Method and device relating to semiconductor components
    1.
    发明授权
    Method and device relating to semiconductor components 有权
    涉及半导体元件的方法和装置

    公开(公告)号:US06300173B1

    公开(公告)日:2001-10-09

    申请号:US09236001

    申请日:1999-01-22

    IPC分类号: H01L2100

    CPC分类号: H01L27/1203

    摘要: A conductor 1 crossing a trench around an electrical component 1 is electrically connected to an isolated intermediate conducting region in order to move the field strength concentrations out of the electrical component and into the intermediate conducting region. This prevents avalanche breakdown occurring in the electrical component.

    摘要翻译: 与电气部件1交叉的导体1电连接到隔离的中间导电区域,以便将电场强度浓度移出电气部件并进入中间导电区域。 这防止在电气部件中发生雪崩击穿。