Micro mirror arrays and microstructures with solderable connection sites
    1.
    发明申请
    Micro mirror arrays and microstructures with solderable connection sites 失效
    具有可焊接连接点的微镜阵列和微结构

    公开(公告)号:US20050013533A1

    公开(公告)日:2005-01-20

    申请号:US10620119

    申请日:2003-07-15

    CPC classification number: B81C1/0023 B81B2201/042 G02B26/0841

    Abstract: A micro mirror array including an upper wafer portion having a plurality of movable reflective surfaces located thereon, the upper wafer portion defining a coverage area in top view. The array further includes a lower wafer portion located generally below and coupled to the upper wafer portion. The lower wafer portion includes at least one connection site located thereon, the at least one connection site being electrically or operatively coupled to at least one component which can control the movement of at least one of the reflective surfaces. The at least one connection site is not generally located within the coverage area of the upper wafer portion.

    Abstract translation: 一种微镜阵列,包括具有位于其上的多个可移动反射表面的上晶片部分,上晶片部分在顶视图中限定覆盖区域。 该阵列还包括下部晶片部分,该下部晶片部分大致位于上部晶片部分下方并耦合到该上部晶片部分。 下晶片部分包括位于其上的至少一个连接部位,所述至少一个连接部位电连接或可操作地耦合到至少一个可控制至少一个反射表面的部件的部件。 至少一个连接位置通常不位于上晶片部分的覆盖区域内。

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