公开(公告)号：US20100080680A1

公开(公告)日：2010-04-01

申请号：US12562274

申请日：2009-09-18

Applicant: Hideki OKAMOTO ,  Takeshi MINOBE ,  Hirofumi TAKIURA

Inventor： Hideki OKAMOTO ,  Takeshi MINOBE ,  Hirofumi TAKIURA

IPC: H01L21/673

CPC classification number: B25J15/0616

Abstract: A conveying arm for conveying a substrate while holding it with suction pads has, on the side of the conveying arm from which the suction pads extend, elastic members, such as flat springs, which are shorter than the suction pads. The flat springs are located above the tip ends of the suction pads when they hold the substrate and when the substrate is lowered to the work stage, the flat springs press any bent portions of the substrate down toward the work stage, which leads to flattening of surface of the substrate against the work stage so as to eliminate leakage of vacuum, used for suctioning the substrate against the work stage, from peripheral portions of the substrate. As a result, the substrate can be securely held on the work stage.

Abstract translation: 用于在用吸盘保持基板的同时输送基板的输送臂在吸板延伸的输送臂的一侧具有短于吸盘的弹性构件，例如板簧。 当弹簧固定在基板上时，平板弹簧位于吸盘顶端之上，当基板下降到工作台时，板簧将基板的任何弯曲部分向下压向工作台，从而导致平面 基板抵靠工作台的表面，从而消除用于从衬底的周边部分向工作台吸引衬底的泄漏泄漏。 结果，可以将基板牢固地保持在工作台上。

公开(公告)号：US06280060B1

公开(公告)日：2001-08-28

申请号：US09368904

申请日：1999-08-06

Applicant: Shinji Suzuki ,  Takeshi Minobe

Inventor： Shinji Suzuki ,  Takeshi Minobe

IPC: F21V2900

CPC classification number: H01L21/67115

Abstract: A cooling arrangement of a heating device of the light irradiation type in which, even when the wafer is heated to a high temperature of roughly 800 to 1200° C., the respective parts, such as the arc tube portion of the lamp, the insertion tube, the sealing area and the like can be easily controlled to a suitable temperature is achieved in a heating device of the light irradiation type, in which several lamps are disposed in a light irradiation chamber, each lamp having an arc tube portion, at least one insertion tube and at least one sealing area arranged on an at least one end of the arc tube portion, by the provision of a mirror which reflects the light from the arc tube portions behind the arc tube portions of the lamps and which has opening through which the insertion portion and the sealing areas pass; a cover chamber which has a plate with opening through which the sealing area of the lamps pass, and a cover with an opening for cooling air; and a wind box which is located between the plate of the cover chamber and the mirror and which is connected via a channel to an air mover, e.g., a blower, for drawing in or blowing in a cooling air flow. The air mover is connected to the opening for cooling air in the cover via the opening of the cover chamber plate, the wind box and the channel and being connected to the opening for cooling air in the light irradiation chamber via the opening of the mirror, the wind box and the channel.

Abstract translation: 即使当将晶片加热到大约800〜1200℃的高温时，照射型加热装置的冷却装置，诸如灯的发光管部分的各部分插入 管，密封区域等可以容易地控制到在光照射类型的加热装置中实现的合适的温度，其中在光照射室中设置若干个灯，每个灯至少具有电弧管部分 一个插入管和至少一个密封区域，其布置在电弧管部分的至少一个端部上，通过设置反射镜，该反射镜将来自灯的弧光管部分后面的电弧管部分的光反射并且具有开口 插入部分和密封区域通过; 盖室，具有开口的板，灯的密封区域通过该盖板，以及具有用于冷却空气的开口的盖; 以及风箱，其位于盖室的板和反射镜之间，并且经由通道连接到例如鼓风机的鼓风机，用于吸入或吹入冷却空气流。 鼓风机通过盖板，风箱和通道的开口连接到开口，用于冷却盖中的空气，并且通过反射镜的开口连接到用于在光照射室中冷却空气的开口， 风箱和通道。

公开(公告)号：US5880816A

公开(公告)日：1999-03-09

申请号：US725020

申请日：1996-10-02

Applicant: Yoshiki Mimura ,  Takeshi Minobe ,  Shinetsu Miura

Inventor： Yoshiki Mimura ,  Takeshi Minobe ,  Shinetsu Miura

IPC: G03F7/20 ,  G03B27/42 ,  G03B27/52

CPC classification number: G03F7/2028

Abstract: To effect exposure of the peripheral area of a wafer to remove an unnecessary resist with a step shape in a development process with high precision and ease, even if the position has errors, in which a circuit pattern is formed on a semiconductor wafer in a preceding process, according to the invention, before exposing the unnecessary resist on a wafer outside of the area on which a pattern is formed, the position of a singular shaped area, such as an "orientation flat" or the like is determined by a unit for determining the peripheral edge area of the wafer, and the rotating carrier is driven and the wafer is rotated until the singular shaped area is positioned in a predetermined position. Furthermore, according to the invention, a unit for determining the alignment marks computes and stores the positions of predetermined alignment marks, by which positional errors in the location in which the circuit pattern is formed are corrected. Then, the rotating carrier is driven again, and fine adjustment of the position of the exposure area on the wafer is performed.

Abstract translation: 为了在显影处理中以高精度和容易的方式实现晶片的周边区域的曝光以去除具有台阶形状的不必要的抗蚀剂，即使位置有错误，其中在前面的半导体晶片上形成电路图案 根据本发明，在将不需要的抗蚀剂暴露在其上形成有图案的区域的晶片之外的过程中，诸如“取向平面”等的单形区域的位置由用于 确定晶片的外围边缘区域，驱动旋转载体，并旋转晶片，直到奇异形状区域位于预定位置。 此外，根据本发明，用于确定对准标记的单元计算并存储预定对准标记的位置，由此校正形成电路图案的位置中的位置误差。 然后，再次驱动旋转载体，进行晶片上的曝光区域的位置的微调。