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公开(公告)号:US20240360344A1
公开(公告)日:2024-10-31
申请号:US18645170
申请日:2024-04-24
Applicant: tesa SE
Inventor: Maike-Christine Strebl-Pfarr , Francisco Lossada , Christian Schuh , Tahmina Schafa
IPC: C09J7/38 , C09J133/14
CPC classification number: C09J7/385 , C09J133/14 , C09J2301/302 , C09J2433/00 , C09J2475/00
Abstract: A chemical-resistant, reactive pressure-sensitive adhesive tape having a reactive adhesive including a radically polymerizable monomer or oligomer, an initiator system for curing the at least one radically polymerizable monomer or oligomer, and a poly(meth)acrylate which contains a fraction of at least 15 percent by weight of monomers with aromatic radicals.
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公开(公告)号:US20240360343A1
公开(公告)日:2024-10-31
申请号:US18643234
申请日:2024-04-23
Applicant: tesa SE
Inventor: Stefan Kramp , Michael Egger
IPC: C09J7/38 , C09J7/26 , C09J11/08 , C09J133/10
CPC classification number: C09J7/385 , C09J7/26 , C09J11/08 , C09J133/10 , C09J2301/1242 , C09J2301/302 , C09J2301/312 , C09J2301/416 , C09J2301/50 , C09J2423/00 , C09J2433/00
Abstract: A reactive pressure-sensitive adhesive element that includes: i) a carrier layer; ii) a first adhesive layer arranged on a first surface of the carrier layer that comprises a first UV-curable pressure-sensitive adhesive; and iii) a second adhesive layer arranged on a second surface of the carrier layer facing away from the first surface, wherein the second adhesive layer comprises a second UV-curable pressure-sensitive adhesive. Each of the first and second UV-curable pressure-sensitive adhesives, based on a mass of the respective pressure-sensitive adhesive, comprises: x) one or more poly (meth) acrylate compounds in a combined mass fraction from 35% to 85%; y) one or more polymerizable epoxy compounds in a combined mass fraction from 10% to 50%; and z) one or more photoinitiators in a combined mass fraction from 0.1% to 5%. Further, the carrier layer comprises a foam carrier, the foam carrier comprising one or more polyolefins.
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公开(公告)号:US20240343949A1
公开(公告)日:2024-10-17
申请号:US18294708
申请日:2021-12-16
Applicant: NITTO DENKO CORPORATION
Inventor: Kazumichi KATO , Shusaku UENO , Takamasa HIRAYAMA
IPC: C09J7/38 , C09J133/08
CPC classification number: C09J7/385 , C09J133/08 , C09J2203/326 , C09J2301/312 , C09J2467/006
Abstract: A pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer of which adhesive face has wettability difficult to change even when exposed to an atmospheric environment, and on which positional deviation or drop is difficult to occur in conveying an electronic component. The pressure-sensitive adhesive layer has an adhesive face protected by a release liner and has a displacement of water contact angles θ1 and θ2 against the adhesive face 10a under the following conditions T1 and T2 of 5° or less:
T1: immediately after separating the release liner R1 under an environment of 23° C.
T2: after 2 hour exposure of the adhesive face 10a to an atmospheric environment after separating the release liner R1 under an environment of 23° C.
θ1: water contact angle (°) of the adhesive face 10a under T1
θ2: water contact angle (°) of the adhesive face 10a under T2
Displacement R(°)=θ2−θ1.-
公开(公告)号:US20240336760A1
公开(公告)日:2024-10-10
申请号:US18574409
申请日:2022-06-28
Applicant: NITTO DENKO CORPORATION
Inventor: Yosuke Yamada , Akiyoshi Yamamoto , Takayuki Nomura
CPC classification number: C08J11/08 , C08L33/02 , C08L33/10 , C09J7/385 , C08J2333/02 , C08J2333/10 , C08L2312/00 , C09J2301/302 , C09J2433/00
Abstract: Provided are a method for producing a water-soluble polymer in which a water-soluble polymer can be produced from a pressure-sensitive adhesive as waste under a mild condition, a method for producing a water-absorbent polymer in which a water-absorbent polymer can be produced from a pressure-sensitive adhesive under a mild condition, a water-soluble polymer that can be produced from a pressure-sensitive adhesive, and a water-absorbent polymer that can be produced from a pressure-sensitive adhesive. A method for producing a water-soluble polymer according to an embodiment of the present invention includes bringing a pressure-sensitive adhesive treatment liquid which contains a liquid having a Hansen solubility parameter value of 31 or less and an alkaline compound and in which a concentration of the alkaline compound in the pressure-sensitive adhesive treatment liquid is from 0.001 wt % to 20 wt %, into contact with a pressure-sensitive adhesive.
