公开(公告)号：US20240361378A1

公开(公告)日：2024-10-31

申请号：US18765323

申请日：2024-07-07

申请人： HITOP INSTRUMENT (JIANGSU) CO., LTD.

发明人： Dongxi LIU

IPC分类号： G01R31/28

CPC分类号： G01R31/2874 ,  G01R31/2875 ,  G01R31/2877

摘要： A small-sized fast cold and hot shock test device is provided. The device includes a host, a test head used for cold and hot shock to a component under test by temperature control and output of compressed air, and an adjustment device for adjusting a position of the test head. The host includes a control device at least used to send temperature control data to the test head. The test head includes an eddy current mechanism for cooling or heating the compressed air, a heater including an air inlet end and an air outlet end, and a nozzle. The eddy current mechanism includes an air inlet, a cold air outlet, and a hot air outlet. The air inlet is connected with an air supply system through an intake air line unit. The cool air outlet is connected with the air inlet end of the heater.

公开(公告)号：US20240329119A1

公开(公告)日：2024-10-03

申请号：US18621026

申请日：2024-03-28

申请人： Realtek Semiconductor Corp.

发明人： Yu-Chen Hsieh ,  Jian-Ru Lin ,  Tsung-Yen Tsai ,  Yung-Tai Chen ,  Yen-Wei Liu

IPC分类号： G01R31/28 ,  G01R31/317

CPC分类号： G01R31/2875 ,  G01R31/31727

摘要： An IC, comprising: a package; a target circuit; and a heating circuit, configured to receive a heating signal to heat at least testing portion of the target circuit to a first predetermined temperature based on the heating signal. The target circuit and the heating circuit are within the package. An IC testing method using such IC is also disclosed.

公开(公告)号：US12007411B2

公开(公告)日：2024-06-11

申请号：US17354444

申请日：2021-06-22

申请人： Teradyne, Inc.

发明人： John P. Toscano ,  Christopher Bruno ,  David Graziose

IPC分类号： G01R31/28 ,  G01R1/04

CPC分类号： G01R1/0466 ,  G01R1/0458 ,  G01R31/2863 ,  G01R31/2875

摘要： An example test socket for a test system includes a receptacle to make electrical and mechanical connections to a device under test (DUT) and a lid to cover the DUT in the receptacle. The lid is controllable to open automatically to enable receipt of the DUT in the receptacle and, following receipt of the DUT, to close automatically to cover the DUT in the receptacle. Closing the lid applies force to the DUT to complete the electrical and mechanical connections between the test socket and the DUT.

公开(公告)号：US20240183897A1

公开(公告)日：2024-06-06

申请号：US18440191

申请日：2024-02-13

申请人： Advantest Test Solutions, Inc.

发明人： Karthik Ranganathan ,  Aritomo Kikuchi ,  Merlin Wallner ,  Rajan Surve ,  Samer Kabbani ,  Paul Ferrari ,  Ikeda Hiroki ,  Kiyokawa Toshiyuki ,  Gregory Cruzan

IPC分类号： G01R31/28

CPC分类号： G01R31/2875 ,  G01R31/2856 ,  G01R31/2877

摘要： A system for testing circuits of an integrated circuit semiconductor wafer includes a tester system testing the circuits of the wafer and a test stack coupled to the tester system. The test stack includes a wafer probe for contacting a first surface of the wafer and for probing individual circuits of the circuits of the wafer, a wafer scale active thermal interposer layer operable to contact a second surface of the wafer and containing a plurality of thermal zones corresponding to a die layout of the wafer and further operable to selectively heat areas of the wafer. The thermal zones are thermally isolated using a plurality of thermal resistance structures disposed between the thermal zones.

公开(公告)号：US20240142514A1

公开(公告)日：2024-05-02

申请号：US18534693

申请日：2023-12-10

申请人： HITOP INSTRUMENT (JIANGSU) CO., LTD.

发明人： Dongxi LIU

IPC分类号： G01R31/28

CPC分类号： G01R31/2874 ,  G01R31/2875 ,  G01R31/2877

摘要： The present disclosure provides an small-sized fast cold and hot shock test device. The device includes a host, a test head used for cold and hot shock to a component under test by temperature control and output of compressed air, and an adjustment device for adjusting a position of the test head. The host includes a control device at least used to send temperature control data to the test head. The test head includes an eddy current mechanism for cooling or heating the compressed air, a heater including an air inlet end and an air outlet end, and a nozzle. The eddy current mechanism includes an air inlet, a cold air outlet, and a hot air outlet. The air inlet is connected with an air supply system through an intake air line unit. The cool air outlet is connected with the air inlet end of the heater. The nozzle is connected with the air outlet end of the heater.

