公开(公告)号：US20150017434A1

公开(公告)日：2015-01-15

申请号：US14373953

申请日：2013-01-24

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Blake R. Dronen ,  Eric G. Larson

IPC: B32B38/10 ,  B32B37/24

CPC classification number: B32B38/10 ,  B32B33/00 ,  B32B37/12 ,  B32B37/24 ,  B32B43/006 ,  B32B2037/243 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/673 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T156/10 ,  Y10T428/2839

Abstract: A hybrid laminated body is provided that includes a light-transmitting support, a latent release layer disposed upon the light-transmitting support, a joining layer disposed upon the latent release layer, and a thermoplastic priming layer disposed upon the joining layer. The hybrid laminated body can further include a substrate to be processed such as, for example, a silicon wafer to be ground. Also provided is a method for manufacturing the provided laminated body.

Abstract translation: 提供了一种混合层压体，其包括透光支撑体，设置在透光性支撑体上的潜在释放层，设置在潜在释放层上的接合层和设置在接合层上的热塑性起泡层。 混合层叠体还可以包括待加工的基板，例如待研磨的硅晶片。 还提供了制造所提供的层叠体的方法。

公开(公告)号：US20150034238A1

公开(公告)日：2015-02-05

申请号：US14385401

申请日：2013-03-06

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Blake R. Dronen ,  Wayne S. Mahoney ,  Eric G. Larson

IPC: H01L21/683 ,  B32B38/10 ,  C09J7/02 ,  B32B7/06

CPC classification number: H01L21/6836 ,  B32B7/06 ,  B32B38/10 ,  C09J7/385 ,  C09J7/401 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2433/005 ,  H01L21/67092 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2221/68386 ,  Y10T156/10 ,  Y10T428/1452 ,  Y10T428/1457 ,  Y10T428/1476

Abstract: A laminate body, method, and materials for temporary substrate support are provided. The laminate body can hold N and protect thin, brittle substrates such as flexible glass or thin semiconductor wafers during further processing such as vapor deposition or thinning by grinding. The provided laminate body, in one embodiment, includes a support, a release layer disposed upon the support, a joining layer disposed upon and in contact with the release layer, and a substrate disposed upon and in contact with the joining layer. The release layer can include an acrylic adhesive and an adhesion modifying agent.

Abstract translation: 提供了层叠体，方法和用于临时衬底支撑的材料。 层压体可以在进一步加工例如气相沉积或通过研磨减薄的过程中保护N并且保护薄的，脆性的基材例如柔性玻璃或薄的半导体晶片。 在一个实施方案中，提供的层压体包括支撑体，设置在支撑体上的剥离层，设置在剥离层上并与释放层接触的接合层，以及设置在接合层上并与接合层接触的基底。 脱模层可以包括丙烯酸粘合剂和粘合改性剂。