公开(公告)号：US4053833A

公开(公告)日：1977-10-11

申请号：US553780

申请日：1975-02-27

申请人： Paul R. Malmberg ,  Robert M. Handy ,  Donald F. Stoneburner ,  David Green

发明人： Paul R. Malmberg ,  Robert M. Handy ,  Donald F. Stoneburner ,  David Green

IPC分类号： G01R31/302 ,  G01R31/26 ,  G01R15/12

CPC分类号： G01R31/303

摘要： A method is provided for contactless testing of an integrated circuit by fabricating, integrally with the integrated circuit, at least one and preferably a plurality of conductive semiconductor elements that are electrically connected between power and/or signal sources and inputs to the integrated circuit, and that are adapted to electrically conduct when exposed to a radiation beam. The conductive elements are selectively exposed by at least one radiation beam, such as an electron or light beam, to cause the conductive elements to electrically conduct and supply desired electrical inputs at the connected inputs of the integrated circuits; and the electrical responses of at least a segment of the integrated circuit to said electrical input are measured to determine whether said circuit segment possesses specified electrical characteristics. The integrated circuit can thus be selectively and sequentially tested by segments and modules. After testing, the conductive semiconductor elements are preferably disconnected from the integrated circuit, and the integrated circuit selectively connected electrically while accommodating and passivating defective components and modules of the circuit.

摘要翻译： 提供了一种通过与集成电路整体制造至少一个并且优选多个电连接到电源和/或信号源之间的导电半导体元件以及将集成电路的输入连接到集成电路的非接触测试的方法，以及 适于在暴露于辐射束时进行导电。 通过至少一个辐射束（例如电子或光束）选择性地暴露导电元件，以使导电元件在集成电路的连接的输入处导电并提供所需的电输入; 并且测量集成电路的至少一段对所述电输入的电响应，以确定所述电路段是否具有指定的电特性。 因此，可以通过段和模块来选择性和顺序地测试集成电路。 在测试之后，导电半导体元件优选地从集成电路断开，并且集成电路选择性地电连接，同时容纳和钝化电路的有缺陷的部件和模块。

公开(公告)号：US3956698A

公开(公告)日：1976-05-11

申请号：US441924

申请日：1974-02-12

申请人： Paul R. Malmberg ,  Robert M. Handy ,  Donald F. Stoneburner ,  David Green

发明人： Paul R. Malmberg ,  Robert M. Handy ,  Donald F. Stoneburner ,  David Green

IPC分类号： G01R31/302 ,  G01R31/26

CPC分类号： G01R31/302

摘要： A method is provided for contactless testing of an integrated circuit by fabricating, integrally with the integrated circuit, semiconductor switch elements, that is, thyristors, transistors and combinations thereof, that are connected to power and/or signal electrical inputs of the integrated circuit. Base regions of the switch elements are selectively exposed to a fine-dimensioned electron beam to switch the elements and supply desired electrical inputs at the connected inputs of the integrated circuit. The integrated circuit can thus be selectively tested preferably by segments and modules. After testing, the switch elements are disconnected from the integrated circuit, and the integrated circuit selectively connected preferably while accommodating and passivating defective components and modules of the circuit.

摘要翻译： 提供一种用于通过与集成电路整体地制造与集成电路的电源和/或信号电输入连接的半导体开关元件，即晶闸管，晶体管及其组合的集成电路的非接触测试的方法。 开关元件的基极区域选择性地暴露于精细尺寸的电子束以切换元件并在集成电路的连接的输入处提供期望的电输入。 因此，可以优选地通过段和模块来选择性地测试集成电路。 在测试之后，开关元件与集成电路断开，并且集成电路优选地在容纳和钝化电路的有缺陷的组件和模块的同时被选择性地连接。