公开(公告)号：US12125960B2

公开(公告)日：2024-10-22

申请号：US18150516

申请日：2023-01-05

Applicant: InnoLux Corporation

Inventor： Tsung-Han Tsai ,  Kuan-Feng Lee ,  Yuan-Lin Wu

IPC: H01L33/62 ,  H01L25/075 ,  H01L25/16 ,  H01L27/12 ,  H01L33/06 ,  H01L33/32 ,  H01L33/50 ,  H01L33/54 ,  H01L33/60 ,  H01L23/31 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/1214 ,  H01L33/06 ,  H01L33/32 ,  H01L33/505 ,  H01L33/54 ,  H01L33/60 ,  H01L23/3185 ,  H01L33/486 ,  H01L33/507

Abstract: An electronic device is provided. The electronic device includes a substrate, a driving circuit, a diode and a light shielding element. The driving circuit is disposed on the substrate. The diode is electrically connected to the driving circuit. The light shielding element overlaps the substrate. A surface of the light shielding element has a first width. A cross-sectional-surface of a portion of the light shielding element has a second width. In addition, the second width is greater than the first width in a cross-sectional view, and the surface is closer to the substrate than the cross-sectional surface of the portion.

公开(公告)号：US12125953B2

公开(公告)日：2024-10-22

申请号：US17456556

申请日：2021-11-24

Applicant: NICHIA CORPORATION

Inventor： Shimpei Sasaoka ,  Toshiyuki Hashimoto ,  Toshinobu Katsumata ,  Naoya Kashiwagi

IPC: H01L33/54 ,  H01L33/00 ,  H01L33/48 ,  H01L33/56

CPC classification number: H01L33/54 ,  H01L33/005 ,  H01L33/486 ,  H01L33/56 ,  H01L2933/005

Abstract: A method for manufacturing a light emitting device according to the present invention includes: providing an intermediate member including: a support member including: housing portions, the housing portions having first recessed portion(s) each having a lateral wall and a bottom surface, and a coupling portion located between adjacent ones of the housing portions and having a height lower than a height of the lateral wall with reference to the bottom surface of the first recessed portion, a light source mounted on the bottom surface of the first recessed portion, and an encapsulant disposed in the first recessed portion; and forming a first light-transmissive member continuously covering the housing portions and the coupling portion. An inclined surface of the first light-transmissive member has a height above the coupling portion is lower than a height above the housing portions with reference to the bottom surface of the first recessed portion.

公开(公告)号：US12113151B2

公开(公告)日：2024-10-08

申请号：US18535178

申请日：2023-12-11

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Namgoo Cha ,  Sangmin Kim ,  Jung Hwan Ahn ,  Jae Hee Lim

IPC: H01L33/38 ,  H01L27/15 ,  H01L33/48 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62

CPC classification number: H01L33/38 ,  H01L27/156 ,  H01L33/486 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62

Abstract: A unit pixel includes a transparent substrate, a plurality of light emitting devices arranged on the transparent substrate, and an optical layer disposed between the light emitting devices and the transparent substrate and transmitting light emitted from the light emitting devices. The transparent substrate has a concavo-convex pattern on a surface facing the light emitting devices.

公开(公告)号：US12107195B2

公开(公告)日：2024-10-01

申请号：US18098030

申请日：2023-01-17

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Chi Hyun In ,  Jun Yong Park ,  Kyu Ho Lee ,  Dae Woong Suh ,  Jong Hyeon Chae ,  Chang Hoon Kim ,  Sung Hyun Lee

IPC: H01L33/48 ,  H01L33/20 ,  H01L33/44 ,  H01L33/50 ,  H01L33/62

CPC classification number: H01L33/486 ,  H01L33/20 ,  H01L33/44 ,  H01L33/505 ,  H01L33/62 ,  H01L2224/16 ,  H01L2933/0033

Abstract: A light emitting diode, including a first type semiconductor layer, an active layer, and a second type semiconductor layer; an ohmic contact layer disposed on the second type semiconductor layer; a first insulating layer disposed on the semiconductor structure and including a first opening overlapping the first type semiconductor layer and a second opening overlapping the ohmic contact layer; a first connection wiring disposed on the first insulating layer, the first connection wiring having a first portion and a second portion; and a second connection wiring disposed on the first insulating layer and spaced apart from the first connection wiring, the second connection wiring electrically connected to the second type semiconductor layer through the second opening. The second connection wiring surrounds at least a portion of the first portion of the first connection wiring in a plan view.

公开(公告)号：US12107194B2

公开(公告)日：2024-10-01

申请号：US17417904

申请日：2019-12-27

Applicant: WAVELORD CO., LTD.

Inventor： Sang Jeong An

IPC: H01L33/48 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64

CPC classification number: H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/647 ,  H01L33/641

Abstract: Disclosed is a semiconductor light emitting device comprising a semiconductor light emitting chip having electrodes; a mold, which has a first surface roughness and includes a bottom portion where the semiconductor light emitting chip is arranged and through holes formed in the bottom portion, with the through holes being comprised of a surface having a second surface roughness different from the first surface roughness, wherein at least one side of the mold facing the semiconductor light emitting chip is made of a material capable of reflecting at least 95% of light emitted by the semiconductor light emitting chip; and conductive parts provided in the through holes for electrical communication with the electrodes.

