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公开(公告)号：US12129341B2
公开(公告)日：2024-10-29
申请号：US17430573
申请日：2019-09-29
发明人： Shuzhen Chen , Rui Li
CPC分类号： C08G77/70 , C08G77/12 , C08J3/12 , C08J2383/05
摘要： Disclosed is a preparation method for a polysiloxane powder filler. The method comprises: providing polysiloxane which contains at least 60 wt % of T unit, wherein T unit is equal to R1SiO3-, R1 is a hydrogen atom or an independently selected organic group comprising 1-18 carbon atoms; and performing heat treatment on the polysiloxane under inert gas atmosphere or vacuum conditions, wherein the heat treatment temperature is 250 to 750 degrees, such that silicon hydroxyl groups in the polysiloxane are condensed to obtain a polysiloxane powder filler having a true density greater than or equal to 1.33 g/cm3 and more preferably greater than or equal to 1.34 g/cm3. The polysiloxane powder filler obtained by the described preparation method has low inductivity, low inductivity loss and low radioactivity; and can be used for semiconductor packaging materials, circuit boards and intermediate semi-finished products thereof, and semi-cured sheets or copper clad laminates of high-frequency high-speed circuit boards.
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公开(公告)号：US20240301252A1
公开(公告)日：2024-09-12
申请号：US18593521
申请日：2024-03-01
申请人： Rohm and Haas Electronic Materials Korea Ltd. , DuPont Toray Specialty Materials Kabushiki Kaisha
发明人： Hyunji Kang , Shunya TAKEUCHI , Mayumi MATSUZAKI , Yuri IGUCHI
CPC分类号： C09J11/04 , C08K3/22 , C08K3/36 , C09J183/04 , C08G77/14 , C08G77/20 , C08G77/70 , C08G77/80 , C08K2003/2241
摘要： A curable silicone composition comprising at least one curing reactive organopolysiloxane in an amount of 65% by weight or more relative to the total weight of the composition, at least one inorganic filler selected from silica, silica-titania composite oxide particle, and a combination thereof, in an amount of 1% by weight or more relative to the total weight of the composition, and at least one additive selected from (C1) organopolysiloxane having at least one organic functional group including at least one polyether structure at molecular side chain and/or molecular terminal; (C2) organosilane compound comprising at least one organic functional group selected from a C1-C6alkyl group, aryl group, and epoxy group, (C3) organopolysiloxane having at least one hydroxy group and at least one aryl group; (C4) organosiloxane oligomer having at least one epoxy group; (C5) unsaturated carboxylic acid or an ester thereof, and combinations thereof.
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公开(公告)号：US20240301142A1
公开(公告)日：2024-09-12
申请号：US18572967
申请日：2022-06-28
发明人： Shoji FUJITA , Takuma WATANABE
摘要： Provided are an organopolysiloxane in which arrangements of diphenylsiloxy units in the siloxane sequence are controlled to achieve a low proportion of arrangements where the diphenylsiloxy unit-containing siloxanes are consecutive; and a method for producing such organopolysiloxane. The organopolysiloxane is such that low-molecular siloxanes having a weight-average molecular weight of not higher than 700 are contained at a ratio of not larger than 10% by mass, and that a proportion of arrangements where diphenylsiloxy units are consecutive relative to all diphenylsiloxy units is not higher than 5 mol %.