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公开(公告)号:US20240327557A1
公开(公告)日:2024-10-03
申请号:US18699992
申请日:2022-11-02
Applicant: ROHM AND HAAS COMPANY
Inventor: Kylie Manning Kennedy , Laura j. Donkus , Michael A. Mallozzi , Himal H. Ray
IPC: C08F226/10 , C08F2/24 , C08F212/08 , C08F220/06 , C08F220/14 , C08F220/18 , C08F220/20 , C09J7/38 , C09J139/06
CPC classification number: C08F226/10 , C08F2/24 , C08F212/08 , C08F220/06 , C08F220/14 , C08F220/1804 , C08F220/1808 , C08F220/20 , C09J7/385 , C09J139/06 , C09J2203/334 , C09J2203/346 , C09J2203/354 , C09J2301/302 , C09J2433/00
Abstract: Provided is an aqueous composition comprising dispersed particles that comprise a polymer, wherein the polymer comprises, by weight based on the weight of the polymer, a) 60% to 99.95% polymerized units of one or more (meth)acrylate ester, b) 0.05% to 6% polymerized units of one or more N-vinyl lactam, c) 0% to 39.95% polymerized units of one or more other monomers. Also provided is a method of making that composition, a process for producing an article using that composition, and a method of bonding two substrates using that article.
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公开(公告)号:US12106974B2
公开(公告)日:2024-10-01
申请号:US17438650
申请日:2020-02-27
Applicant: MITSUI CHEMICALS TOHCELLO, INC.
Inventor: Toru Miura , Hiroyoshi Kurihara
CPC classification number: H01L21/568 , B32B7/12 , B32B27/08 , B32B37/12 , C09J7/385 , B32B2307/732 , B32B2457/00 , C09J2203/326 , C09J2423/00 , C09J2425/00 , C09J2433/00 , C09J2475/00 , C09J2483/00
Abstract: A method for manufacturing an electronic device includes at least a preparing step of preparing a structure provided with an adhesive film provided with a base material layer, an adhesive resin layer (A) provided on a first surface side of the base material layer, an adhesive resin layer (B) provided on a second surface side of the base material layer and in which an adhesive force is reduced by external stimuli, and an unevenness-absorbing resin layer (C) provided between the base material layer and the adhesive resin layer (A) or between the base material layer and the adhesive resin layer (B), an electronic component attached to the adhesive resin layer (A) of the adhesive film and having an uneven structure, and a support substrate attached to the adhesive resin layer (B) of the adhesive film; and a sealing step of sealing the electronic component with a sealing material.
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公开(公告)号:US12104101B2
公开(公告)日:2024-10-01
申请号:US16872088
申请日:2020-05-11
Applicant: President and Fellows of Harvard College
Inventor: Sibo Cheng , Yashraj S. Narang , Canhui Yang , Zhigang Suo , Robert D. Howe
CPC classification number: C09J7/385 , B32B5/18 , B32B5/32 , B32B25/045 , B32B25/16 , B32B25/20 , B32B7/12 , B32B2250/24 , B32B2255/26 , B32B2266/122 , B32B2457/00 , C09J2301/414 , C09J2433/00 , C09J2483/006
Abstract: A composite material is disclosed including: a first material including a plurality of crosslinked first polymer chains including a plurality of first polymer monomeric units; a coating layer on the surface of the first material, wherein the coating layer includes a plurality of adhesion polymer chains, wherein the plurality of adhesion polymer chains includes a plurality of the first polymer monomeric units and a plurality of first bond-forming units, wherein the adhesion polymer chains are interwoven with the first polymer chains; and a second material including a plurality of second polymer chains, wherein the coating layer is disposed in-between the first and the second material and contacting the surface of the first and the second material, and a portion of the second polymer chains includes a plurality of second polymer monomeric units and second bond-forming units; wherein the first and the second bond-forming units form one or more bonds.
