Sensor assembly for head-mountable device

    公开(公告)号:US11740691B1

    公开(公告)日:2023-08-29

    申请号:US17228588

    申请日:2021-04-12

    Applicant: Apple Inc.

    CPC classification number: G06F3/012 G01C19/5783 G06F1/163

    Abstract: A head-mountable device can securely support sensors in a manner that maintains their positions and orientations over time and avoids applying excessive strain on the sensors, thereby protecting them from harm. The sensor can be mounted on a flex circuit or circuit board, which is rigidly secured within an inner case, including for example a base and an inner shield. The inner case can be suspended within an outer case, including for example a frame and an outer shield. Shock absorbers on opposing sides of the inner case can flexibly couple the inner case to the outer case. The shock absorbers can dampen the effects of vibrations or other forces applied from the outer case. The inner case can decouple the sensor from strain applied from the shock absorbers.

    Connector Assembly
    3.
    发明公开
    Connector Assembly 审中-公开

    公开(公告)号:US20240162651A1

    公开(公告)日:2024-05-16

    申请号:US18377967

    申请日:2023-10-09

    Applicant: APPLE INC.

    CPC classification number: H01R13/6275 H01R13/15

    Abstract: A receptacle connector includes a receptacle housing, pin contacts, and a retainer. The receptacle housing has a convex wall portion, a concave wall portion, a first side wall portion that extends between the convex wall portion and the concave wall portion, and a second side wall portion that extends between the convex wall portion and the concave wall portion. The convex wall portion, the concave wall portion, the first side wall portion, and the second side wall portion at least partially define a cavity having an open end. The pin contacts are located in the cavity of the receptacle housing. The retainer has a first side latch and a second side latch that are configured to extend into the cavity in an engaged position and to move outward from the cavity to a disengaged position.

    Modular Systems Configured to Provide Localized Haptic Feedback Using Inertial Actuators

    公开(公告)号:US20220291746A1

    公开(公告)日:2022-09-15

    申请号:US17200640

    申请日:2021-03-12

    Applicant: Apple Inc.

    Abstract: An electronic device includes a housing defining an aperture. An input device extends through the aperture and has a user input surface external to the housing. An inertial actuator is mechanically and fixedly coupled to the input device and positioned within the housing. A mechanical wave dampener provides mechanical wave dampening between the input device and the housing. The electronic device enables haptic feedback to be provided locally to the input device. In some cases, the mechanical wave dampener may dampen shaking of the input device with respect to the housing by at least an order of magnitude.

    CROWN INPUT AND FEEDBACK FOR HEAD-MOUNTABLE DEVICES

    公开(公告)号:US20210089136A1

    公开(公告)日:2021-03-25

    申请号:US17002704

    申请日:2020-08-25

    Applicant: Apple Inc.

    Abstract: A head-mountable device can provide a crown module having an input system that allows a user to provide inputs by rotating or otherwise applying torque to a crown of the crown module. The head-mountable device can interpret the rotation and/or torque as a user input. The crown module can further include a feedback system that provides localized haptic feedback at the crown. The haptic feedback can be effectively perceived by the user at the crown without causing the entire head-mountable device to vibrate against the head and/or face of the user.

    Head-Mounted Electronic Device With Alignment Sensors

    公开(公告)号:US20240077695A1

    公开(公告)日:2024-03-07

    申请号:US18505895

    申请日:2023-11-09

    Applicant: Apple Inc.

    Abstract: A head-mounted device may have a head-mounted housing. Optical components may be supported by the head-mounted housing. The optical components may include cameras such as front-facing cameras and/or movable optical modules that have displays for displaying images to eye boxes. Sensors may be provided in the head-mounted device to detect changes in orientation between respective optical modules, between respective portions of a chassis, display cover layer, or other head-mounted support structure in the housing, between optical components such as cameras, and/or between optical components and housing structures. Information from these sensors can be used to measure image misalignment such as image misalignment associated with misaligned cameras or misalignment between optical module images and corresponding eye boxes.

    Electronic devices with stacked circuitry

    公开(公告)号:US11871517B1

    公开(公告)日:2024-01-09

    申请号:US17200608

    申请日:2021-03-12

    Applicant: Apple Inc.

    CPC classification number: H05K1/147 H05K1/189 H05K2201/10128

    Abstract: An electronic device may have a display with an array of pixels for displaying images. The electronic device may also have a lens through which the images are viewable on the display. The display may have a display panel that is mounted to a printed circuit stack. The printed circuit stack may include multiple printed circuit layers to which components are mounted. The components may include an orientation sensor overlapped by the display panel. A camera may be mounted to a printed circuit stack and may overlap one or more electrical components such as an orientation sensor. The printed circuit stacks may include rigid and flexible printed circuits coupled together using solder and other conductive connections. Air gaps may be created between stacked printed circuit layers.

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