公开(公告)号：US08384113B2

公开(公告)日：2013-02-26

申请号：US13306815

申请日：2011-11-29

Applicant: Chester Kuo ,  Hung-Chin Lin

Inventor： Chester Kuo ,  Hung-Chin Lin

IPC: H01L33/60 ,  H01L33/58 ,  H01L33/64 ,  H01L33/50

CPC classification number: H01L33/642 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2933/0058 ,  H01L2924/00014

Abstract: A photoelectric device includes a ceramic substrate defining a cavity in a top thereof and having two electrode layers beside the cavity. A photoelectric die is received in the cavity. A first packing layer is received in the cavity and encapsulates the photoelectric die. The photoelectric die is electrically connected with the electrode layers via two wires. A reflective cup is mounted on the ceramic substrate and defines a receiving space above the top of the ceramic substrate and the first packing layer. A second packing layer is received in the receiving space and covers the first packing layer.

Abstract translation: 光电器件包括陶瓷衬底，该陶瓷衬底在其顶部中限定空腔并且在空腔旁边具有两个电极层。 光电管芯被容纳在腔内。 第一包装层被容纳在腔中并封装光电管芯。 光电管芯通过两条电线与电极层电连接。 反射杯安装在陶瓷基板上，并且在陶瓷基板的顶部和第一包装层之上限定了一个接收空间。 第二包装层被容纳在接收空间中并覆盖第一包装层。

公开(公告)号：US08368085B2

公开(公告)日：2013-02-05

申请号：US12903116

申请日：2010-10-12

Applicant: Hung-Chin Lin ,  Kuo-Fu Peng ,  Chien-Min Chen ,  Ko-Wei Chien

Inventor： Hung-Chin Lin ,  Kuo-Fu Peng ,  Chien-Min Chen ,  Ko-Wei Chien

IPC: H01L27/15 ,  H01L33/00

CPC classification number: H01L33/64 ,  H01L33/486 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor package includes at least four lead frames each having an extending portion and a connecting portion, a heat dissipation plate having a top surface and a bottom surface, at least one semiconductor chip positioned on the top surface of the heat dissipation plate. At least one conductive wire electrically connects the chip to the lead frames. An encapsulation covers the lead frames, the heat dissipation plate, the semiconductor chip, and the conductive wires, while the bottom surface of the heat dissipation plate and the extending portions of the lead frames are exposed.

Abstract translation: 半导体封装包括至少四个引线框架，每个引线框架具有延伸部分和连接部分，散热板具有顶表面和底表面，至少一个半导体芯片位于散热板的顶表面上。 至少一根导线将芯片电连接到引线框架。 封装覆盖引线框架，散热板，半导体芯片和导线，同时散热板的底表面和引线框架的延伸部分露出。

公开(公告)号：US08093078B2

公开(公告)日：2012-01-10

申请号：US12879206

申请日：2010-09-10

Applicant: Chester Kuo ,  Hung Chin Lin

Inventor： Chester Kuo ,  Hung Chin Lin

IPC: H01L21/00

CPC classification number: H01L33/642 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2933/0058 ,  H01L2924/00014

Abstract: A method for fabricating a photoelectric device initially provides a ceramic substrate comprising a thermal dissipation layer on a bottom layer of the ceramic substrate, an electrode layer on the top surface of the ceramic substrate, and a reflective structure in cavities of the ceramic substrate. Next, a plurality of photoelectric dies is disposed on the top surface of the ceramic substrate. Then, a first packaging layer is formed on the top surfaces of the photoelectric dies. Next, the ceramic substrate is placed between an upper mold and a lower mold. Finally, a plurality of lenses is formed on the top surface of the first packaging layer by using an injection molding technique or a transfer molding technique.

Abstract translation: 一种制造光电装置的方法最初提供了一种陶瓷基片，该陶瓷基片包括陶瓷基片的底层上的散热层，陶瓷基片顶表面上的电极层和陶瓷基片的空腔中的反射结构。 接着，在陶瓷基板的上表面上配置多个光电管。 然后，在光电管芯的上表面上形成第一包装层。 接下来，将陶瓷基板放置在上模和下模之间。 最后，通过使用注塑技术或传递模塑技术在第一包装层的顶表面上形成多个透镜。

公开(公告)号：US20070114740A1

公开(公告)日：2007-05-24

申请号：US11476086

申请日：2006-06-28

Applicant: Hung-Chin Lin

Inventor： Hung-Chin Lin

IPC: B62B3/00

CPC classification number: B62B3/001 ,  B62B3/007 ,  Y10T403/32549 ,  Y10T403/32557 ,  Y10T403/32591

Abstract: A steering control coupling structure used in a children's wagon having a wheel assembly and a towing bar is disclosed to include a linking bracket affixed to the wheel axle of the wheel assembly, a first adapter affixed to a carriage and pivoted with the carriage to the linking bracket by a pivot device, the first adapter having a circular coupling hole and two 135° sector guide holes at two sides of the circular coupling hole, and a second adapter, which is affixed to the linking bracket around the pivot device and has a circular coupling block coupled to the circular hole of the first adapter and two 45° sector guide blocks respectively inserted into the 135° sector guide holes for forcing the second adapter to bias against the first adapter when the towing bar is biased to force the wheel assembly to change the steering direction.