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公开(公告)号：US12083783B2
公开(公告)日：2024-09-10
申请号：US16957999
申请日：2018-12-26
发明人： Wenjuan Zhou , Yin Zhang
IPC分类号： B32B7/12 , B32B7/06 , B32B9/02 , B32B25/20 , B32B27/12 , B32B27/18 , C08G77/00 , C08G77/12 , C08G77/20 , C08K5/5425 , C09J183/04
CPC分类号： B32B7/06 , B32B7/12 , B32B9/025 , B32B25/20 , B32B27/12 , B32B27/18 , C08G77/12 , C08G77/20 , C08G77/70 , C08K5/5425 , C09J183/04
摘要： The disclosure relates to a low TVOC release silicone composite sheet, comprising: 1) a substrate layer selected from a fabric or a polymeric film. 2) a silicone adhesive layer coated onto the substrate layer and containing volatile organic compound (VOC) releasing additives, and 3) a reinforcing layer adjacent to the silicone adhesive layer; wherein the coating amount of the silicone adhesive layer is less than 45 wt %, preferably less than 35 wt %, more preferably less than 20 wt %, based on the total coating amount of the silicone adhesive layer and the reinforcing layer. and wherein both silicone adhesive layer and reinforcing layer contain or consist essentially of liquid silicone rubber (LSR) or room temperature vulcanized silicone rubber (RTV), and said reinforcing layer contains one or more coatings comprising A). organopolysiloxane having one or more silicon atom-bonded alkenyl groups on average in one molecule; B). an organohydrogenpolysiloxane; and C). a hydrosilylation reaction catalyst present in any amount effective to cure the composition. Furthermore, it relates also to a method for coating and for reducing TVOC release.
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公开(公告)号：US20240270965A1
公开(公告)日：2024-08-15
申请号：US18555908
申请日：2022-03-30
发明人： Qing Cao , Shenglan Zhang , Chao Ma
CPC分类号： C08L83/08 , C08G77/12 , C08G77/16 , C08G77/20 , C08G77/70 , C09J7/381 , C09J183/04 , C08L2205/025
摘要： A curable composition contains: (A) a polydiorganosiloxane component including: (A1) greater than 3.1 wt % to 20 wt % of an aliphatically unsaturated polydiorganosiloxane polymer and (A3) a hydroxyl-terminated polydiorganosiloxane gum of unit formula (A-III); (B) a polyorganosilicate resin component including (B1) a capped resin, (B2) >18.53 wt % to 54.3 wt % of an uncapped resin; where the weight ratio of the uncapped resin (B2) to the capped resin (B1) is greater than 0.51 to 58.82; where component (A) and component (B) are present in amounts to provide a weight ratio of (B):(A) of 1.2:1 to less than 1.62:1; (C) a polyorganohydrogensiloxane that is present in an amount to provide a molar ratio of silicon bonded hydrogen atoms to alkenyl groups for the curable composition of 5 to 50; (D) a hydrosilylation reaction catalyst in an amount sufficient to provide 1 to 1000 ppm of platinum group metal; and (E) a condensation reaction catalyst; where the content of alkenyl groups in the curable composition is 0.017 wt % to 0.089 wt %; and where wt % values are relative to the total weight of components (A), (B), (C), (D) and (E) unless otherwise stated.
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公开(公告)号：US12060459B2
公开(公告)日：2024-08-13
申请号：US17158149
申请日：2021-01-26
申请人： Henkel AG & Co. KGaA
发明人： Christina Despotopoulou , Johann Klein , Therese Hemery , Esteban Mejia , Udo Kragl , Theresia Koehler , Lea Grefe
IPC分类号： C08G77/08 , C08G77/00 , C08G77/06 , C08G77/12 , C08G77/16 , C08G77/20 , C08K5/05 , C08K5/18 , C08K5/23
CPC分类号： C08G77/08 , C08G77/06 , C08G77/12 , C08G77/16 , C08G77/20 , C08G77/70 , C08G77/80 , C08K5/05 , C08K5/18 , C08K5/23 , C08G2170/00
摘要： The invention relates to a process for preparing polyorganosiloxanes by (i) condensation polymerization of at least one linear organosiloxane which has at least one hydroxy group or hydrolysable group bound to a silicon atom, (ii) ring-opening polymerization of at least one cyclosiloxane, or (iii) ring-opening polymerization and condensation polymerization of a mixture of at least one linear organosiloxane which has at least one hydroxy group or hydrolysable group bound to a silicon atom and at least one cyclosiloxane with a basic initiator and a hydroxy group-containing compound in the presence of a polar aprotic solvent, wherein the obtained polyorganosiloxanes are not miscible in the polar aprotic solvent at room temperature.
