

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Lee Francis

IPC: H05K1/02 ,  H05K1/18 ,  H05K7/14

CPC classification number: H05K1/0256 ,  H05K1/181 ,  H05K7/1427 ,  H05K2201/0761 ,  H05K2201/09063 ,  H05K2201/09972 ,  H05K2201/1003

Abstract: A case includes a header with a first isolation barrier, a cover with a second isolation barrier, and a printed circuit board (PCB) including a slot in which the first isolation barrier or the second isolation barrier is located and a primary-circuit side and a secondary-circuit side located on opposites sides of the slot.

公开(公告)号：US20180306391A1

公开(公告)日：2018-10-25

申请号：US15753009

申请日：2016-08-16

Applicant: PHILIPS LIGHTING HOLDING B.V.

Inventor： Michel Cornelis Josephus Marie VISSENBERG ,  Anna Wilhelmina Maria WONDERGEM-DE BEST

IPC: F21S4/10 ,  F21S4/28 ,  F21V29/503 ,  F21V29/70

CPC classification number: F21S4/10 ,  F21S4/20 ,  F21S4/28 ,  F21V29/503 ,  F21V29/70 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K3/0052 ,  H05K3/0097 ,  H05K2201/09027 ,  H05K2201/09127 ,  H05K2201/09918 ,  H05K2201/09972 ,  H05K2201/10106

Abstract: A lighting device comprising a carrier board and an array of lighting elements mounted on the carrier board. The carrier board has a generally spiral shape and the carrier board can be tessellated with one or more identical other carrier boards with windings interleaved with each other. This enables multiple carrier boards to be formed from a single substrate with little or no waste of material. Different designs enable two, four or even more different identical carried board shapes to be tessellated together.

公开(公告)号：US20180042147A1

公开(公告)日：2018-02-08

申请号：US15488024

申请日：2017-04-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Il-ju MUN ,  Keon KUK ,  Ji-woon YEOM

IPC: H05K9/00 ,  H05K1/18

CPC classification number: H05K1/182 ,  B05D1/26 ,  B05D7/50 ,  H01L23/552 ,  H01L2224/16227 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K9/0024 ,  H05K2201/09972 ,  H05K2201/10204 ,  H05K2203/0126

Abstract: An electromagnetic interference (EMI) shielding structure and a manufacturing method thereof are provided. The EMI shielding structure includes a shielding dam provided on a printed circuit board, the shielding dam forming a closed loop that defines a periphery of adjacent shielding regions of the printed circuit board; an insulating member that is provided on the adjacent shielding regions within the shielding dam, the insulating member covering circuit devices provided in the adjacent shielding regions; and a shielding member that covers an upper surface of the insulating member, wherein the shielding dam includes a border portion surrounding the adjacent shielding regions, and a partition portion disposed between the adjacent shielding regions and within the border portion.

公开(公告)号：US09818698B2

公开(公告)日：2017-11-14

申请号：US14509939

申请日：2014-10-08

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chuei-Tang Wang ,  Der-Chyang Yeh

IPC: H01L21/56 ,  H01L23/498 ,  H01L23/31 ,  H01L23/552 ,  H01L25/065 ,  H05K3/28 ,  H01L21/768 ,  H01L25/00 ,  H01L23/00 ,  H01L25/16

CPC classification number: H01L23/552 ,  H01L21/565 ,  H01L21/76802 ,  H01L21/76877 ,  H01L21/76898 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/64 ,  H01L25/0655 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/02317 ,  H01L2224/02372 ,  H01L2224/02373 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/81191 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/284 ,  H05K2201/0715 ,  H05K2201/09972 ,  H05K2201/10378 ,  H05K2203/1316 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

Abstract: An integrated circuit structure includes a substrate, a photosensitive molding on a first side of the substrate, a via formed in the molding, and a conformable metallic layer deposited over the first side of the substrate and in the via. A through via may be formed through the substrate aligned with the via in the molding with an electrically conductive liner deposited in the through via in electrical contact with the conformable metallic layer. The integrated circuit structure may further include a connector element such as a solder ball on an end of the through via on a second side of the substrate opposite the first side. The integrated circuit structure may further include a die on the first side of the substrate in electrical contact with another through via or with a redistribution layer.

