公开(公告)号：US10680160B2

公开(公告)日：2020-06-09

申请号：US15026311

申请日：2013-10-30

Applicant: Hewlett-Packard Development Company, L.P. ,  State of Oregon on behalf of Oregon State Univ.

Inventor： James Elmer Abbott, Jr. ,  Peter Mardilovich ,  Brady Gibbons ,  Bryan Alexander Maack

IPC: H01L41/09 ,  H01L41/27 ,  H01L41/332 ,  H01L41/08 ,  B41J2/16 ,  B41J2/14 ,  H01L41/047 ,  H01L41/187

Abstract: The present disclosure is drawn to a piezoelectric thin film stack and method of preparing the same. The piezoelectric thin film stack can comprise a substrate with an oxide application surface, a metal oxide adhesive blend layer applied to the oxide application surface, and a piezoelectric film applied directly to the metal oxide adhesive blend layer.