公开(公告)号：US08368085B2

公开(公告)日：2013-02-05

申请号：US12903116

申请日：2010-10-12

Applicant: Hung-Chin Lin ,  Kuo-Fu Peng ,  Chien-Min Chen ,  Ko-Wei Chien

Inventor： Hung-Chin Lin ,  Kuo-Fu Peng ,  Chien-Min Chen ,  Ko-Wei Chien

IPC: H01L27/15 ,  H01L33/00

CPC classification number: H01L33/64 ,  H01L33/486 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor package includes at least four lead frames each having an extending portion and a connecting portion, a heat dissipation plate having a top surface and a bottom surface, at least one semiconductor chip positioned on the top surface of the heat dissipation plate. At least one conductive wire electrically connects the chip to the lead frames. An encapsulation covers the lead frames, the heat dissipation plate, the semiconductor chip, and the conductive wires, while the bottom surface of the heat dissipation plate and the extending portions of the lead frames are exposed.

Abstract translation: 半导体封装包括至少四个引线框架，每个引线框架具有延伸部分和连接部分，散热板具有顶表面和底表面，至少一个半导体芯片位于散热板的顶表面上。 至少一根导线将芯片电连接到引线框架。 封装覆盖引线框架，散热板，半导体芯片和导线，同时散热板的底表面和引线框架的延伸部分露出。

公开(公告)号：US20110156085A1

公开(公告)日：2011-06-30

申请号：US12903116

申请日：2010-10-12

Applicant: HUNG-CHIN LIN ,  KUO-FU PENG ,  CHIEN-MIN CHEN ,  KO-WEI CHIEN

Inventor： HUNG-CHIN LIN ,  KUO-FU PENG ,  CHIEN-MIN CHEN ,  KO-WEI CHIEN

IPC: H01L33/52 ,  H01L23/495

CPC classification number: H01L33/64 ,  H01L33/486 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor package includes at least four lead frames each having an extending portion and a connecting portion, a heat dissipation plate having a top surface and a bottom surface, at least one semiconductor chip positioned on the top surface of the heat dissipation plate. At least one conductive wire electrically connects the chip to the lead frames. An encapsulation covers the lead frames, the heat dissipation plate, the semiconductor chip, and the conductive wires, while the bottom surface of the heat dissipation plate and the extending portions of the lead frames are exposed.

Abstract translation: 半导体封装包括至少四个引线框架，每个引线框架具有延伸部分和连接部分，散热板具有顶表面和底表面，至少一个半导体芯片位于散热板的顶表面上。 至少一根导线将芯片电连接到引线框架。 封装覆盖引线框架，散热板，半导体芯片和导线，同时散热板的底表面和引线框架的延伸部分露出。