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    SOLDER PASTE FOR MODULE FABRICATION OF SOLAR CELLS
    4.
    发明申请
    SOLDER PASTE FOR MODULE FABRICATION OF SOLAR CELLS 有权

    公开(公告)号：US20220216357A1

    公开(公告)日：2022-07-07

    申请号：US17595690

    申请日：2020-05-22

    Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

    Inventor： Narahari PUJARI ,  Siuli SARKAR ,  Carl BILGRIEN

    IPC: H01L31/05

    Abstract: A method of fabricating a solar module by interconnection of a plurality of photovoltaic (PV) cells in which at least a first PV cell is interconnected to a second PV cell using an electrically-conductive adherent comprising or consisting of a solder paste. The solder paste comprises particles of solder alloy dispersed in a solder flux. The solder alloy comprises a Sn-containing solder alloy having a liquidus temperature of less than 225° C.

    HIGH TEMPERATURE ULTRA-HIGH RELIABILITY ALLOYS
    8.
    发明申请
    HIGH TEMPERATURE ULTRA-HIGH RELIABILITY ALLOYS 有权

    公开(公告)号：US20220324063A1

    公开(公告)日：2022-10-13

    申请号：US17753280

    申请日：2020-08-28

    Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

    Inventor： Pritha CHOUDHURY ,  Morgana RIBAS ,  Anil KUMAR ,  Raghu R. RANGARAJU ,  Siuli SARKAR

    IPC: B23K35/26 ,  C22C13/00 ,  B23K35/02

    Abstract: A lead-free solder alloy comprising: from 2.5 to 5 wt. % silver; from 0.01 to 5 wt. % bismuth; from 1 to 7 wt. % antimony; from 0.01 to 2 wt. % copper; one or more of: up to 6 wt. % indium, up to 0.5 wt. % titanium, up to 0.5 wt. % germanium, up to 0.5 wt. % rare earths, up to 0.5 wt. % cobalt, up to 5.0 wt. % aluminium, up to 5.0 wt. % silicon, up to 0.5 wt. % manganese, up to 0.5 wt. % chromium, up to 0.5 wt. % iron, up to 0.5 wt. % phosphorus, up to 0.5 wt. % gold, up to 1 wt. % gallium, up to 0.5 wt. % tellurium, up to 0.5 wt. % selenium, up to 0.5 wt. % calcium, up to 0.5 wt. % vanadium, up to 0.5 wt. % molybdenum, up to 0.5 wt. % platinum, and up 0 to 0.5 wt. % magnesium; optionally up to 0.5 wt. % nickel; and the balance tin together with any unavoidable impurities.

    LEAD-FREE SOLDER COMPOSITIONS
    9.
    发明申请
    LEAD-FREE SOLDER COMPOSITIONS 有权

    公开(公告)号：US20220072664A1

    公开(公告)日：2022-03-10

    申请号：US17309818

    申请日：2019-12-26

    Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

    Inventor： Ranjit PANDHER ,  Niveditha NAGARAJAN ,  Anil KUMAR ,  Morgana de Avila RIBAS ,  Gyan DUTT ,  Siuli SARKAR ,  Carl BILGRIEN

    IPC: B23K35/26 ,  C22C13/00

    Abstract: A lead-free solder alloy comprising: from 1 to 9 wt. % copper, at least one of: from greater than 0 to 1 wt. % nickel, from greater than 0 to 10 wt. % germanium, from greater than 0 to 10 wt. % manganese, from greater than 0 to 10 wt. % aluminium, from greater than 0 to 10 wt. % silicon, from greater than 0 to 9 wt. % bismuth, from greater than 0 to 5 wt. % indium, from greater than 0 to 1 wt. % titanium, from greater than 0 to 2 wt. % lanthanum, from greater than 0 to 2 wt. % neodymium, optionally one or more of: up to 1 wt. % for chromium, gallium, cobalt, iron, phosphorous, gold, tellurium, selenium, calcium, vanadium, molybdenum, platinum, magnesium; up to 5 wt. % silver, up to 1 wt. % zinc, up to 2 wt. % rare earth metals, excluding lanthanum and neodymium, and the balance tin together with any unavoidable impurities.

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