公开(公告)号：US10699986B2

公开(公告)日：2020-06-30

申请号：US16233266

申请日：2018-12-27

Applicant: ABB Schweiz AG

Inventor： Daniel Kearney ,  Jürgen Schuderer ,  Slavo Kicin ,  Liliana Duarte

IPC: H01L23/34 ,  H01L23/473 ,  H01L25/07 ,  H05K1/02 ,  H01L23/538 ,  H05K1/18

Abstract: An electronics package includes an electrically conducting support layer; at least one electrically conducting outer layer; at least two power electronics components arranged on different sides of the support layer and electrically interconnected with the support layer and with the at least one outer layer; and isolation material, in which the support layer and the at least two power electronics components are embedded, the support layer and the at least one outer layer are laminated together with the isolation material; and a cooling channel for conducting a cooling fluid through the electronics package, the cooling channel runs between the at least two power electronics components through the support layer.

公开(公告)号：US20190131211A1

公开(公告)日：2019-05-02

申请号：US16233266

申请日：2018-12-27

Applicant: ABB Schweiz AG

Inventor： Daniel Kearney ,  Jürgen Schuderer ,  Slavo Kicin ,  Liliana Duarte

IPC: H01L23/473 ,  H01L25/07 ,  H05K1/02

Abstract: An electronics package includes an electrically conducting support layer; at least one electrically conducting outer layer; at least two power electronics components arranged on different sides of the support layer and electrically interconnected with the support layer and with the at least one outer layer; and isolation material, in which the support layer and the at least two power electronics components are embedded, the support layer and the at least one outer layer are laminated together with the isolation material; and a cooling channel for conducting a cooling fluid through the electronics package, the cooling channel runs between the at least two power electronics components through the support layer.