公开(公告)号：US20240003966A1

公开(公告)日：2024-01-04

申请号：US18203074

申请日：2023-05-30

申请人： Meritech CO., Ltd.

发明人： BYUNG GOOK CHANG ,  JONG JIN PARK ,  SEUNG CHUL CHOI ,  seung nam Kang

IPC分类号： G01R31/28

CPC分类号： G01R31/2863 ,  G01R31/2862 ,  G01R31/2875 ,  G01R31/2877

摘要： Disclosed herein is a burn-in system with a plurality of plugs on test boards, including: a main body (100) which has a test chamber (200) with an open front side; a plurality of test boards (40) on which a plurality of semiconductor chips (90) are mounted and which is mounted in the test chamber (200); a main board which tests the semiconductor chips by exchanging signals with the plurality of semiconductor chips; a door (540) which is provided on the main body (100) to open and close the test chamber (200); and a temperature control means provided inside the main body (100) to heat and cool the test boards (40) mounted inside the test chamber (200).

公开(公告)号：US20230417826A1

公开(公告)日：2023-12-28

申请号：US18036821

申请日：2020-11-30

申请人： ADVANTEST Corporation

发明人： Matthias Werner ,  Takashi Hashimoto

IPC分类号： G01R31/28 ,  G01R35/00

CPC分类号： G01R31/2867 ,  G01R31/2875 ,  G01R31/2877 ,  G01R35/005

摘要： An electronic component handling apparatus pressing the DUT against a socket electrically connected to a tester, includes: a first receiver that receives, from the tester, a first signal indicating a detection value of a temperature detection circuit; a calculator that calculates a temperature of the DUT based on the first signal; a calibrator that calibrates the calculated temperature; a second receiver that receives, from the tester, a second signal that causes the calibrator to start a first calibration; and a temperature adjuster that adjusts the temperature of the DUT. The second receiver receives the second signal before the tester turns on the DUT, once the second signal is received, the calibrator calculates a first calibrated temperature by executing the first calibration with respect to the calculated temperature, and the temperature adjuster adjusts the temperature of the DUT based on the first calibrated temperature.

公开(公告)号：US11796589B1

公开(公告)日：2023-10-24

申请号：US17971505

申请日：2022-10-21

申请人： AEM Holdings Ltd.

发明人： Thomas P. Jones ,  Samer Kabbani ,  Chan See Jean ,  Paul R. Hoffman

IPC分类号： G01R31/28 ,  H05B1/02

CPC分类号： G01R31/2875 ,  H05B1/0233 ,  H05B2203/005

摘要： Disclosed herein are thermal heads and corresponding test systems for independently controlling a one or more components while testing one or more devices under test. In some embodiments, a thermal head comprises a plurality of adapters, one or more heaters, and one or more thermal controllers for independently controlling temperatures of the components. The thermal controllers may control the temperatures of at least some of the components independently such that thermal control of one component does not affect the thermal control of the other component. In some embodiments, the thermal control is by way of one or more cold plates, and the thermal head comprises one or more cold plates. Embodiments of the disclosure further include independent control of one or more forces using one or more force mechanisms.

公开(公告)号：US11774492B2

公开(公告)日：2023-10-03

申请号：US17841491

申请日：2022-06-15

申请人： Advantest Test Solutions, Inc.

发明人： Samer Kabbani ,  Paul Ferrari ,  Ikeda Hiroki ,  Kiyokawa Toshiyuki ,  Gregory Cruzan ,  Karthik Ranganathan ,  Todd Berk ,  Ian Williams ,  Mohammad Ghazvini ,  Tom Jones

IPC分类号： G01R31/28 ,  G01R1/04

CPC分类号： G01R31/2875 ,  G01R1/0458 ,  G01R31/2863 ,  G01R31/2867 ,  G01R31/2874

摘要： A stand-alone active thermal interposer device for use in testing a system-in-package device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.

公开(公告)号：US20230258710A1

公开(公告)日：2023-08-17

申请号：US17836744

申请日：2022-06-09

申请人： Luxsentek Microelectronics Corp.

发明人： CHAO-YANG HSIAO ,  SHENG-CHENG LEE ,  WEN-SHENG LIN ,  CHIH-WEI LIN ,  CHEN-HUA HSI ,  YUEH-HUNG HO

IPC分类号： G01R31/28

CPC分类号： G01R31/2863 ,  G01R31/2875

摘要： The present invention proposes a chip reliability test assembly, which comprises a motherboard and a daughter board. The motherboard is used to support the chips during an aging acceleration process at high temperature. The daughter board is used to measure the electricity of chip after the aging acceleration process. Each chip holder is removable off the motherboard. The daughter board does not go through the aging acceleration process and can be reusable.