公开(公告)号：US20230297533A1

公开(公告)日：2023-09-21

申请号：US18322183

申请日：2023-05-23

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： JASON R. TALBERT

IPC: G06F13/40 ,  G06F13/20

CPC classification number: G06F13/4027 ,  G06F13/20 ,  G06F9/4405

Abstract: Signal bridging using an unpopulated processor interconnect, including: communicatively coupling an apparatus to a plurality of first signal paths between a bootstrap processor (BSP) and a processor interconnect of a circuit board; communicatively coupling the apparatus to a plurality of second signal paths between the processor interconnect and a peripheral interface of the circuit board; and communicatively coupling the BSP to the peripheral interface via one or more third signal paths in the apparatus.

公开(公告)号：US20220179817A1

公开(公告)日：2022-06-09

申请号：US17115384

申请日：2020-12-08

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： JASON R. TALBERT

IPC: G06F13/40 ,  G06F13/20

Abstract: Signal bridging using an unpopulated processor interconnect, including: communicatively coupling an apparatus to a plurality of first signal paths between a bootstrap processor (BSP) and a processor interconnect of a circuit board; communicatively coupling the apparatus to a plurality of second signal paths between the processor interconnect and a peripheral interface of the circuit board; and communicatively coupling the BSP to the peripheral interface via one or more third signal paths in the apparatus.