公开(公告)号：US20210405722A1

公开(公告)日：2021-12-30

申请号：US17029852

申请日：2020-09-23

Applicant: ADVANCED MICRO DEVICES, INC. ,  ATI TECHNOLOGIES ULC

Inventor： Greg SADOWSKI ,  Sriram SUNDARAM ,  Stephen KUSHNIR ,  William C. BRANTLEY ,  Michael J. SCHULTE

IPC: G06F1/28 ,  G05F1/625

Abstract: A multi-die semiconductor package includes a first integrated circuit (IC) die having a first intrinsic performance level and a second IC die having a second intrinsic performance level different from the first intrinsic performance level. A power management controller distributes, based on a determined die performance differential between the first IC die and the second IC die, a level of power allocated to the semiconductor chip package between the first IC die and the second IC die. In this manner, the first IC die receives and operates at a first level of power resulting in performance exceeding its intrinsic performance level. The second IC die receives and operates at a second level of power resulting in performance below its intrinsic performance level, thereby reducing performance differentials between the IC dies.