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    Packaging structure of image sensor and method for packaging the same
    4.
    发明授权
    Packaging structure of image sensor and method for packaging the same 失效
    图像传感器的包装结构及其包装方法

    公开(公告)号：US06737720B2

    公开(公告)日：2004-05-18

    申请号：US09768845

    申请日：2001-01-23

    Applicant: Mon Nan Ho ,  Hsiu Wen Tu ,  Ching Shui Cheng ,  Li Huan Chen ,  Joe Liu ,  Jichen Wu ,  Wen Chuan Chen

    Inventor： Mon Nan Ho ,  Hsiu Wen Tu ,  Ching Shui Cheng ,  Li Huan Chen ,  Joe Liu ,  Jichen Wu ,  Wen Chuan Chen

    IPC: H01L310203

    CPC classification number: H01L27/14618 ,  H01L2224/48091 ,  H01L2924/00014

    Abstract: A packaging structure of an image sensor includes a substrate, an image sensing chip, a plurality of wirings, and a transparent layer. The substrate includes a plurality of metal sheets, glue for sealing the metal sheets, a first surface, and a second surface. The metal sheets are exposed to the outside via the first surface and the second surface to form first contacts and second contacts, respectively. The image sensing chip is mounted on the substrate. The plurality of bonding pads are formed on the image sensing chip. The plurality of wirings electrically connect the bonding pads on the image sensing chip to the first contacts of the first surface of the substrate, in order to electrically connect the image sensing chip to the substrate. The transparent layer is arranged above the image sensing chip. Therefore, a packaging structure of an image sensor made of plastic materials can be formed, thereby simplifying the packaging processes and lowering the manufacturing costs.

    Abstract translation: 图像传感器的封装结构包括基板，图像感测芯片，多个布线和透明层。 基板包括多个金属片，用于密封金属片的胶，第一表面和第二表面。 金属片经由第一表面和第二表面暴露于外部，以分别形成第一触点和第二触点。 图像感测芯片安装在基板上。 多个接合焊盘形成在图像感测芯片上。 多个布线将图像感测芯片上的接合焊盘电连接到衬底的第一表面的第一触点，以将图像感​​测芯片电连接到衬底。 透明层设置在图像感测芯片的上方。 因此，可以形成由塑料材料制成的图像传感器的包装结构，从而简化包装过程并降低制造成本。

    Quick sealing glass-lidded package
    5.
    发明授权
    Quick sealing glass-lidded package 有权
    快速密封玻璃包装

    公开(公告)号：US06603183B1

    公开(公告)日：2003-08-05

    申请号：US09946750

    申请日：2001-09-04

    Applicant: Paul Robert Hoffman

    Inventor： Paul Robert Hoffman

    IPC: H01L310203

    CPC classification number: H01L27/14618 ,  H01L24/73 ,  H01L27/14687 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

    Abstract: An image sensor package includes a substrate and an image sensor mounted to the substrate. Bond pads of the image sensor are wirebonded to interior traces on the substrate by bond wires. An encapsulant encloses the bond wires, the encapsulant being formed of a first optically curable material that has been cured. A lid adhesive mounts a lid to the substrate, the lid adhesive being formed of a second optically curable material that has been cured. During fabrication, the first and second optically curable materials are cured rapidly without heating to form the encapsulant and the lid adhesive, respectively, thus minimizing the fabrication cost of the image sensor package.

    Abstract translation: 图像传感器封装包括基板和安装到基板的图像传感器。 图像传感器的接合焊盘通过接合线与衬底上的内部迹线引线键合。 密封剂包封接合线，密封剂由已经固化的第一可光学固化的材料形成。 盖粘合剂将盖子安装到基板上，盖粘合剂由已经固化的第二可光学固化材料形成。 在制造期间，第一和第二光学可固化材料在不加热的情况下被快速固化以分别形成密封剂和盖粘合剂，从而使图像传感器封装的制造成本最小化。

    Manufacturing method for two-dimensional image detectors and two-dimensional image detectors
    6.
    发明授权
    Manufacturing method for two-dimensional image detectors and two-dimensional image detectors 有权
    二维图像检测器和二维图像检测器的制造方法

    公开(公告)号：US06559451B1

    公开(公告)日：2003-05-06

    申请号：US09657528

    申请日：2000-09-08

    Applicant: Yoshihiro Izumi ,  Osamu Teranuma ,  Toshinori Yoshimuta ,  Shinya Hirasawa

    Inventor： Yoshihiro Izumi ,  Osamu Teranuma ,  Toshinori Yoshimuta ,  Shinya Hirasawa

    IPC: H01L310203

    CPC classification number: H01L31/02161 ,  H01L27/12 ,  H01L27/14609 ,  H01L27/14618 ,  H01L27/1462 ,  H01L27/14687 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A TFT array is formed on a glass substrate (step P1). A surface protection layer is formed on the glass substrate so as to cover the TFT array (step P2). The glass substrate is divided to form active matrix substrates with the surface protection layer being provided (step P3). The divided active matrix substrate is chamfered along its edges (step P4). The surface protection layer is removed from the active matrix substrate (step P5). An X-ray conductive layer is formed on the TFT array where the surface protection layer has been removed (step P6). By these steps, pollutants produced during the division and chamfering of the glass substrate are prevented from polluting the TFT array and the X-ray conductive layer, and the active element array and the semiconductor layer is prevented from deteriorating in terms of performance in manufacturing process for a two-dimensional image detector.

