Substrate handling and transporting apparatus
    1.
    发明授权
    Substrate handling and transporting apparatus 失效
    基板处理和运输装置

    公开(公告)号:US5020475A

    公开(公告)日:1991-06-04

    申请号:US315723

    申请日:1989-02-24

    IPC分类号: C30B25/02 C30B25/10

    CPC分类号: C30B29/06 C30B25/10

    摘要: A substrate loading subsystem receives substrates from an external source and delivers them to an input port. A substrate pickup transports the substrates serially from the input port to a delivery port of a processing subsystem wherein the substrates are subjected to a reactant gas in a reaction chamber. After completion of the chemical vapor deposition, the substrate pick up serially transports the substrates to an outlet port wherefrom they are off loaded.

    摘要翻译: 衬底加载子系统从外部源接收衬底并将其传送到输入端口。 基板拾取器将基板从输入端口顺序地输送到处理子系统的输送端口,其中基板在反应室中经受反应气体。 在化学气相沉积完成之后,衬底拾取器将衬底串联地输送到出口端口,在那里它们被卸载。

    Wafer edge with light sensor
    2.
    发明授权
    Wafer edge with light sensor 失效
    带光传感器的晶圆边缘

    公开(公告)号:US07235806B2

    公开(公告)日:2007-06-26

    申请号:US10439393

    申请日:2003-05-16

    CPC分类号: H01L21/67259

    摘要: An apparatus for detecting the presence of a substrate that is carried by an end effector of a substrate handling assembly positioned within a substrate processing system comprises a receiving member that is coupled to an end effector and a light sensor that is operatively coupled to the receiving member and is configured to detect an amount light transmitted by the receiving member. In a modified embodiment, the apparatus also includes a transmitting member that receives light from a light source and is also coupled to the end effector.

    摘要翻译: 一种用于检测由位于衬底处理系统内的衬底处理组件的端部执行器承载的衬底的存在的装置,包括耦合到端部执行器的接收构件和可操作地联接到接收构件的光传感器 并且被配置为检测由接收构件发送的光量。 在修改的实施例中,该装置还包括传送构件,其接收来自光源的光并且还耦合到端部执行器。

    Chemical vapor deposition system
    3.
    发明授权
    Chemical vapor deposition system 失效
    化学气相沉积系统

    公开(公告)号:US4828224A

    公开(公告)日:1989-05-09

    申请号:US108771

    申请日:1987-10-15

    摘要: This invention discloses a system for chemically depositing various materials carried by a reactant gas onto substrates for manufacturing semiconductor devices. The system includes special loading and unloading sub-system for placement of substrates to be processed into the system and subsequent extraction without contamination of the system. A special substrate handling sub-system is provided for moving the substrates to and from at least one processing sub-system without physically contacting the planar surfaces of the substrates. The processing sub-system includes a horizontal gas flow reaction chamber having a rotatable susceptor therein for rotating the single substrate supportable thereon about an axis that is normal to the center of the substrate for averaging of the temperature and reactant gas concentration variables. The processing sub-system is separated from the handling sub-system by a special isolation valve and a gas injection device is used to inject the gas into the reaction chamber with a predetermined velocity profile. A special temperature sensing arrangement is provided in the processing sub-system for controlling a radiant heating sub-system which is provided above and below the reaction chamber.

    摘要翻译: 本发明公开了一种用于将由反应气体承载的各种材料化学沉积到用于制造半导体器件的衬底上的系统。 该系统包括专用的装载和卸载子系统,用于将要处理的基板放置在系统中,随后提取而不会污染系统。 提供了一种特殊的基板处理子系统,用于将基板移动到至少一个处理子系统并且从至少一个处理子系统移动,而不物理地接触基板的平面表面。 处理子系统包括水平气流反应室,其中具有可旋转的基座,用于使可支撑在其上的单个基板绕垂直于基板中心的轴线旋转,以平均温度和反应气体浓度变量。 处理子系统通过特殊隔离阀与处理子系统分离,并且气体注入装置用于以预定的速度分布将气体注入反应室。 在处理子系统中设置有用于控制设置在反应室上方和下方的辐射加热子系统的特殊温度检测装置。

