REVERSE-CONDUCTING POWER SEMICONDUCTOR DEVICE
    1.
    发明申请
    REVERSE-CONDUCTING POWER SEMICONDUCTOR DEVICE 有权
    反向导电功率半导体器件

    公开(公告)号:US20130207157A1

    公开(公告)日:2013-08-15

    申请号:US13852366

    申请日:2013-03-28

    Abstract: An exemplary reverse-conducting power semiconductor device with a wafer having a first main side and a second main side parallel to the first main side. The device includes a plurality of diode cells and a plurality of IGCT cells, each IGCT cell including between the first and second main side: a first anode electrode, a first anode layer of a first conductivity type on the first anode electrode, a buffer layer of a second conductivity type on the first anode layer, a drift layer of the second conductivity type on the buffer layer, a base layer of the first conductivity type on the drift layer, a first cathode layer of a second conductivity type on the base layer, and a cathode electrode on the first cathode layer. A mixed part includes the second anode layers of the diode cells alternating with the first cathode layers of the IGCT cells.

    Abstract translation: 一种示例性的反向导电功率半导体器件,其具有晶片,该晶片具有平行于第一主侧的第一主侧和第二主侧。 该装置包括多个二极管单元和多个IGCT单元,每个IGCT单元包括在第一和第二主侧之间:第一阳极电极,第一阳极电极上的第一导电类型的第一阳极层,缓​​冲层 在第一阳极层上具有第二导电类型的漂移层,缓冲层上的第二导电类型的漂移层,漂移层上的第一导电类型的基极层,基底层上的第二导电类型的第一阴极层 和第一阴极层上的阴极电极。 混合部分包括与IGCT电池的第一阴极层交替的二极管单元的第二阳极层。

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