公开(公告)号：US12105288B2

公开(公告)日：2024-10-01

申请号：US17377629

申请日：2021-07-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongsup Song ,  Taehyun Lee

IPC: G02B27/01 ,  F21V8/00 ,  G02B25/00 ,  G02B26/00 ,  H01L27/15 ,  H01L33/48 ,  H01L33/62

CPC classification number: G02B27/0172 ,  G02B6/0076 ,  G02B25/001 ,  G02B26/00 ,  H01L27/153 ,  H01L33/486 ,  H01L33/62 ,  G02B2027/014 ,  G02B2027/0178

Abstract: Augmented reality glasses include a left eye lens part and a right eye lens part, each of the left eye lens part and the right eye lens part having a display area configured to display an augmented reality image, and a tracking area surrounding the display area, the tracking area including a plurality of light emission parts configured to emit light having a wavelength in an infrared band, and a frame including a left eye lens support area, a right eye lens support area, and a nose bridge connecting the left lens support area and the right lens support area, the left eye lens support area supporting the left eye lens part, and the right eye lens support area supporting the right eye lens part.

公开(公告)号：US12100693B2

公开(公告)日：2024-09-24

申请号：US18067186

申请日：2022-12-16

Applicant: CreeLED, Inc.

Inventor： Charles Chak Hau Pang ,  Victor Yue Kwong Lau ,  Tiancai Su

IPC: H01L33/64 ,  H01L25/075 ,  H01L25/13 ,  H01L33/48 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L25/13 ,  H01L33/486 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L33/647

Abstract: LED packages are disclosed capable of emitting a range of colors including white light, while still emitting that can have a high color rendering index (CRI). The LED packages can have a simplified reflective cup arrangement and improved lead frame design. The LED packages according to the present invention comprise one or more LED WITH PHOSPHORs for high CRI lighting applications, along with multiple narrowband emitters (e.g. RGB LEDs), but do not have a dam or partition to segregate the LED WITH PHOSPHOR from the multiple emitters. This results in a LED package that is less complex and easier to manufacture, while still providing the desired flexibility in LED package emissions.

公开(公告)号：US12095224B2

公开(公告)日：2024-09-17

申请号：US17427955

申请日：2020-01-17

Applicant: Sony Group Corporation

Inventor： Kei Satou ,  Jugo Mitomo

IPC: H01S5/0237 ,  H01L33/48 ,  H01S5/02253 ,  H01S5/42

CPC classification number: H01S5/0237 ,  H01L33/486 ,  H01S5/02253 ,  H01S5/423

Abstract: A light emitting element assembly includes: a light emitting element (21); a light emitting element drive unit (30); a first joining member (41) connected to an electrode provided in the light emitting element (21); and a second joining member (42) provided on the light emitting element drive unit (30). In the light emitting element assembly, one of the first joining member (41) and the second joining member (42) includes an alloy material, the other one of the first joining member (41) and the second joining member (42) includes a metallic material, the joining member (the second joining member (42)) including the alloy material includes a first portion (43) and a second portion (44), the joining member (the first joining member (41)) including the metallic material and the first portion (43) are joined to each other, and the second portion (44) is provided on the light emitting element drive unit (30) between the light emitting element (21) and the light emitting element drive unit (30), and is in contact with the light emitting element (21).

公开(公告)号：US12087896B2

公开(公告)日：2024-09-10

申请号：US18056034

申请日：2022-11-16

Applicant: ROHM CO., LTD.

Inventor： Tomoichiro Toyama

IPC: H01L33/62 ,  H01L23/00 ,  H01L33/48 ,  H01L33/56

CPC classification number: H01L33/62 ,  H01L24/45 ,  H01L33/486 ,  H01L33/56

Abstract: Semiconductor light-emitting device, includes: substrate having base and conductive part; first to third semiconductor light-emitting elements; first to third wires connected to the first to third semiconductor light-emitting elements respectively; and light-transmitting resin part covering the first to the third semiconductor light-emitting elements, wherein the base has main and rear surfaces facing opposite sides in thickness direction of the base, wherein the conductive part includes main surface part on the main surface, wherein the main surface part includes main surface first part where the first and second semiconductor light-emitting elements are mounted, wherein the main surface first part reaches both ends of the main surface in first direction perpendicular to the thickness direction, and wherein the main surface first part is separated from both the main surface part where the third semiconductor light-emitting element is mounted and the main surface part where the first, second, and third wires are connected.

公开(公告)号：US20240297284A1

公开(公告)日：2024-09-05

申请号：US18270801

申请日：2021-12-06

Applicant: LG ELECTRONICS INC.

Inventor： Daewoon HONG ,  Taehyun KIM ,  Dahye KIM ,  Sangtae PARK

IPC: H01L33/62 ,  H01L25/075 ,  H01L27/12 ,  H01L33/48 ,  H01L33/54

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L27/124 ,  H01L33/486 ,  H01L33/54

Abstract: A light-emitting device package may comprise: a drive part which has a first pad and a second pad disposed at one surface thereof, the second pad being electrically connected to a light-emitting device, and controls driving of the light-emitting device; the light-emitting device disposed on the second pad; and a bonding part, wherein the light-emitting device and the bonding part may be disposed together on one surface of the drive part.