Fluid resistant silicone encapsulant
    1.
    发明授权
    Fluid resistant silicone encapsulant 失效
    耐流体硅胶密封胶

    公开(公告)号:US07199206B2

    公开(公告)日:2007-04-03

    申请号:US10753293

    申请日:2004-01-08

    IPC分类号: C08L83/04

    摘要: A cross-linkable and cross-linked organosilicon polymer which is prepared from a mixture of a reactive polysiloxane resin having both reactive carbon-carbon double bonds and silicone-hydrogen groups, characterized by alternating structures of polycyclic polyene residue and cyclic (or tetrahedral) polysiloxane residue, and either vinyl terminated fluorine-containing polysiloxane or vinyl terminated phenyl-substituted siloxane. In an alternative embodiment, the polymer comprises a mixture of vinyl terminated phenyl-substituted polysiloxane and vinyl functional fluorosilicone elastomer with the cross-linkable and cross linked organosilicon polymer. In an alternative embodiment, the polymer comprises vinyl functional polydimethyl siloxane, and preferably high molecular weight methyl divinyl siloxane, with or without phenyl substituted siloxane.

    摘要翻译: 由具有反应性碳 - 碳双键和硅氢基团的反应性聚硅氧烷树脂的混合物制备的可交联和交联的有机硅聚合物,其特征在于多环多烯残基和环(或四面体)聚硅氧烷的交替结构 残基和乙烯基封端的含氟聚硅氧烷或乙烯基封端的苯基取代的硅氧烷。 在替代实施方案中,聚合物包含乙烯基封端的苯基取代的聚硅氧烷和乙烯基官能的氟硅氧烷弹性体与可交联和交联的有机硅聚合物的混合物。 在替代实施方案中,聚合物包含乙烯基官能聚二甲基硅氧烷,优选高分子量甲基二乙烯基硅氧烷,具有或不具有苯基取代的硅氧烷。

    High Tg potting compound
    2.
    发明授权
    High Tg potting compound 失效
    高Tg灌封料

    公开(公告)号:US06462108B1

    公开(公告)日:2002-10-08

    申请号:US09620170

    申请日:2000-07-20

    IPC分类号: C08K308

    摘要: A liquid epoxy-based potting composition has a glass transition temperature equal to or greater than 200° C. and comprises a cyclo-aliphatic epoxy, present in an amount of 50 to 80 parts by weight; a multi-functional aromatic epoxy (having more than two epoxy groups per molecule), present in an amount of 20 to 50 parts by weight; a liquid anhydride, present in an amount of 80 to 150 parts by weight; a basic latent accelerator, present in an amount of 1 to 5 parts by weight; and a filler, present in an amount of 100 to 500 parts by weight.

    摘要翻译: 液体环氧类灌封组合物的玻璃化转变温度等于或大于200℃,并且包含以50至80重量份的量存在的环脂族环氧树脂; 多功能芳族环氧树脂(每分子具有多于两个环氧基团),其量为20至50重量份; 液体酸酐,其量为80至150重量份; 一种碱性潜在促进剂,其用量为1至5重量份; 和填料,其量为100-500重量份。