    Semiconductor handling robot with improved paddle-type end effector
    4.
    发明授权
    Semiconductor handling robot with improved paddle-type end effector 有权
    具有改进的桨式末端执行器的半导体处理机器人

    公开(公告)号:US07168911B1

    公开(公告)日:2007-01-30

    申请号:US10437207

    申请日:2003-05-13

    IPC分类号: F26B3/08

    CPC分类号: H01L21/67745 H01L21/6838

    摘要: A robotic semiconductor handling system includes two robot arms for transferring substrates between processing, cooling, and storage stations. The first robot arm has a paddle-type end effector adapted such that it can support one substrate at a primary location as well as a second substrate at a secondary staging location. The second robot arm is a Bernoulli-style wand that transfers a substrate from the primary location to the secondary one, and transfers substrates from either location to the process chamber. The use of the dual-location paddle allows for a significant reduction in cycle-time over a single paddle location and a Bernoulli wand system.

    摘要翻译: 机器人半导体处理系统包括用于在处理,冷却和存储站之间传送基板的两个机器人臂。 第一机器人臂具有桨式端部执行器,其适于使得其可以在次级分段位置处支撑主要位置处的一个基板以及第二基板。 第二个机器人手臂是一个伯努利风格的魔杖,将基底从主要位置传递到次要位置,并将衬底从任一位置传送到处理室。 使用双位置桨允许在单个桨位置和伯努利杆系统上显着减少循环时间。

    Semiconductor processing system with gas curtain
    5.
    发明授权
    Semiconductor processing system with gas curtain 失效
    带气幕的半导体处理系统

    公开(公告)号:US5997588A

    公开(公告)日:1999-12-07

    申请号:US729550

    申请日:1996-10-11

    摘要: A gas curtain for use with a semiconductor processing system to prevent unwanted gases from entering a processing chamber. The gas curtain includes both upward and downward flows of gas surrounding an isolation valve adjacent a delivery port into the processing chamber. In the valve open position, the downward flows extends between the valve and the delivery port, and the upward flow extends in an opposite direction behind the isolation valve. In the valve closed position, one of the flows extends through a slot in the isolation valve, while the other flow is directed in an opposite direction on the rear side of the isolation valve. In a method of using the gas curtain apparatus, a pick-up wand operating on a Bernoulli principal uses gases which are unwanted in the processing chamber, and just prior to loading wafers into the processing chamber, the gas flow in the Bernoulli wand is switched from a first gas to a second gas. Desirably, the second gas is hydrogen. The Bernoulli wand passes through the gas curtain before entering the processing chamber to remove any fugitive particles, moisture and unwanted gases. An exhaust located proximate to an input/output chamber creates a continuous pressure gradient in the handling chamber toward the input/output chamber further helping to prevent unwanted gases from entering the processing chamber.

    摘要翻译: 一种与半导体处理系统一起使用以防止不需要的气体进入处理室的气幕。 气幕包括邻近进入处理室的输送口的隔离阀周围的向上和向下的气体流。 在阀打开位置,向下的流动在阀和输送口之间延伸,并且向上的流沿隔离阀的相反方向延伸。 在阀关闭位置,其中一个流动延伸通过隔离阀中的槽,而另一个流在隔离阀的后侧上以相反的方向被引导。 在使用气幕装置的方法中,在伯努利主体上操作的拾取棒使用在处理室中不需要的气体,并且在将晶片装入处理室之前,在伯努利棒中的气流被切换 从第一气体到第二气体。 期望地,第二气体是氢气。 伯努利魔杖在进入处理室之前通过气帘,以除去任何流淌的颗粒,水分和不需要的气体。 位于输入/输出室附近的废气在处理室中朝向输入/输出室产生连续的压力梯度,进一步有助于防止不需要的气体进入处理室。

    Semiconductor handling robot with improved paddle-type end effector
    7.
    发明授权
    Semiconductor handling robot with improved paddle-type end effector 有权
    具有改进的桨式末端执行器的半导体处理机器人

    公开(公告)号:US06585478B1

    公开(公告)日:2003-07-01

    申请号:US09709782

    申请日:2000-11-07

    IPC分类号: F26B308

    CPC分类号: H01L21/67745 H01L21/6838

    摘要: A robotic semiconductor handling system includes two robot arms for transferring substrates between processing, cooling, and storage stations. The first robot arm has a paddle-type end effector adapted such that it can support one substrate at a primary location as well as a second substrate at a secondary staging location. The second robot arm is a Bernoulli-style wand that transfers a substrate from the primary location to the secondary one, and transfers substrates from either location to the process chamber. The use of the dual-location paddle allows for a significant reduction in cycle-time over a single paddle location and a Bernoulli wand system.

