公开(公告)号：US20220324063A1

公开(公告)日：2022-10-13

申请号：US17753280

申请日：2020-08-28

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Pritha CHOUDHURY ,  Morgana RIBAS ,  Anil KUMAR ,  Raghu R. RANGARAJU ,  Siuli SARKAR

IPC: B23K35/26 ,  C22C13/00 ,  B23K35/02

Abstract: A lead-free solder alloy comprising: from 2.5 to 5 wt. % silver; from 0.01 to 5 wt. % bismuth; from 1 to 7 wt. % antimony; from 0.01 to 2 wt. % copper; one or more of: up to 6 wt. % indium, up to 0.5 wt. % titanium, up to 0.5 wt. % germanium, up to 0.5 wt. % rare earths, up to 0.5 wt. % cobalt, up to 5.0 wt. % aluminium, up to 5.0 wt. % silicon, up to 0.5 wt. % manganese, up to 0.5 wt. % chromium, up to 0.5 wt. % iron, up to 0.5 wt. % phosphorus, up to 0.5 wt. % gold, up to 1 wt. % gallium, up to 0.5 wt. % tellurium, up to 0.5 wt. % selenium, up to 0.5 wt. % calcium, up to 0.5 wt. % vanadium, up to 0.5 wt. % molybdenum, up to 0.5 wt. % platinum, and up 0 to 0.5 wt. % magnesium; optionally up to 0.5 wt. % nickel; and the balance tin together with any unavoidable impurities.