公开(公告)号：US08731220B2

公开(公告)日：2014-05-20

申请号：US13325488

申请日：2011-12-14

Applicant: Rui Zhang ,  Lin-lin Wang ,  Zhou Ge ,  Xiao-lin Zhang

Inventor： Rui Zhang ,  Lin-lin Wang ,  Zhou Ge ,  Xiao-lin Zhang

IPC: H04R25/00

CPC classification number: H04R19/005 ,  H04R19/04 ,  H04R31/00 ,  H04R2499/11

Abstract: A MEMS microphone includes a silicon substrate, a diaphragm connected to the silicon substrate, a backplate opposed from the diaphragm for forming an air gap. The backplate defines a plurality of first through holes and a plurality of second through holes surrounded by the first through holes, each of the first through holes being formed by a straight boundary and an arc boundary, the radius of the second boundary being greater than half the width of the first boundary.

Abstract translation: MEMS麦克风包括硅衬底，连接到硅衬底的膜片，与膜片相对的用于形成气隙的背板。 背板限定多个第一通孔和由第一通孔围绕的多个第二通孔，每个第一通孔由直边界和弧边界形成，第二边界的半径大于一半 第一个边界的宽度。

公开(公告)号：US20120294464A1

公开(公告)日：2012-11-22

申请号：US13325488

申请日：2011-12-14

Applicant: Rui Zhang ,  Lin-lin Wang ,  Zhou Ge ,  Xiao-lin Zhang

Inventor： Rui Zhang ,  Lin-lin Wang ,  Zhou Ge ,  Xiao-lin Zhang

IPC: H04R1/00

CPC classification number: H04R19/005 ,  H04R19/04 ,  H04R31/00 ,  H04R2499/11

Abstract: A MEMS microphone includes a silicon substrate, a diaphragm connected to the silicon substrate, a backplate opposed from the diaphragm for forming an air gap. The backplate defines a plurality of first through holes and a plurality of second through holes surrounded by the first through holes, each of the first through holes being formed by a straight boundary and an arc boundary, the radius of the second boundary being greater than half the width of the first boundary.

Abstract translation: MEMS麦克风包括硅衬底，连接到硅衬底的膜片，与膜片相对的用于形成气隙的背板。 背板限定多个第一通孔和由第一通孔围绕的多个第二通孔，每个第一通孔由直边界和弧边界形成，第二边界的半径大于一半 第一个边界的宽度。