    摘要翻译: 机器人半导体处理系统包括用于在处理,冷却和存储站之间传送基板的两个机器人臂。 第一机器人臂具有桨式端部执行器,其适于使得其可以在次级分段位置处支撑主要位置处的一个基板以及第二基板。 第二个机器人手臂是一个伯努利风格的魔杖,将基底从主要位置传递到次要位置,并将衬底从任一位置传送到处理室。 使用双位置桨允许在单个桨位置和伯努利杆系统上显着减少循环时间。

    Chemical vapor desposition system
    8.
    发明授权
    Chemical vapor desposition system 失效
    化学气相沉积系统

    公开(公告)号:US5435682A

    公开(公告)日:1995-07-25

    申请号:US255114

    申请日:1994-06-07

    IPC分类号: C30B25/02 C30B25/10 A61K27/02

    摘要: This invention discloses a system for chemically depositing various materials carried by a reactant gas onto substrates for manufacturing semiconductor devices. The system includes special loading and unloading sub-systems for placement of substrates to be processed into the system and subsequent extraction without contamination of the system. A special substrate handling sub-system is provided for moving the substrates to and from at least one processing sub-system without physically contacting the planar surfaces of the substrates. The processing sub-system includes a horizontal gas flow reaction chamber having a rotatable susceptor therein for rotating the single substrate supportable thereon about an axis that is normal to the center of the substrate for averaging of the temperature and reactant gas concentration variables. The processing sub-system is separated from the handling sub-system by a special isolation valve and a gas injection device is used to inject the gas into the reaction chamber with a predetermined velocity profile. A special temperature sensing arrangement is provided in the processing sub-system for controlling a radiant heating sub-system which is provided above and below the reaction chamber.

    摘要翻译: 本发明公开了一种用于将由反应气体承载的各种材料化学沉积到用于制造半导体器件的衬底上的系统。 该系统包括特殊的装载和卸载子系统,用于将要处理的基板放置到系统中,随后提取而不会污染系统。 提供了一种特殊的基板处理子系统,用于将基板移动到至少一个处理子系统并且从至少一个处理子系统移动,而不物理地接触基板的平面表面。 处理子系统包括水平气流反应室,其中具有可旋转的基座,用于使可支撑在其上的单个基板绕垂直于基板中心的轴线旋转,以平均温度和反应气体浓度变量。 处理子系统通过特殊隔离阀与处理子系统分离,并且气体注入装置用于以预定的速度分布将气体注入反应室。 在处理子系统中设置有用于控制设置在反应室上方和下方的辐射加热子系统的特殊温度检测装置。

    Method for loading a substrate into a GVD apparatus
    9.
    发明授权
    Method for loading a substrate into a GVD apparatus 失效
    将基板装载到GVD装置中的方法

    公开(公告)号:US5156521A

    公开(公告)日:1992-10-20

    申请号:US720750

    申请日:1991-06-25

    IPC分类号: C30B25/02 C30B25/10

    CPC分类号: C30B29/06 C30B25/10

    摘要: A method for loading a substrate into a receiving chamber upon a positionable platform, which platform is in sealed relationship with the receiving chamber, permits purging of the receiving chamber prior to transport of the loaded substrate(s) to a feed chamber. The platform is positioned from the receiving chamber into the feed chamber to off load the substrates. A cassette containing a plurality of stacked substrates may be loaded upon the platform to transport a plurality of substrates into the feed chamber.

    摘要翻译: 一种将基板装载到接收室中的方法,所述定位平台与所述接收室处于密封关系中,所述定位平台允许在将所加载的基板运送到进料室之前清洗所述接收室。 平台从接收室定位到进料室中以卸载基板。 可以将包含多个堆叠的基板的盒子装载到平台上以将多个基板输送到进料室中。