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294 条记录 (耗时 0.025 秒)

    PLATING CATALYST LIQUID, PLATING METHOD, AND METHOD FOR PRODUCING LAMINATE HAVING METAL FILM
    4.
    发明申请
    PLATING CATALYST LIQUID, PLATING METHOD, AND METHOD FOR PRODUCING LAMINATE HAVING METAL FILM 审中-公开
    镀层催化剂液体，镀层方法和生产具有金属膜的层压板的方法

    公开(公告)号：US20110240482A1

    公开(公告)日：2011-10-06

    申请号：US13139039

    申请日：2009-12-03

    申请人： Masataka Satou ,  Hideo Nagasaki

    发明人： Masataka Satou ,  Hideo Nagasaki

    IPC分类号： C25D3/50 ,  C23C28/00 ,  C25D5/56

    CPC分类号： C23C18/30 ,  C23C18/1608 ,  C23C18/1653 ,  C23C18/28 ,  C23C18/405 ,  C25D7/00 ,  H05K3/181 ,  H05K3/185

    摘要： A plating catalyst liquid which places little burden on the environment, which does not roughen the surface of a plating target, which can be easily controlled for the amount of plating catalyst applied and which is at low risk of inflammation and is highly safe, and a plating method using the plating catalyst are provided. The plating catalyst liquid includes a palladium compound, water, and a water-soluble combustible liquid serving as a combustible liquid ingredient, has a flash point of 40° C. or more and contains the water-soluble combustible liquid in an amount of 0.1 to 40 wt %.

    摘要翻译： 电镀催化剂液体，其对环境的负担很小，其不会使电镀对象的表面粗糙化，其可以容易地控制所施加的电镀催化剂的量，并且处于低度炎症和高度安全的风险;以及 提供使用电镀催化剂的电镀方法。 电镀催化剂液体包括钯化合物，水和作为可燃液体成分的水溶性可燃液体，其闪点为40℃以上，并且含有0.1〜1.0的水溶性可燃性液体 40重量％。

    Method for Selective Adsorption of Noble Metal Onto Surface of Polymer
    5.
    发明申请
    Method for Selective Adsorption of Noble Metal Onto Surface of Polymer 审中-公开
    贵金属在聚合物表面的选择性吸附方法

    公开(公告)号：US20100307796A1

    公开(公告)日：2010-12-09

    申请号：US12845656

    申请日：2010-07-28

    申请人： Hong Kee LEE

    发明人： Hong Kee LEE

    IPC分类号： H05K1/00 ,  G03F7/20 ,  B32B3/10 ,  B32B15/08

    CPC分类号： G03F7/0042 ,  C23C18/1605 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/208 ,  C23C18/28 ,  G03F7/265 ,  H05K3/185 ,  Y10T428/24917

    摘要： The present disclosure relates to a method for the selective adsorption of a noble metal catalyst onto a surface of a polymer. More particularly, the method of the present invention includes a first step of masking with a photo mask, the surface of a polymer adsorbed with a photosensitive metal ion, and radiating light onto the surface of the polymer such that the photosensitive metal ion on the unmasked surface is oxidized, and a second step of permitting the photosensitive metal ion which is not oxidized in the first step to react to a noble metal catalyst such that the noble metal catalyst is adsorbed onto the surface of the polymer.

    摘要翻译： 本公开涉及将贵金属催化剂选择性吸附到聚合物表面上的方法。 更具体地说，本发明的方法包括用光掩模进行掩蔽的第一步骤，吸附有感光金属离子的聚合物的表面，并将光辐射到聚合物的表面上，使得未掩蔽的感光金属离子 表面被氧化，并且允许在第一步骤中未被氧化的感光金属离子与贵金属催化剂反应使得贵金属催化剂吸附在聚合物表面上的第二步骤。

    METHOD FOR APPLYING A METAL ON PAPER
    6.
    发明申请
    METHOD FOR APPLYING A METAL ON PAPER 审中-公开
    在纸上应用金属的方法

    公开(公告)号：US20090297840A1

    公开(公告)日：2009-12-03

    申请号：US12296663

    申请日：2007-04-10

    申请人： Karl-Gunnar Larsson ,  Anders Hult

    发明人： Karl-Gunnar Larsson ,  Anders Hult

    IPC分类号： B32B15/12 ,  B05D1/38 ,  H05H1/00 ,  B05D5/00

    CPC分类号： D21H19/02 ,  C23C18/1605 ,  C23C18/1651 ,  C23C18/1692 ,  C23C18/2006 ,  C23C18/2086 ,  C23C18/28 ,  C23C18/31 ,  C23C18/40 ,  C23C26/00 ,  D21H19/08 ,  D21H23/30 ,  H05K1/03 ,  H05K1/032 ,  H05K1/0366 ,  H05K1/038 ,  H05K1/0386 ,  H05K3/181 ,  H05K3/381 ,  H05K2201/0158 ,  H05K2201/0179 ,  H05K2201/0284 ,  H05K2203/095 ,  Y10T428/265 ,  Y10T428/31703

    摘要： There is disclosed a method for applying a first metal on paper, which method comprises the steps a) producing polymers on the surface of said paper, said polymers comprising carboxylic groups and adsorbed ions of at least one second metal, said ions being adsorbed at a pH above 7, b) reducing said ions to the second metal and c) depositing said first metal on the reduced ions of said second metal. The invention further comprises objects manufactured according to the method. Advantages of the present invention include improved adhesion of the metal coating, possibility to coat many difficult materials. The process is suitable for large-scale and continuous production and it will reduce the waste of metal. Circuits manufactured according to the invention display improved signal integrity. Also there is the possibility to manufacture circuits which are built up sequentially with several layers of conductors in distinct patterns. It is also possible to manufacture of circuits with a very small line width.

