公开(公告)号：US06950170B2

公开(公告)日：2005-09-27

申请号：US10413444

申请日：2003-04-14

申请人： Hiroki Nakahara ,  Takatomo Toda ,  Kotaro Ueno

发明人： Hiroki Nakahara ,  Takatomo Toda ,  Kotaro Ueno

IPC分类号： G02F1/1333

CPC分类号： G02F1/1333 ,  G02F1/133351 ,  G02F2001/133302 ,  G02F2201/503

摘要： An electro-optical panel having improved cracking resistance includes a substrate having scratches and cracks formed during a production process removed by etching.

摘要翻译： 具有改进的抗开裂性的电光面板包括在通过蚀刻去除生产过程中形成的划痕和裂纹的基板。

公开(公告)号：US06809390B2

公开(公告)日：2004-10-26

申请号：US09999207

申请日：2001-11-30

申请人： Takatomo Toda ,  Naoki Makino

发明人： Takatomo Toda ,  Naoki Makino

IPC分类号： H01L310203

CPC分类号： G02F1/13452 ,  H01L27/3297 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed is a semiconductor chip mounting substrate 4a bearing semiconductor chips 19a and 19b thereof. The first substrate 4a includes a power source line 22 for supplying a supply voltage potential to the semiconductor chips 19a and 19b, a ground line 23 for supplying a ground voltage potential to the semiconductor chips 19a and 19b, output lines 21a and 21b to which an output signal is supplied from the semiconductor chips 19a and 19b, and an insulator layer 11 for covering the output lines 21a and 21b. The insulator layer 11 is formed so that no insulator layer is arranged in the area between the power source line 22 and the ground line 23.

摘要翻译： 公开了一种载有其半导体芯片19a和19b的半导体芯片安装基板4a。 第一基板4a包括用于向半导体芯片19a和19b提供电源电压的电源线22，用于向半导体芯片19a和19b提供接地电压的接地线23，输出线21a和21b， 从半导体芯片19a和19b提供输出信号，以及用于覆盖输出线21a和21b的绝缘体层11。 绝缘体层11形成为在电源线22与接地线23之间的区域内不设置绝缘体层。