PHOTOSENSITIVE POLYIMIDE COMPOSITION, POLYIMIDE FILM AND SEMICONDUCTOR DEVICE USING THE SAME
    1.
    发明申请
    PHOTOSENSITIVE POLYIMIDE COMPOSITION, POLYIMIDE FILM AND SEMICONDUCTOR DEVICE USING THE SAME 失效
    感光性聚酰亚胺组合物,聚酰亚胺膜和使用其的半导体器件

    公开(公告)号:US20080187867A1

    公开(公告)日:2008-08-07

    申请号:US11861948

    申请日:2007-09-26

    Abstract: A photosensitive polyimide composition, a polyimide film, and a semiconductor device using the same are disclosed. The photosensitive polyimide composition can be cured by heating. A polyhydroxyimide is used as a base resin and can be mixed with a photoacid generator and a cross-linking agent having two or more vinylether groups. A film of the photosensitive polyimide composition can be developed by treatment with an alkaline aqueous solution. Embodiments of the invention enable improvement in production yield and reliability in a highly-integrated memory semiconductor packaging processes.

    Abstract translation: 公开了光敏聚酰亚胺组合物,聚酰亚胺膜和使用其的半导体器件。 感光性聚酰亚胺组合物可以通过加热固化。 使用聚羟基酰亚胺作为基础树脂,并且可以与光酸产生剂和具有两个或更多个乙烯基醚基团的交联剂混合。 感光性聚酰亚胺组合物的膜可以通过用碱性水溶液处理而显影。 本发明的实施例能够在高度集成的存储器半导体封装工艺中提高生产成品率和可靠性。

    Photosensitive polyimide composition, polyimide film and semiconductor device using the same
    3.
    发明授权
    Photosensitive polyimide composition, polyimide film and semiconductor device using the same 失效
    光敏聚酰亚胺组合物,聚酰亚胺膜和使用其的半导体器件

    公开(公告)号:US07745096B2

    公开(公告)日:2010-06-29

    申请号:US11861948

    申请日:2007-09-26

    Abstract: A photosensitive polyimide composition, a polyimide film, and a semiconductor device using the same are disclosed. The photosensitive polyimide composition can be cured by heating. A polyhydroxyimide is used as a base resin and can be mixed with a photoacid generator and a cross-linking agent having two or more vinylether groups. A film of the photosensitive polyimide composition can be developed by treatment with an alkaline aqueous solution. Embodiments of the invention enable improvement in production yield and reliability in a highly-integrated memory semiconductor packaging processes.

    Abstract translation: 公开了光敏聚酰亚胺组合物,聚酰亚胺膜和使用其的半导体器件。 感光性聚酰亚胺组合物可以通过加热固化。 使用聚羟基酰亚胺作为基础树脂,并且可以与光酸产生剂和具有两个或更多个乙烯基醚基团的交联剂混合。 感光性聚酰亚胺组合物的膜可以通过用碱性水溶液处理而显影。 本发明的实施例能够在高度集成的存储器半导体封装工艺中提高生产成品率和可靠性。

    Method of speech recognition using variational inference with switching state space models
    4.
    发明授权
    Method of speech recognition using variational inference with switching state space models 失效
    使用与开关状态空间模型的变分推理的语音识别方法

    公开(公告)号:US07487087B2

    公开(公告)日:2009-02-03

    申请号:US10984609

    申请日:2004-11-09

    CPC classification number: G10L15/14

    Abstract: A method is developed which includes 1) defining a switching state space model for a continuous valued hidden production-related parameter and the observed speech acoustics, and 2) approximating a posterior probability that provides the likelihood of a sequence of the hidden production-related parameters and a sequence of speech units based on a sequence of observed input values. In approximating the posterior probability, the boundaries of the speech units are not fixed but are optimally determined. Under one embodiment, a mixture of Gaussian approximation is used. In another embodiment, an HMM posterior approximation is used.

    Abstract translation: 开发了一种方法,其包括:1)定义用于连续值隐藏生产相关参数和观察到的语音声学的切换状态空间模型,以及2)近似提供隐藏生产相关参数序列的可能性的后验概率 以及基于观察到的输入值的序列的语音单元序列。 在逼近后验概率中,语音单元的边界不是固定的,而是被最佳确定。 在一个实施例中,使用高斯近似的混合。 在另一个实施例中,使用HMM后验近似。

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