Abstract translation: 公开了一种用于具有车轮组件和牵引杆的儿童车中的转向控制联接结构，其包括固定到车轮组件的车轮轴上的连接支架，固定到滑架上并与车架枢转的第一适配器 支架通过枢转装置，第一适配器具有圆形联接孔和在圆形联接孔的两侧的两个135°的扇形导向孔，以及第二适配器，该第二适配器固定在枢转装置周围的连接支架上， 联接块联接到第一适配器的圆形孔和两个45°扇形引导块，分别插入到135°的扇形引导孔中，以迫使第二适配器偏压第一适配器时，当牵引杆被偏置以迫使车轮组件 改变转向方向。

公开(公告)号：US08405096B2

公开(公告)日：2013-03-26

申请号：US12888399

申请日：2010-09-22

Applicant: Chien-Min Chen ,  Ko-Wei Chien ,  Hung-Chin Lin

Inventor： Chien-Min Chen ,  Ko-Wei Chien ,  Hung-Chin Lin

IPC: H01L27/15 ,  H01L31/12 ,  H01L33/00

CPC classification number: H01L33/60 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: An LED package structure includes an LED die, a lead frame and a housing connecting to the lead frame. The LED die is located on a surface of the lead frame. The housing includes an inner face surrounding the LED die. The inner face has a bottom edge connected to the surface of the lead frame, a top edge and a waist line between the bottom edge and top edge. The bottom edge surrounds an area less than an area surrounded by the waist line. The area surrounded by the waist line is less than an area surrounded by the top edge. The inner face has a curved surface between the waist line and the bottom edge.

Abstract translation: LED封装结构包括LED管芯，引线框架和连接到引线框架的壳体。 LED管芯位于引线框架的表面上。 壳体包括围绕LED管芯的内表面。 内表面具有连接到引线框架的表面的底边缘，底边缘和顶边之间的上边缘和腰线。 底部边缘围绕小于由腰围包围的区域的区域。 由腰围包围的区域小于由顶部边缘包围的区域。 内表面在腰线和底边之间具有弯曲表面。

公开(公告)号：US20110156085A1

公开(公告)日：2011-06-30

申请号：US12903116

申请日：2010-10-12

Applicant: HUNG-CHIN LIN ,  KUO-FU PENG ,  CHIEN-MIN CHEN ,  KO-WEI CHIEN

Inventor： HUNG-CHIN LIN ,  KUO-FU PENG ,  CHIEN-MIN CHEN ,  KO-WEI CHIEN

IPC: H01L33/52 ,  H01L23/495

CPC classification number: H01L33/64 ,  H01L33/486 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor package includes at least four lead frames each having an extending portion and a connecting portion, a heat dissipation plate having a top surface and a bottom surface, at least one semiconductor chip positioned on the top surface of the heat dissipation plate. At least one conductive wire electrically connects the chip to the lead frames. An encapsulation covers the lead frames, the heat dissipation plate, the semiconductor chip, and the conductive wires, while the bottom surface of the heat dissipation plate and the extending portions of the lead frames are exposed.

Abstract translation: 半导体封装包括至少四个引线框架，每个引线框架具有延伸部分和连接部分，散热板具有顶表面和底表面，至少一个半导体芯片位于散热板的顶表面上。 至少一根导线将芯片电连接到引线框架。 封装覆盖引线框架，散热板，半导体芯片和导线，同时散热板的底表面和引线框架的延伸部分露出。

公开(公告)号：US20100049181A1

公开(公告)日：2010-02-25

申请号：US12540097

申请日：2009-08-12

Applicant: HUNG CHIN LIN ,  CHIA CHEN CHANG

Inventor： HUNG CHIN LIN ,  CHIA CHEN CHANG

IPC: A61B18/18 ,  A61N5/06

CPC classification number: A61B18/04 ,  A61B18/203 ,  A61B2018/00452 ,  A61B2018/0047 ,  A61B2018/00476 ,  A61N5/06 ,  A61N2005/0651

Abstract: A medical light device includes a main body, a light source, a filler, and a contact part. A cavity, receiving a light source, is disposed on the main body. The filler is composed of transparent material, filled inside the cavity, and covers the light source. The contact part, composed of soft and transparent material, is placed adjacent to the filler, covering the surface of the filler. The refractive index difference between the contact part and the filler is smaller than the refractive index difference between the filler and air.