公开(公告)号：US09812418B2

公开(公告)日：2017-11-07

申请号：US15351992

申请日：2016-11-15

Applicant: Fujitsu Limited

Inventor： Kozo Shimizu ,  Seiki Sakuyama

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/367 ,  H01L25/00 ,  B23K1/00 ,  B23K3/08 ,  H01L23/31 ,  H01L23/488 ,  H01L23/498 ,  B23K35/02 ,  B23K35/26 ,  H05K1/02 ,  H05K3/34 ,  H01L23/14 ,  B23K101/40 ,  B23K101/42 ,  H05K1/09 ,  H05K1/11

CPC classification number: H01L24/17 ,  B23K1/0008 ,  B23K1/0016 ,  B23K3/085 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/264 ,  B23K2101/40 ,  B23K2101/42 ,  H01L23/145 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05082 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/13016 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/1601 ,  H01L2224/16145 ,  H01L2224/16157 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/16505 ,  H01L2224/16507 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/75253 ,  H01L2224/75501 ,  H01L2224/75502 ,  H01L2224/759 ,  H01L2224/81005 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81411 ,  H01L2224/81815 ,  H01L2224/81948 ,  H01L2224/81986 ,  H01L2225/06513 ,  H01L2924/014 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/1579 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/16747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3512 ,  H01L2924/35121 ,  H05K1/0203 ,  H05K1/09 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0248 ,  H05K2201/09972 ,  H05K2201/1056 ,  H05K2203/1121 ,  H05K2203/304 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/00

Abstract: An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

公开(公告)号：US09774085B2

公开(公告)日：2017-09-26

申请号：US14717172

申请日：2015-05-20

Applicant: Google Inc.

Inventor： Peter Bevelacqua ,  Jason Chamberlain

IPC: H05K3/32 ,  H01Q7/00 ,  H01Q1/38 ,  H05K1/02 ,  H04B5/00

CPC classification number: H01Q7/00 ,  H01Q1/38 ,  H04B5/0056 ,  H04B5/0081 ,  H05K1/0296 ,  H05K3/32 ,  H05K2201/09063 ,  H05K2201/09972 ,  H05K2201/10098

Abstract: Systems and techniques are provided for a co-located NFC reader. A top conductive layer may include an inner PCB section, including a circuit for an electronic device, and an outer PCB section, including a near-field communications (NFC) chipset, separated by a gap in which an NFC antenna connected to the NFC chipset may be located. A substrate layer may include an inner PCB section and an outer PCB section separated by the gap. A bridge including a trace may cross the gap. A lower conductive layer may include an inner PCB section, including a circuit for the electronic device electrically connected to the circuit for the electronic device located on the inner PCB section of the top conductive layer, and an outer PCB section, including a circuit for the electronic device, separated by the gap.

公开(公告)号：US09706638B2

公开(公告)日：2017-07-11

申请号：US14996623

申请日：2016-01-15

Applicant: Astec International Limited

Inventor： Daryl Weispfennig ,  Bradley Schumacher ,  Kwong Kei Chin

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K1/03 ,  H05K1/09 ,  H01L23/495

CPC classification number: H05K1/0203 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49568 ,  H01L23/49582 ,  H01L2924/0002 ,  H05K1/0263 ,  H05K1/0298 ,  H05K1/0313 ,  H05K1/09 ,  H05K1/115 ,  H05K1/181 ,  H05K3/202 ,  H05K3/42 ,  H05K3/4602 ,  H05K2201/0352 ,  H05K2201/09881 ,  H05K2201/09972 ,  H05K2201/10166 ,  H05K2201/10689 ,  H05K2203/175 ,  Y02P70/611 ,  Y10T29/49126 ,  H01L2924/00

Abstract: An integrated circuit assembly includes a first electrically conductive sheet, a second electrically conductive sheet electrically isolated from the first electrically conductive sheet, a non-conductive material disposed between the first and second electrically conductive sheets, an electrical trace disposed on the non-conductive material and electrically isolated from the first and second electrically conductive sheets, and an integrated circuit having at least one lead directly connected to the first electrically conductive sheet, at least one lead directly connected to the second electrically conductive sheet, and at least one lead electrically connected to the electrical trace. Other integrated circuit assemblies and method for making integrated circuit assemblies are also disclosed.

公开(公告)号：US09596752B2

公开(公告)日：2017-03-14

申请号：US14464006

申请日：2014-08-20

Applicant: Ambianti B.V.

Inventor： Georgios Metaxas

IPC: H05K5/00 ,  H05K1/02 ,  G06F3/14 ,  G09G3/20 ,  H05K3/00

CPC classification number: H05K1/0292 ,  G06F3/1446 ,  G09G3/20 ,  G09G3/2085 ,  G09G3/2088 ,  G09G2300/026 ,  G09G2300/0426 ,  G09G2310/0278 ,  G09G2310/0281 ,  G09G2330/08 ,  G09G2340/0492 ,  G09G2360/141 ,  G09G2370/18 ,  H05K1/0286 ,  H05K3/0052 ,  H05K2201/09972 ,  H05K2201/10507

Abstract: A panel of rectangular shape comprising a plurality of electric devices spread over the panel, a control unit including a microprocessor and a power supply, drivers for driving the electric devices based on control information received from the control unit and electric wiring connecting the control unit, the drivers and the electric devices, the shape of the panel being adaptable by removing one or more parts of the panel by cutting, sawing, milling, drilling or other suitable methods, wherein the control unit and the drivers are positioned closer to a first side of the panel than to a second side opposite the first side. The drivers and electric devices are partitioned into groups that each comprises one driver that exclusively drives the electric devices in that group.

