公开(公告)号：US10882737B2

公开(公告)日：2021-01-05

申请号：US16088021

申请日：2017-03-23

Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH

Inventor： Navab Singh ,  Daw Don Cheam

IPC: H01L21/48 ,  B81B7/00 ,  B81C1/00 ,  H01L23/48 ,  H01L23/14 ,  H01L23/13 ,  H01L23/498

Abstract: A through silicon interposer wafer and method of manufacturing the same. A through silicon interposer wafer having at least one cavity formed therein for MEMS applications and a method of manufacturing the same are provided. The through silicon interposer wafer includes one or more filled silicon vias formed sufficiently proximate to the at least one cavity to provide support for walls of the at least one cavity during subsequent processing of the interposer wafer.