公开(公告)号：US09786609B2

公开(公告)日：2017-10-10

申请号：US14072572

申请日：2013-11-05

Applicant: ANALOG DEVICES GLOBAL

Inventor： Oliver J Kierse ,  Frank Poucher ,  Michael J Cusack ,  Padraig L Fitzgerald ,  Patrick Elebert

IPC: H01L23/28 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/16 ,  H01L23/29

CPC classification number: H01L23/562 ,  H01L21/56 ,  H01L23/16 ,  H01L23/295 ,  H01L23/31 ,  H01L23/3107 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A stress shield for a plastic integrated circuit package is disclosed. A shield plate is attached by an adhesive to a top surface of an integrated circuit die such that the shield plate covers less than all of the top surface and leaves bond pads exposed. A molding material is applied over the shield plate and the integrated circuit die. The shield plate shields the integrated circuit die from stresses imparted by the molding material.