公开(公告)号：US06868852B2

公开(公告)日：2005-03-22

申请号：US09822606

申请日：2001-04-02

申请人： Paul Gaschke

发明人： Paul Gaschke

IPC分类号： A62B9/00 ,  A62B18/08

CPC分类号： A62B9/003

摘要： A cold weather breathing device that protects the face including the mouth and nostril area from direct exposure to the external environment, prevents a user's goggles from fogging in cold environments, and keeps moist exhaled breath away from the user's face. In a preferred embodiment, the device is configured to provide separate breathing channels for exhaled air from the mouth and nose. To promote ease of cleaning, the breathing device can be attached to a head garment with a simple interlocking design that allows its removal and separate cleaning. The breathing device provides a nose-channel-forming member and mouth disc that are mounted on the head garment and inset into a mouth-channel-forming member which is thus attached to the head garment.

摘要翻译： 保护包括嘴和鼻孔在内的脸部的寒冷天气呼吸装置不会直接暴露于外部环境，防止用户的护目镜在寒冷的环境中起雾，并保持呼吸呼吸远离使用者的脸部。 在优选实施例中，该装置被配置成为从嘴和鼻的呼出空气提供单独的呼吸通道。 为了促进清洁的便利性，呼吸装置可以以简单的互锁设计附着到头部服装上，从而允许其移除和分开的清洁。 呼吸装置提供了一种鼻通道形成构件和口盘，其安装在头部衣服上并插入到通道形成构件中，从而附接到头部衣服。

公开(公告)号：US20070285116A1

公开(公告)日：2007-12-13

申请号：US11743899

申请日：2007-05-03

申请人： Paul Aube ,  Normand Cote ,  Roger Gamache ,  David Gardell ,  Paul Gaschke ,  Marc Knox ,  Denis Turcotte

发明人： Paul Aube ,  Normand Cote ,  Roger Gamache ,  David Gardell ,  Paul Gaschke ,  Marc Knox ,  Denis Turcotte

IPC分类号： G01R31/02

CPC分类号： G01R31/2875 ,  G01R31/2867 ,  G01R31/2868

摘要： A method, system and apparatus for testing an integrated circuit chip. The system including: means for forming a liquid polyalphaolefine layer on a bottom surface of the integrated circuit chip, a top surface of the integrated circuit chip having and a bottom surface not having signal and power pads; means for placing a surface of a heat sink into physical contact with the bottom surface of the polyalphaolefine layer; means for electrically coupling the integrated circuit chip to a tester; means for electrically testing the integrated circuit chip; means for electrically de-coupling the integrated circuit chip from the tester; means for removing the heat sink from contact with the polyalphaolefine layer, all or a portion of the polyalphaolefine layer remaining on the bottom surface of the integrated circuit chip; and means for removing the polyalphaolefine layer from the bottom surface of the integrated circuit chip.

摘要翻译： 一种用于测试集成电路芯片的方法，系统和装置。 该系统包括：用于在集成电路芯片的底表面上形成液体聚α-烯烃层的装置，集成电路芯片的顶表面和没有信号和功率垫的底表面; 用于将散热器的表面放置成与聚α-烯烃精细层的底表面物理接触的装置; 用于将集成电路芯片电耦合到测试器的装置; 用于电测试集成电路芯片的装置; 用于将集成电路芯片与测试器电耦合的装置; 用于去除所述散热器与所述聚α-烯烃精氢层接触的装置，所述或部分所述聚α-烯烃精矿层残留在所述集成电路芯片的底表面上; 以及用于从集成电路芯片的底表面去除聚α-烯烃精细层的装置。

公开(公告)号：US20060186909A1

公开(公告)日：2006-08-24

申请号：US10906483

申请日：2005-02-22

申请人： Paul Aube ,  Normand Cote ,  Roger Gamache ,  David Gardell ,  Paul Gaschke ,  Marc Knox ,  Denis Turcotte

发明人： Paul Aube ,  Normand Cote ,  Roger Gamache ,  David Gardell ,  Paul Gaschke ,  Marc Knox ,  Denis Turcotte

IPC分类号： G01R31/02

CPC分类号： G01R31/2875 ,  G01R31/2867 ,  G01R31/2868

摘要： A method, system and apparatus for testing an electronic device. The method including: (a) forming a temporary liquid heat transfer layer on a surface of the electronic device; after step (a), (b) placing a surface of a heat sink into physical contact with a surface of the heat transfer layer; after step (b), (c) electrically testing the electronic device; after step (c), (d) removing the heat sink from contact with the heat transfer layer; and after step (d), (e) removing any heat transfer layer remaining on the electronic device from the surface of the electronic device.

摘要翻译： 一种用于测试电子设备的方法，系统和装置。 该方法包括：（a）在电子设备的表面上形成临时液体传热层; 在步骤（a）之后，（b）将散热片的表面与传热层的表面物理接触; 在步骤（b）之后，（c）电测试电子设备; 在步骤（c）之后，（d）去除散热片与传热层的接触; 并且在步骤（d）之后，（e）从电子设备的表面去除残留在电子设备上的任何传热层。