公开(公告)号：US20220189921A1

公开(公告)日：2022-06-16

申请号：US17121039

申请日：2020-12-14

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： John WUU ,  David JOHNSON

IPC: H01L25/065 ,  H01L25/18 ,  H01L23/00 ,  H02M3/04 ,  H03K19/20

Abstract: A stacked die system includes at least three dies. A first die has a same design as a second die. The first die includes a first circuit, and the second die includes a corresponding second circuit. A signal is received at the first die and sent to the third die via the second die. The signal is routed through either the first circuit or the second circuit but not both. Accordingly, an operation is performed on the signal prior to the signal reaching the third die but the operation is not performed by both the first circuit and the second circuit.