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公开(公告)号：US12037459B2
公开(公告)日：2024-07-16
申请号：US17431458
申请日：2020-09-27
发明人： Fuming Huang , Chengrong Zhu , Shenglan Zhang , Zhihua Liu
CPC分类号： C08G77/20 , C08G77/08 , C08G77/70 , C08J5/18 , C08K5/54 , C09D183/04 , C08J2383/07
摘要： An (A) additive organopolysiloxane composition is disclosed, which includes (A1) a branched organopolysiloxane polymer comprising M, D and Q siloxy units, (A2) a silicone resin, and (A3) a polydiorganosiloxane oligomer. A curable composition is also disclosed, the curable composition including the (A) additive organopolysiloxane composition, (B) an organosilicon compound having at least two silicon-bonded hydrogen atoms per molecule, and (C) a hydrosilylation catalyst. A method of preparing the curable composition, and a method of forming a film with the curable composition are also disclosed. The compositions and methods are useful for forming silicone release coatings with high release force.
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公开(公告)号：US20240218128A1
公开(公告)日：2024-07-04
申请号：US18288827
申请日：2021-05-05
申请人： WACKER CHEMIE AG
摘要： An organosilicon compound includes a mixture of polymeric alkyl silicates. The polymeric alkyl silicates include at least 90% by weight a mixture of polymeric alkyl silicates of the formula (I) [SiO4/2]a [(RxO)SiO3/2]b [(RyO)SiO3/2]b′ [(RxO)2SiO2/2]c [(RxO)(RyO)SiO2/2]c′ [(RyO)2SiO2/2]c″ [(RxO)3SiO1/2]d [(RxO)2(RyO)SiO1/2]d′ [(RxO)(RyO)2SiO1/2]d″ [(RyO)3SiO1/2]d′″ [O1/2RzO1/2]e [O1/2RzOH]e′ [O1/2RzORX]e″ [O1/2RzORy*]e′″ (I). Polymeric alkyl silicates of a formula II are excluded.
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公开(公告)号：US20240174815A1
公开(公告)日：2024-05-30
申请号：US18282948
申请日：2022-03-23
申请人： DOW TORAY CO., LTD.
发明人： Makoto YOSHITAKE
摘要： An organopolysiloxane composition is disclosed. The organopolysiloxane composition of includes at least (A) an organopolysiloxane expressed by an average unit formula, having a silicon-bonded hydroxyl group, (B) an organopolysiloxane expressed by an average unit formula, which is different from compound (A), and (C) a compound having at least two functional groups selected from ether bonds, ester bonds, and alkoxysilyl groups expressed by a formula, in one molecule. The amount of compound (A) is 2 to 70 mass % of the sum of component (A) and component (B). The amount of component (C) is an amount where the sum of functional groups in component (C) is 0.05 mols or more with regard to 1 mol of silicon-bonded hydroxyl groups in component (A). The composition has sufficient thixotropic properties, independent of inorganic powders such as fumed silica, precipitated silica, alumina, titanium oxide, and the like.
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公开(公告)号：US11982942B2
公开(公告)日：2024-05-14
申请号：US17767698
申请日：2020-10-09
申请人： MERCK PATENT GMBH
发明人： Karsten Koppe , Naofumi Yoshida
CPC分类号： G03F7/0757 , C08G77/04 , C08G77/70 , C08G77/80
摘要： The present invention relates to novel positive tone photoresist formulations comprising using crosslinkable siloxane polymers. The siloxane polymers used in the positive tone photoresist formulations are crosslinkable and comprise a first repeating unit, which contains at least one maleimide group, and a second repeating unit, which does not contain a maleimide group. The present invention further provides a manufacturing method for a microelectronic structure using a positive tone photoresist formulation according to the present invention and to an electronic device comprising a microelectronic structure, which is obtained or obtainable by said manufacturing method.
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