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8.
公开(公告)号:US20240304115A1
公开(公告)日:2024-09-12
申请号:US18271863
申请日:2022-01-05
Applicant: Eun Mi CHO
Inventor: Eun Mi CHO
IPC: G09F3/10 , B32B7/06 , B32B7/14 , B32B27/10 , B32B27/36 , B32B37/24 , C09J7/25 , C09J7/38 , C09J7/40 , G09F3/02 , H01M4/04
CPC classification number: G09F3/10 , B32B7/06 , B32B7/14 , B32B27/10 , B32B27/36 , B32B37/24 , C09J7/255 , C09J7/385 , C09J7/401 , C09J7/403 , C09J7/405 , B32B2037/243 , B32B2255/12 , B32B2255/26 , B32B2255/28 , B32B2307/4023 , B32B2307/412 , B32B2307/7376 , B32B2307/748 , B32B2317/12 , B32B2333/08 , B32B2367/00 , B32B2383/00 , B32B2519/00 , C09J2203/33 , C09J2400/28 , C09J2433/00 , C09J2467/005 , C09J2467/006 , C09J2483/005 , G09F2003/0225 , G09F2003/0239 , G09F2003/0257 , H01M4/04
Abstract: A tag for marking a defective portion of an electrode for a secondary battery and a manufacturing method thereof are provided. More specifically, the tag for marking a defective portion of an electrode is simply attached to a place recognized as having a defect in an electrode for a secondary battery produced by an automation process. So, the tag for marking a defective portion of an electrode for a secondary battery is formed as release paper applied with color contrasted with the color of the tag for marking is laminated so that a light sensor installed in an automatic tag feeder identifies the release paper and the tag for marking without an error to automatically supply the tag for marking when supplying the tag for marking a defective portion of an electrode by the automatic tag feeder.
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公开(公告)号:US20240301251A1
公开(公告)日:2024-09-12
申请号:US18255998
申请日:2022-02-15
Applicant: LG CHEM, LTD.
Inventor: Byung Su PARK , Hyun Cheol KIM , Hui Je LEE , Seung Yeon RYU , Jin Ho SON
IPC: C09J7/38 , C09J133/08
CPC classification number: C09J7/385 , C09J133/08 , C09J2301/302 , C09J2301/312 , C09J2301/414 , C09J2433/00 , C09J2467/006
Abstract: A pressure-sensitive adhesive, which is applied to a flexible device, thereby effectively responding to repeated deformation and recovery, causing no defects (for example, observation of deformation traces and the like) before and after deformation, having excellent cuttability and workability, and causing no lifting, delamination, and/or bubble generation, and a use thereof are provided.
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10.
公开(公告)号:US20240301245A1
公开(公告)日:2024-09-12
申请号:US18596209
申请日:2024-03-05
Applicant: Lohmann GmbH & CO. KG
Inventor: Vincent LEON , Regina SCHULDAIS , Daniel GÄRTNER , Philipp RIES
CPC classification number: C09J7/28 , C09J7/385 , C09J9/02 , C09J2301/124 , C09J2400/163 , C09J2433/00
Abstract: A pressure-sensitive adhesive for skin applications, having a polymer network comprising at least one copolymer and at least one type of electrically conductive particle to improve long-term bonding and efficiency. The copolymer may comprise 70 to 98.5% by weight of non-polar monomers and 1.5 to 30% by weight of polar monomers.
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