公开(公告)号：US11015055B2

公开(公告)日：2021-05-25

申请号：US16304454

申请日：2017-04-27

Applicant: ADEKA CORPORATION

Inventor： Hiroki Akatsu ,  Takashi Ayabe

IPC: C08L81/02 ,  C08K5/3492 ,  C08L67/04 ,  C08L77/00 ,  C08L101/16 ,  C08K5/3475 ,  B29C45/00 ,  B29C48/00 ,  B29K67/00 ,  B29K77/00 ,  B29K81/00

Abstract: A resin composition comprises (A) 100 parts by mass of a resin selected from the group consisting of polyamides, polylactic acids, and polyphenylene sulfides each having a melting point of 170° C. to 370° C., (B) 0.05 to 5.0 parts by mass of a triazine compound represented by the disclosed general formula (1), preferred examples of which are compounds of the formula: wherein RA, RB, RC, and RD, which may be the same or different, each represent a hydrogen atom or a C1-C4 alkyl group, (C) 0 to 3.0 parts by mass of at least one compound selected from the group consisting of 2,2′-methylenebis[6-(2H-benzotriazol-2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol], 2-[3-hydroxy-4-(4,6-diphenyl-1,3,5-triazin-2-yl)phenoxy]ethyl 2-ethylhexanoate, and 2,4,6-tris(2-hydroxy-4-hexyloxy-3-methylphenyl)-1,3,5-triazine, and (D) 0 to 1.0 part by mass of a light stabilizer being particulate at room temperature (25° C.). The resin composition is useful for making molded articles having improved heat resistance and weatherability.