Abstract translation: 医疗灯装置包括主体，光源，填充物和接触部。 接收光源的空腔设置在主体上。 填料由透明材料组成，填充在腔内，并覆盖光源。 由软和透明材料组成的接触部分与填料相邻放置，覆盖填料表面。 接触部分和填料之间的折射率差小于填料和空气之间的折射率差。

公开(公告)号：US06845548B1

公开(公告)日：2005-01-25

申请号：US10660714

申请日：2003-09-12

Applicant: Hung-Chin Lin

Inventor： Hung-Chin Lin

IPC: A42B3/22 ,  A44B11/25 ,  A44B17/00 ,  A45F5/02

CPC classification number: A42B3/185 ,  A44B11/258 ,  A44D2205/00 ,  Y10T24/1371 ,  Y10T24/1385 ,  Y10T24/3424 ,  Y10T24/4084 ,  Y10T24/45581 ,  Y10T24/4736

Abstract: A buckle assembly for mounting a goggle on a helmet. The goggle is connected with a strap. The buckle assembly includes a first buckle having a main body. The strap is connected at an end of the main body. A buckling portion is formed on the main body. The buckling portion forms a buckling hole and a buckling flange, and a grip portion is connected to another end of the main body. A second buckle includes a main plate and a locating portion, a buckling portion which is formed of catch plates which can be bent inwards and outwards, and a claw is outwardly disposed on each catch plate for catching the buckling flange of the first buckle. A buckle locator includes a base, a locating portion for connecting the locating portion of the second buckle, and allocating portion for connecting the helmet.

Abstract translation: 用于将护目镜安装在头盔上的带扣组件。 护目镜与皮带连接。 带扣组件包括具有主体的第一带扣。 带子连接在主体的一端。 在主体上形成有弯曲部。 弯曲部分形成一个弯曲孔和一个弯曲的凸缘，并且把手部分连接到主体的另一端。 第二带扣包括主板和定位部分，由可向内和向外弯曲的卡扣板形成的弯曲部分，并且爪被向外设置在每个卡扣板上，用于抓住第一扣环的弯曲凸缘。 带扣定位器包括基座，用于连接第二带扣的定位部分的定位部分和用于连接头盔的分配部分。

公开(公告)号：US20110095316A1

公开(公告)日：2011-04-28

申请号：US12888399

申请日：2010-09-22

Applicant: CHIEN-MIN CHEN ,  KO-WEI CHIEN ,  HUNG-CHIN LIN

Inventor： CHIEN-MIN CHEN ,  KO-WEI CHIEN ,  HUNG-CHIN LIN

IPC: H01L33/60 ,  H01L33/48

CPC classification number: H01L33/60 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: An LED package structure includes an LED die, a lead frame and a housing connecting to the lead frame. The LED die is located on a surface of the lead frame. The housing includes an inner face surrounding the LED die. The inner face has a bottom edge connected to the surface of the lead frame, a top edge and a waist line between the bottom edge and top edge. The bottom edge surrounds an area less than an area surrounded by the waist line. The area surrounded by the waist line is less than an area surrounded by the top edge. The inner face has a curved surface between the waist line and the bottom edge.

Abstract translation: LED封装结构包括LED管芯，引线框架和连接到引线框架的壳体。 LED管芯位于引线框架的表面上。 壳体包括围绕LED管芯的内表面。 内表面具有连接到引线框架的表面的底边缘，底边缘和顶边之间的上边缘和腰线。 底部边缘围绕小于由腰围包围的区域的区域。 由腰围包围的区域小于由顶部边缘包围的区域。 内表面在腰线和底边之间具有弯曲表面。

公开(公告)号：US20110068358A1

公开(公告)日：2011-03-24

申请号：US12879206

申请日：2010-09-10

Applicant: Chester Kuo ,  Hung Chin Lin

Inventor： Chester Kuo ,  Hung Chin Lin

IPC: H01L33/64 ,  H01L33/08

CPC classification number: H01L33/642 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2933/0058 ,  H01L2924/00014

Abstract: A method for fabricating a photoelectric device initially provides a ceramic substrate comprising a thermal dissipation layer on a bottom layer of the ceramic substrate, an electrode layer on the top surface of the ceramic substrate, and a reflective structure in cavities of the ceramic substrate. Next, a plurality of photoelectric dies is disposed on the top surface of the ceramic substrate. Then, a first packaging layer is formed on the top surfaces of the photoelectric dies. Next, the ceramic substrate is placed between an upper mold and a lower mold. Finally, a plurality of lenses is formed on the top surface of the first packaging layer by using an injection molding technique or a transfer molding technique.

Abstract translation: 一种制造光电装置的方法最初提供了一种陶瓷基片，该陶瓷基片包括陶瓷基片的底层上的散热层，陶瓷基片顶表面上的电极层和陶瓷基片的空腔中的反射结构。 接着，在陶瓷基板的上表面上配置多个光电管。 然后，在光电管芯的上表面上形成第一包装层。 接下来，将陶瓷基板放置在上模和下模之间。 最后，通过使用注塑技术或传递模塑技术在第一包装层的顶表面上形成多个透镜。