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公开(公告)号：US20110204126A1
公开(公告)日：2011-08-25
申请号：US13032832
申请日：2011-02-23
申请人： Hilmar VON CAMPE , Stefan MEYER , Thai HUYNH-MINH , Stephan HUBER , Silvio REIFF
发明人： Hilmar VON CAMPE , Stefan MEYER , Thai HUYNH-MINH , Stephan HUBER , Silvio REIFF
CPC分类号： H01L24/01 , B23K1/0016 , B23K1/06 , B23K3/0607 , H01L31/022425 , H01L31/0504 , Y02E10/50
摘要： The invention concerns a method and an apparatus for the application of solder onto a work piece, wherein the solder is soldered on at a soldering temperature TL and subject to the influence of ultrasound. In order to be able to solder without difficulties the solder onto work pieces that exhibit sensitivity to breakage it is proposed that the solder is heated, is applied to the work piece that is supported in particular in a spring-mounted manner, and is soldered-on subject to the influence of ultrasound.
摘要翻译： 本发明涉及将焊料应用到工件上的方法和装置，其中焊料在焊接温度TL下焊接并受到超声的影响。 为了能够焊接没有困难，将焊料焊接到显示出破坏灵敏度的工件上，提出焊料被加热，被施加到特别是以弹簧安装的方式被支撑的工件上， 受超声影响。
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公开(公告)号：US08777087B2
公开(公告)日：2014-07-15
申请号：US13032832
申请日：2011-02-23
申请人： Hilmar Von Campe , Stefan Meyer , Thai Huynh-Minh , Stephan Huber , Silvio Reiff
发明人： Hilmar Von Campe , Stefan Meyer , Thai Huynh-Minh , Stephan Huber , Silvio Reiff
CPC分类号： H01L24/01 , B23K1/0016 , B23K1/06 , B23K3/0607 , H01L31/022425 , H01L31/0504 , Y02E10/50
摘要： The invention concerns a method and an apparatus for the application of solder onto a work piece, wherein the solder is soldered on at a soldering temperature TL and subject to the influence of ultrasound. In order to be able to solder without difficulties the solder onto work pieces that exhibit sensitivity to breakage it is proposed that the solder is heated, is applied to the work piece that is supported in particular in a spring-mounted manner, and is soldered-on subject to the influence of ultrasound.
摘要翻译： 本发明涉及将焊料应用到工件上的方法和装置，其中焊料在焊接温度TL下焊接并受到超声的影响。 为了能够焊接没有困难，将焊料焊接到显示出破坏灵敏度的工件上，提出焊料被加热，被施加到特别是以弹簧安装的方式被支撑的工件上， 受超声影响。
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公开(公告)号：US20140158749A1
公开(公告)日：2014-06-12
申请号：US14177336
申请日：2014-02-11
申请人： Hilmar VON CAMPE , Stefan MEYER , Thai HUYNH-MINH , Stephan HUBER , Silvio REIFF
发明人： Hilmar VON CAMPE , Stefan MEYER , Thai HUYNH-MINH , Stephan HUBER , Silvio REIFF
IPC分类号： H01L23/00
CPC分类号： H01L24/01 , B23K1/0016 , B23K1/06 , B23K3/0607 , H01L31/022425 , H01L31/0504 , Y02E10/50
摘要： The invention concerns a method and an apparatus for the application of solder onto a work piece, wherein the solder is soldered on at a soldering temperature TL and subject to the influence of ultrasound. In order to be able to solder without difficulties the solder onto work pieces that exhibit sensitivity to breakage it is proposed that the solder is heated, is applied to the work piece that is supported in particular in a spring-mounted manner, and is soldered-on subject to the influence of ultrasound.
摘要翻译： 本发明涉及将焊料应用到工件上的方法和装置，其中焊料在焊接温度TL下焊接并受到超声的影响。 为了能够焊接没有困难，将焊料焊接到显示出破坏灵敏度的工件上，提出焊料被加热，被施加到特别是以弹簧安装的方式被支撑的工件上， 受超声影响。
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