摘要:
A sensitizing agent for electroless plating which comprises a solution of at least one of palladium (II), silver (I), copper (I), copper (II), and nickel (II) compounds in an amide and a method for sensitizing substrates made of plastics or ceramics which comprises treating the substrates with the sensitizing agent, followed by treating them with a reducing solution, are provided.
摘要:
Resol type phenol resins containing scarcely or no phenol mononucleus compounds (monomers) and phenol dinuclei compounds (dimers) and their methylolated derivatives and scarcely containing molecules having an apparent molecular weight of more than 2500 are produced by reacting phenol with formaldehyde in the presence of an alkaline catalyst in a molar ratio of 3.0 to 6.0 moles of formaldehyde and 0.05 to 2.0 moles of the alkaline catalyst per mole of phenol, neutralizing the reaction solution with an acid to pH 4.5 to 6.5 and precipitating the resulting product for separation.