    Abstract translation: 在玻璃基板上形成TFT阵列（步骤P1）。 在玻璃基板上形成表面保护层以覆盖TFT阵列（步骤P2）。 玻璃基板被分割以形成具有表面保护层的有源矩阵基板（步骤P3）。 分割的有源矩阵基板沿其边缘倒角（步骤P4）。 从有源矩阵基板去除表面保护层（步骤P5）。 在去除表面保护层的TFT阵列上形成X射线导电层（步骤P6）。 通过这些步骤，防止在玻璃基板的分割和倒角期间产生的污染物污染TFT阵列和X射线导电层，并且防止有源元件阵列和半导体层在制造过程中的性能方面劣化 用于二维图像检测器。

    Diode housing
    9.
    发明授权
    Diode housing 有权
    二极管外壳

    公开(公告)号：US06624491B2

    公开(公告)日：2003-09-23

    申请号：US09754043

    申请日：2000-12-29

    Applicant: Gunther Waitl ,  Herbert Brunner

    Inventor： Gunther Waitl ,  Herbert Brunner

    IPC: H01L310203

    CPC classification number: H01L33/486 ,  H01L24/45 ,  H01L31/0203 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A housing accommodating a semiconductor chip is set out. The housing and chip may be used for sending and/or receiving radiation. Popular applications of the housing may be in light emitting diodes. The housing includes a conductor strip that is punched into two electrically isolated portions. The housing further includes a cavity extending inwards from the top of the housing. The conductor portions include respective areas that are exposed at the bottom of the cavity. The semiconductor chip is bonded to one of the exposed areas and a wire bonds the chip to the second exposed area. The conductor portions also terminate in exposed electrodes, which allow for electrical connection of the chip with external devices. A window is formed in the cavity and the walls of the housing that form the cavity may be made of a reflective material. The electrodes remain unexposed to the window but for any residual areas about the chip and bonding wire within the first and second exposed areas. By minimizing the area of the conductor exposed to the window, delamination brought about by the different thermal expansions of the window and conductor are minimized and/or eliminated. Likewise, with a reflective housing covering the base of the cavity that accommodates the window, internal radiation reflection is increased over that which was achieved with an exposed conductor.

    Abstract translation: 设置容纳半导体芯片的壳体。 外壳和芯片可用于发送和/或接收辐射。 外壳的热门应用可能在发光二极管中。 壳体包括被冲压成两个电隔离部分的导体条。 壳体还包括从壳体的顶部向内延伸的腔体。 导体部分包括暴露在空腔底部的相应区域。 半导体芯片被接合到一个暴露区域，并且引线将芯片连接到第二暴露区域。 导体部分也终止在暴露的电极中，这允许芯片与外部装置的电连接。 在空腔中形成窗口，并且形成空腔的壳体的壁可以由反射材料制成。 电极保持未暴露于窗口，但是对于芯片周围的任何残留区域以及在第一和第二暴露区域内的接合线。 通过使暴露于窗户的导体的面积最小化，窗口和导体的不同热膨胀引起的分层被最小化和/或消除。 类似地，通过覆盖容纳窗口的空腔的底部的反射壳体，内部辐射反射增加超过用暴露的导体实现的反射。

    Package structure for a photosensitive chip
    10.
    发明授权
    Package structure for a photosensitive chip 有权
    感光芯片的封装结构

    公开(公告)号：US06590269B1

    公开(公告)日：2003-07-08

    申请号：US10114201

    申请日：2002-04-01

    Applicant: Jason Chuang ,  Allis Chen ,  Jachson Hsieh ,  Hsiu Wen Tu ,  Meng Ru Tsai ,  Mon Nan Ho ,  Fu Yung Huang ,  Yung Sheng Chiu ,  Jichen Wu ,  Chih Cheng Hsu

    Inventor： Jason Chuang ,  Allis Chen ,  Jachson Hsieh ,  Hsiu Wen Tu ,  Meng Ru Tsai ,  Mon Nan Ho ,  Fu Yung Huang ,  Yung Sheng Chiu ,  Jichen Wu ,  Chih Cheng Hsu

    IPC: H01L310203

    CPC classification number: H01L31/0203 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A package structure for a photosensitive chip includes a substrate having an upper surface and a lower surface, and a frame layer having a first surface and a second surface. The frame layer is formed on the substrate by way of injection molding with the first surface contacting the upper surface. A cavity is formed between the substrate and the frame layer. The second surface is formed with a depression in which plural projections each having a suitable height are formed. The frame layer is formed directly on the substrate by way of injection molding. The package structure further includes a photosensitive chip arranged within the cavity, a plurality of wires for connecting the substrate to the photosensitive chip, and a transparent layer rested on the projections within the depression. Accordingly, the yield can be improved and the manufacturing processes can be facilitated.

    Abstract translation: 用于感光芯片的封装结构包括具有上表面和下表面的基片和具有第一表面和第二表面的框架层。 框架层通过注射成型形成在基板上，第一表面接触上表面。 在基板和框架层之间形成空腔。 第二表面形成有凹部，其中形成有具有适当高度的多个凸起。 框架层通过注射成型直接形成在基板上。 封装结构还包括布置在空腔内的感光芯片，用于将基板连接到感光芯片的多根导线以及搁置在凹陷内的凸起上的透明层。 因此，可以提高收率并且可以促进制造过程。

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