    摘要翻译： 公开了一种在纸上施加第一金属的方法，该方法包括以下步骤：a）在所述纸的表面上制备聚合物，所述聚合物包含羧基和至少一种第二金属的吸附离子，所述离子被吸附在 b）将所述离子还原成第二金属，和c）将所述第一金属沉积在所述第二金属的还原离子上。 本发明还包括根据该方法制造的物体。 本发明的优点包括改善金属涂层的附着力，可能涂覆许多困难的材料。 该工艺适合大规模连续生产，减少金属的浪费。 根据本发明制造的电路显示改进的信号完整性。 还有可能制造电路，其顺序地以不同图案的几层导体构成。 也可以制造线宽非常小的电路。

    Measurement techniques for controlling aspects of a electroless deposition process
    7.
    发明申请
    Measurement techniques for controlling aspects of a electroless deposition process 有权
    用于控制无电沉积工艺方面的测量技术

    公开(公告)号：US20050084615A1

    公开(公告)日：2005-04-21

    申请号：US10794592

    申请日：2004-03-05

    申请人： Timothy Weidman ,  Dmitry Lubomirsky

    发明人： Timothy Weidman ,  Dmitry Lubomirsky

    IPC分类号： B05C3/00 ,  B05C19/02 ,  C23C18/16 ,  C23C18/28 ,  C23F1/00 ,  C25D7/12 ,  H01L21/288 ,  H01L21/768

    CPC分类号： H01L21/76838 ,  C23C18/1601 ,  C23C18/1619 ,  C23C18/1628 ,  C23C18/1678 ,  C23C18/1682 ,  C23C18/1872 ,  C23C18/28 ,  H01L21/288 ,  Y10S134/902

    摘要： Embodiments of the invention generally provide a fluid processing chamber, sensors and a controller and method for using the same. The fluid processing chamber includes an inlet region, a processing region and an outlet region. The inlet region generally contains one or more sensors and an external controller to monitor the characteristics of the processing fluid at the inlet to the processing region. The outlet region generally contains one or more sensors and an external controller to monitor the characteristics of the processing fluid leaving the processing region of the chamber. In one embodiment the processing region contains one or more sensors and an external controller to monitor the characteristics of the processing fluid in the processing region. The sensors may include, for example, an ORP probe, a temperature sensor, a conductivity sensor, a dissolved hydrogen sensor, a dissolved oxygen sensor, and a pH sensor. The fluid processing chamber is generally useful for all process steps done to deposit an electroless deposited film on a substrate including, for example, all pre-clean process steps (substrate preparation steps), all electroless activation process steps, all electroless deposition steps, and all post electroless deposition cleaning steps.

    摘要翻译： 本发明的实施例通常提供流体处理室，传感器以及使用该流体处理室的控制器和方法。 流体处理室包括入口区域，处理区域和出口区域。 入口区域通常包含一个或多个传感器和外部控制器，以监控处理区域入口处的处理流体的特性。 出口区域通常包含一个或多个传感器和外部控制器，以监测离开室的处理区域的处理流体的特性。 在一个实施例中，处理区域包含一个或多个传感器和外部控制器，用于监视处理区域中处理流体的特性。 传感器可以包括例如ORP探针，温度传感器，电导率传感器，溶解氢传感器，溶解氧传感器和pH传感器。 流体处理室通常可用于在基底上沉积无电沉积膜的所有工艺步骤，包括例如所有预清洁工艺步骤（衬底制备步骤），所有无电解激活工艺步骤，所有无电沉积步骤和 所有后期无电沉积清洗步骤。

    Electroless plating of substrates
    9.
    发明授权
    Electroless plating of substrates 失效
    基板无电镀

    公开(公告)号：US5292557A

    公开(公告)日：1994-03-08

    申请号：US976866

    申请日：1992-11-16

    申请人： Larry D. Olson

    发明人： Larry D. Olson

    IPC分类号： C23C18/28 ,  H05K3/18 ,  H05K3/38 ,  B05D1/00

    CPC分类号： C23C18/28 ,  H05K3/181 ,  H05K3/381

    摘要： Electroless deposition of copper from solution onto a substrate, particularly a polymeric laminate for use in electronic circuitry, is accomplished by first treating said substrate with a stilbene-based fluorescent brightener to sensitize said substrate and thereafter contacting said substrate with an electroless copper plating solution.

    摘要翻译： 将铜从溶液中无电沉积到基底上，特别是用于电子电路中的聚合物层压板，通过首先用基于茋的荧光增白剂处理所述基底，使所述基底敏化，然后使所述基底与无电镀铜溶液接触来实现。