Abstract translation: 一种矩形形状的面板，包括分布在面板上的多个电气设备，包括微处理器和电源的控制单元，基于从控制单元接收的控制信息和连接控制单元的电线驱动电气设备的驱动器， 驱动器和电气设备，通过切割，锯切，铣削，钻孔或其它合适的方法来移除面板的一个或多个部分来适应面板的形状，其中控制单元和驱动器位于更靠近第一侧 与第一侧相对的第二侧。 驱动器和电气设备被分成组，每个组包括专门驱动该组中的电气设备的一个驱动器。

公开(公告)号：US20160329774A1

公开(公告)日：2016-11-10

申请号：US15109832

申请日：2014-05-22

Applicant: MITSUBISHI ELECTRIC CORPORATION

Inventor： Rei ARAKI ,  Yu KAWANO ,  Yoshihito ASAO

IPC: H02K5/24 ,  H02K11/33 ,  H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H02K11/21 ,  H02K11/25

CPC classification number: H02K5/24 ,  H02K11/21 ,  H02K11/25 ,  H02K11/33 ,  H05K1/0201 ,  H05K1/0216 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/09972 ,  H05K2201/1009 ,  H05K2201/10507

Abstract: A board includes a separating zone in an area closer to the edge than to the center of the board, the separating zone including one elongated through hole. A first group of electronic components that is a source of heat or electric noise is placed in a first area on the center side with respect to the separating zone of the board. On the other hand, a second group of electronic components from which influence of heat or electric noise from other components needs to be eliminated to a maximum extent is placed in a second area on the edge side with respect to the separating zone of the board.

Abstract translation: 板包括在靠近边缘的区域比板的中心更远的区域，分离区包括一个细长的通孔。 作为热或电噪声源的第一组电子部件被放置在相对于电路板的分离区域的中心侧的第一区域中。 另一方面，从第二组电子部件放置到相对于电路板的分离区域的边缘侧的第二区域中，来自其他部件的热或电噪声的影响需要最大程度地消除。

公开(公告)号：US09490766B2

公开(公告)日：2016-11-08

申请号：US14180119

申请日：2014-02-13

Applicant: UT-Battelle, LLC

Inventor： Roger Allen Kisner ,  David Lee Fugate

IPC: H03H7/01 ,  H03H1/00 ,  H05K1/02 ,  H05K3/00

CPC classification number: H03H1/0007 ,  H03H7/0115 ,  H03H2001/0021 ,  H03H2001/0028 ,  H05K1/0209 ,  H05K1/0233 ,  H05K3/0061 ,  H05K2201/09972 ,  H05K2201/1006 ,  H05K2201/10219

Abstract: Electromagnetic interference (EMI) noise filter embodiments and methods for filtering are provided herein. EMI noise filters include multiple signal exclusion enclosures. The multiple signal exclusion enclosures contain filter circuit stages. The signal exclusion enclosures can attenuate noise generated external to the enclosures and/or isolate noise currents generated by the corresponding filter circuits within the enclosures. In certain embodiments, an output of one filter circuit stage is connected to an input of the next filter circuit stage. The multiple signal exclusion enclosures can be chambers formed using conductive partitions to divide an outer signal exclusion enclosure. EMI noise filters can also include mechanisms to maintain the components of the filter circuit stages at a consistent temperature. For example, a metal base plate can distribute heat among filter components, and an insulating material can be positioned inside signal exclusion enclosures.

Abstract translation: 本文提供电磁干扰（EMI）噪声滤波器实施例和滤波方法。 EMI噪声滤波器包括多个信号排除外壳。 多信号排除外壳包含滤波电路级。 信号排除外壳可以衰减外壳产生的噪声和/或隔离由外壳内的相应的滤波器电路产生的噪声电流。 在某些实施例中，一个滤波器电路级的输出连接到下一个滤波器电路级的输入端。 多个信号排除外壳可以是使用导电隔板形成的腔室，以分隔外部信号排除罩。 EMI噪声滤波器还可以包括将滤波器电路的部件级保持在恒定温度的机构。 例如，金属基板可以在过滤器部件之间分配热量，并且绝缘材料可以位于信号排除外壳内。