公开(公告)号：US20210283727A1

公开(公告)日：2021-09-16

申请号：US17286704

申请日：2019-10-23

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Rahul RAUT ,  Nirmalyakumar CHAKI ,  Bawa SINGH ,  Ranjit PANDHER ,  Siuli SARKAR

IPC: B23K35/26 ,  B23K35/02 ,  B23K35/362

Abstract: A solder alloy comprising: from 40 to 65 wt. % bismuth; from I to IO wt. % indium; at least one of: from 0.1 to 5 wt. % gallium, from 0.1 to 5 wt. % zinc, from 0.1 to 2 wt. % copper, from 0.01 to 0.1 wt. % cobalt, from 0.1 to 2 wt. % silver, from 0.005 to 0.05 wt. % titanium, and from 0.01 to 1 wt. % nickel; optionally up to 1 wt. % of one or more of: vanadium, rare earth metals, neodymium, chromium, iron, aluminium, phosphorus, gold, tellurium, selenium, calcium, vanadium, molybdenum, platinum, magnesium, silicon, and manganese; and the balance tin together with any unavoidable impurities.